Patents by Inventor Joel Philliber
Joel Philliber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9327316Abstract: An apparatus comprises a substrate and transducers disposed over the substrate, each of the transducers comprising a different resonance frequency. A transducer device comprises circuitry configured to transmit signals, or to receive signals, or both. The transducer device also comprises a transducer block comprising a plurality of piezoelectric ultrasonic transducers (PMUT), wherein each of the PMUTs; and an interconnect configured to provide signals from the transducer block to the circuitry and to provide signals from the circuitry to the transducer block.Type: GrantFiled: June 30, 2009Date of Patent: May 3, 2016Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Atul Goel, Osvaldo Buccafusca, Steven Martin, Joel Philliber, R. Shane Fazzio
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Patent number: 9088850Abstract: An acoustic device includes a transducer formed on a first surface of a substrate and an acoustic horn formed in the substrate by a dry-etching process through an opposing second surface of the substrate. The acoustic horn is positioned to amplify sound waves from the transducer and defines a non-linear cross-sectional profile.Type: GrantFiled: June 28, 2012Date of Patent: July 21, 2015Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: David Martin, Joel Philliber, John Choy
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Patent number: 8981624Abstract: A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.Type: GrantFiled: December 27, 2010Date of Patent: March 17, 2015Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: David Martin, Donald Lee, John Choy, Joel Philliber, Osvaldo Buccafusca
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Patent number: 8946877Abstract: A semiconductor package comprises: a substrate comprising a semiconductor device; a cap comprising a seal ring disposed over a surface of the cap; and a gap between the substrate and the surface of the cap. The seal ring comprises a tread comprising at least two columns.Type: GrantFiled: September 29, 2010Date of Patent: February 3, 2015Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Rick Snyder, Joel Philliber
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Patent number: 8329053Abstract: In accordance with an illustrative embodiment, a method of fabricating a transducer is described. The method comprises providing a transducer over a first surface of a substrate, wherein the substrate comprises a thickness. The method further comprises patterning a mask over a second surface. The mask comprises an opening for forming a scribe etch. The method comprises etching through the opening in the mask and into but not through the thickness of the substrate to provide the scribe etch.Type: GrantFiled: November 23, 2009Date of Patent: December 11, 2012Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: David Martin, Joel Philliber
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Patent number: 8280080Abstract: A device includes a first wafer, a second wafer, a gasket bonding the first wafer to the second wafer to define a cavity between the first wafer and the second wafer, and an acoustic transducer disposed on the first wafer and disposed within the cavity between the first wafer and the second wafer. One or more apertures are provided for communicating an acoustic signal between the acoustic transducer and an exterior of the device. An aperture may be formed in the cavity itself, or the cavity may be hermetically sealed. An aperture may be formed completely through the first wafer and located directly beneath at least a portion of the acoustic transducer.Type: GrantFiled: April 28, 2009Date of Patent: October 2, 2012Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: Joel Philliber, John Choy, David Martin
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Patent number: 8231795Abstract: An acoustic device includes a transducer formed on a first surface of a substrate and an acoustic horn formed in the substrate by a dry-etching process through an opposing second surface of the substrate. The acoustic horn is positioned to amplify sound waves from the transducer and defines a non-linear cross-sectional profile.Type: GrantFiled: May 1, 2009Date of Patent: July 31, 2012Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: David Martin, Joel Philliber, John Choy
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Publication number: 20120074555Abstract: A semiconductor package comprises: a substrate comprising a semiconductor device; a cap comprising a seal ring disposed over a surface of the cap; and a gap between the substrate and the surface of the cap. The seal ring comprises a tread comprising at least two columns.Type: ApplicationFiled: September 29, 2010Publication date: March 29, 2012Applicant: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: Rick Snyder, Joel Philliber
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Publication number: 20110120971Abstract: In accordance with an illustrative embodiment, a method of fabricating a transducer is described. The method comprises providing a transducer over a first surface of a substrate, wherein the substrate comprises a thickness. The method further comprises patterning a mask over a second surface. The mask comprises an opening for forming a scribe etch. The method comprises etching through the opening in the mask and into but not through the thickness of the substrate to provide the scribe etch.Type: ApplicationFiled: November 23, 2009Publication date: May 26, 2011Applicant: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: David Martin, Joel Philliber
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Patent number: 7888844Abstract: A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.Type: GrantFiled: September 30, 2009Date of Patent: February 15, 2011Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: David Martin, Donald Lee, John Choy, Joel Philliber, Osvaldo Buccafusca
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Publication number: 20100327695Abstract: An apparatus comprises a substrate and transducers disposed over the substrate, each of the transducers comprising a different resonance frequency. A transducer device comprises circuitry configured to transmit signals, or to receive signals, or both. The transducer device also comprises a transducer block comprising a plurality of piezoelectric ultrasonic transducers (PMUT), wherein each of the PMUTs; and an interconnect configured to provide signals from the transducer block to the circuitry and to provide signals from the circuitry to the transducer block.Type: ApplicationFiled: June 30, 2009Publication date: December 30, 2010Applicant: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: Atul Goel, Osvaldo Buccafusca, Steven Martin, Joel Philliber
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Publication number: 20100327702Abstract: A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.Type: ApplicationFiled: September 30, 2009Publication date: December 30, 2010Applicant: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: David Martin, Donald Lee, John Choy, Joel Philliber, Osvaldo Buccafusca
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Publication number: 20080000060Abstract: A method of determining adhesion quality and apparatus embodying the method are disclosed. The apparatus includes a substrate, a seed layer, and a resonator. The substrate defines a cavity and has a doped portion proximal to the cavity. The seed layer is disposed above the cavity. The resonator includes a bottom electrode on the seed layer, a piezoelectric portion on the bottom electrode, and a top electrode on the piezoelectric portion. To test the quality of adhesion of the seed layer to the substrate, one or more electrical property is measured between the doped portion and the bottom electrode and compared to a threshold value.Type: ApplicationFiled: September 13, 2007Publication date: January 3, 2008Inventor: Joel Philliber
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Publication number: 20060170309Abstract: A method of determining adhesion quality and apparatus embodying the method are disclosed. The apparatus includes a substrate, a seed layer, and a resonator. The substrate defines a cavity and has a doped portion proximal to the cavity. The seed layer is disposed above the cavity. The resonator includes a bottom electrode on the seed layer, a piezoelectric portion on the bottom electrode, and a top electrode on the piezoelectric portion. To test the quality of adhesion of the seed layer to the substrate, one or more electrical property is measured between the doped portion and the bottom electrode and compared to a threshold value.Type: ApplicationFiled: January 31, 2005Publication date: August 3, 2006Inventor: Joel Philliber
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Publication number: 20050242419Abstract: A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method is disclosed. To fabricate the apparatus, a device chip including a substrate and at least one circuit element on the substrate is fabricated. Also, a cap is fabricated. The cap is attached to the device chip using single phase metal alloy to achieve sealed cavity over the circuit element. The single phase metal alloy allows the cap to be diffusion bonded to the device chip at a higher diffusivity thus allowing diffusion at a lower temperature, lower pressure, shorter period, or a combination of these.Type: ApplicationFiled: April 30, 2004Publication date: November 3, 2005Inventor: Joel Philliber