Abstract: Sensor including a substrate, an assembly of thermoelectric layers including at least one first and one second junction of a thermocouple, at least one first and one second connection pads arranged to transfer heat respectively to each first and each second junction, a support member (2) of the substrate (3) intended to be connected to the hot source (Sc) and to the cold source (Sf), first and second metal connectors arranged to electrically connect the support member (2) respectively to each first and each second connection pad, the support member (2) including a thermal conductor configured to transfer heat from the hot source (Sc) to the first metal connector, and to transfer heat from the second metal connector to the cold source (Sf).

Abstract: The invention relates to a method for manufacturing a photovoltaic module comprising a plurality of solar cells in a thin-layer structure, in which the following are consecutively formed: an electrode on the rear surface (41), a photovoltaic layer (46) obtained by depositing a layer (42) of precursors and by annealing such as to convert the precursors into a semiconductor material, and another semiconductor layer (43) in order to create a pn junction with the photovoltaic layer (46); characterized in that the layer (42) is deposited in a localized manner, such as to leave free at least one area (410) of the electrode on the rear surface (41) placed between two adjacent cells, wherein the annealing step modifies said area (410) which has higher resistivity than the rest of the electrode on the rear surface (41), such as to provide electric insulation between two adjacent cells.

Abstract: This sensor (1) includes an assembly of thermoelectric layers, a support member (2) including at least one first and one second metallic connector pins (30, 31), first and second metal connectors arranged to electrically connect the support member (2) respectively to a first connection pad and a second connection pad, an external package (8) including a first surface (8a) and a second opposite surface (8b) intended to be respectively connected to a hot source and to a cold source, a first via (80) connecting the first surface (8a) to each first connector pin (30), a second via (81) connecting the second surface (8b) to each second connector pin (31), and the support member (2) includes thermal conductors between the connector pins (30, 31) and the metal connectors.

Abstract: Sensor including a substrate, an assembly of thermoelectric layers including at least one first and one second junction of a thermocouple, at least one first and one second connection pads arranged to transfer heat respectively to each first and each second junction, a support member (2) of the substrate (3) intended to be connected to the hot source (Sc) and to the cold source (Sf), first and second metal connectors arranged to electrically connect the support member (2) respectively to each first and each second connection pad, the support member (2) including a thermal conductor configured to transfer heat from the hot source (Sc) to the first metal connector, and to transfer heat from the second metal connector to the cold source (Sf).

Abstract: This sensor (1) includes an assembly of thermoelectric layers, a support member (2) including at least one first and one second metallic connector pins (30, 31), first and second metal connectors arranged to electrically connect the support member (2) respectively to a first connection pad and a second connection pad, an external package (8) including a first surface (8a) and a second opposite surface (8b) intended to be respectively connected to a hot source and to a cold source, a first via (80) connecting the first surface (8a) to each first connector pin (30), a second via (81) connecting the second surface (8b) to each second connector pin (31), and the support member (2) includes thermal conductors between the connector pins (30, 31) and the metal connectors.

Abstract: The thermoelectric device includes a first duct housed in a second duct in tightly sealed manner. The first and second ducts extend along a longitudinal axis. The device further includes a thermocouple extending along a transverse axis. The thermocouple is interposed between the first and second ducts which are shaped in such a way that the thermocouple undergoes a compressive stress, in the transverse direction.

Abstract: A method for manufacturing two series-connected photovoltaic cells includes: forming an insulating substrate; forming a stack including; a first conductive layer formed on the substrate; a semiconductor layer comprising a first absorption layer and a second semiconductor layer forming a junction with the first absorption layer; and a second transparent conductive layer, formed on the absorption layer; forming an area dividing the stack into two cells series-connected by an electric path. The forming of said path comprises: forming a first trench all the way to the substrate; forming a second trench all the way to the first conductive layer; and depositing a conductive solution on the first trench and at last a portion of the second trench, so that the solution does not penetrate into the first trench all the way to the first conductive layer and penetrates into the second trench all the way to the first conductive layer.

Abstract: The present invention relates to a process for selective wet chemical etching of a thin-film substrate comprising a CIGS surface layer. The present invention also relates to a process for producing cells in series for thin-film photovoltaic modules, which process implements the selective wet chemical etching process according to the invention. The present invention furthermore relates to a process for creating small patterns, such as for example monolithic interconnects, in thin-film photovoltaic devices, which process implements the selective wet chemical etching process according to the invention.

Abstract: The invention relates to a method for manufacturing a photovoltaic module comprising a plurality of solar cells in a thin-layer structure, in which the following are consecutively formed: an electrode on the rear surface (41), a photovoltaic layer (46) obtained by depositing a layer (42) of precursors and by annealing such as to convert the precursors into a semiconductor material, and another semiconductor layer (43) in order to create a pn junction with the photovoltaic layer (46); characterised in that the layer (42) is deposited in a localised manner, such as to leave free at least one area (410) of the electrode on the rear surface (41) placed between two adjacent cells, wherein the annealing step modifies said area (410) which has higher resistivity than the rest of the electrode on the rear surface (41), such as to provide electric insulation between two adjacent cells.

Abstract: The present invention relates to a process for selective wet chemical etching of a thin-film substrate comprising a CIGS surface layer. The present invention also relates to a process for producing cells in series for thin-film photovoltaic modules, which process implements the selective wet chemical etching process according to the invention. The present invention furthermore relates to a process for creating small patterns, such as for example monolithic interconnects, in thin-film photovoltaic devices, which process implements the selective wet chemical etching process according to the invention.

Abstract: The invention relates to a liquid metal emulsion. The emulsion according to the invention includes a liquid metal selected from among gallium, indium, and the alloys thereof, and a solvent that is an alkanethiol. The invention is useful in particular in the field of manufacturing thin films.

Abstract: A method for manufacturing two series-connected photovoltaic cells includes: forming an insulating substrate; forming a stack including; a first conductive layer formed on the substrate; a semiconductor layer comprising a first absorption layer and a second semiconductor layer forming a junction with the first absorption layer; and a second transparent conductive layer, formed on the absorption layer; forming an area dividing the stack into two cells series-connected by an electric path. The forming of said path comprises: forming a first trench all the way to the substrate; forming a second trench all the way to the first conductive layer; and depositing a conductive solution on the first trench and at last a portion of the second trench, so that the solution does not penetrate into the first trench all the way to the first conductive layer and penetrates into the second trench all the way to the first conductive layer.

Abstract: A device and method include forming a mask on a substrate supporting a plurality of metallic nanocrystals such that a portion of the metallic nanocrystals is exposed. Protective shells are formed about the exposed metallic nanocrystals. Unprotected metallic nanocrystals are removed.

Abstract: A method of forming a device includes forming protective shells about metallic nanocrystals supported by a substrate. The metallic nanocrystals having protective shells are encapsulated with a layer formed with process parameters that are not compatible with the integrity of unprotected metallic nanocrystals.