Abstract: The invention is a decorating medium, system and method for producing relief art on substrate surfaces. The decorating medium is an acrylic emulsion based medium containing an expandable polymer which expands the medium upon heating. The acrylic emulsion is produced with a mixture of an acrylic binder and an acrylic thickener or a cellulosic thickener combined in the appropriate range to obtain a medium rheology suitable for controlled application of the medium to the substrate surfaces. The decorating medium is applied to a substrate surface in a desired pattern either directly from a storage bottle or tube equipped with a nozzle or with an applicator such as a brush, a sponge, a knife or spatula. The desired pattern is achieved by free hand or by using a stencil or mask. After the decorating medium is applied to the surface of the substrate in the desired pattern, the medium is cured and heated. The heat causes the medium to expand and creates the relief art on the surface of the substrate.

Abstract: The invention is a decorating medium, system and method for producing relief art on substrate surfaces. The decorating medium is an acrylic emulsion based medium containing an expandable polymer which expands the medium upon heating. The acrylic emulsion is produced with a mixture of an acrylic binder and an acrylic thickener or a cellulosic thickener combined in the appropriate range to obtain a medium rheology suitable for controlled application of the medium to the substrate surfaces. The decorating medium is applied to a substrate surface in a desired pattern either directly from a storage bottle or tube equipped with a nozzle or with an applicator such as a brush, a sponge, a knife or spatula. The desired pattern is achieved by free hand or by using a stencil or mask. After the decorating medium is applied to the surface of the substrate in the desired pattern, the medium is cured and heated. The heat causes the medium to expand and creates the relief art on the surface of the substrate.

Abstract: A paste vehicle for use in a metal bearing solder paste composition having a heat-polymerizable binder is provided. This vehicle can be non-aqueous, inorganic salt-free and dispersed in a non-aqueous, organic liquid, and may be incorporated with a flux into a solder paste composition capable of utilizing an average particle size finer than 100 mesh. This paste has excellent anti-slump properties, requires no cleanup to remove residual solder reflow, and permits smaller more controlled joints to be formed.