Patents by Inventor Joel Philliber

Joel Philliber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9327316
    Abstract: An apparatus comprises a substrate and transducers disposed over the substrate, each of the transducers comprising a different resonance frequency. A transducer device comprises circuitry configured to transmit signals, or to receive signals, or both. The transducer device also comprises a transducer block comprising a plurality of piezoelectric ultrasonic transducers (PMUT), wherein each of the PMUTs; and an interconnect configured to provide signals from the transducer block to the circuitry and to provide signals from the circuitry to the transducer block.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: May 3, 2016
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Atul Goel, Osvaldo Buccafusca, Steven Martin, Joel Philliber, R. Shane Fazzio
  • Patent number: 9088850
    Abstract: An acoustic device includes a transducer formed on a first surface of a substrate and an acoustic horn formed in the substrate by a dry-etching process through an opposing second surface of the substrate. The acoustic horn is positioned to amplify sound waves from the transducer and defines a non-linear cross-sectional profile.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: July 21, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: David Martin, Joel Philliber, John Choy
  • Patent number: 8981624
    Abstract: A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: March 17, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: David Martin, Donald Lee, John Choy, Joel Philliber, Osvaldo Buccafusca
  • Patent number: 8946877
    Abstract: A semiconductor package comprises: a substrate comprising a semiconductor device; a cap comprising a seal ring disposed over a surface of the cap; and a gap between the substrate and the surface of the cap. The seal ring comprises a tread comprising at least two columns.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: February 3, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Rick Snyder, Joel Philliber
  • Patent number: 8329053
    Abstract: In accordance with an illustrative embodiment, a method of fabricating a transducer is described. The method comprises providing a transducer over a first surface of a substrate, wherein the substrate comprises a thickness. The method further comprises patterning a mask over a second surface. The mask comprises an opening for forming a scribe etch. The method comprises etching through the opening in the mask and into but not through the thickness of the substrate to provide the scribe etch.
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: December 11, 2012
    Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: David Martin, Joel Philliber
  • Patent number: 8280080
    Abstract: A device includes a first wafer, a second wafer, a gasket bonding the first wafer to the second wafer to define a cavity between the first wafer and the second wafer, and an acoustic transducer disposed on the first wafer and disposed within the cavity between the first wafer and the second wafer. One or more apertures are provided for communicating an acoustic signal between the acoustic transducer and an exterior of the device. An aperture may be formed in the cavity itself, or the cavity may be hermetically sealed. An aperture may be formed completely through the first wafer and located directly beneath at least a portion of the acoustic transducer.
    Type: Grant
    Filed: April 28, 2009
    Date of Patent: October 2, 2012
    Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: Joel Philliber, John Choy, David Martin
  • Patent number: 8231795
    Abstract: An acoustic device includes a transducer formed on a first surface of a substrate and an acoustic horn formed in the substrate by a dry-etching process through an opposing second surface of the substrate. The acoustic horn is positioned to amplify sound waves from the transducer and defines a non-linear cross-sectional profile.
    Type: Grant
    Filed: May 1, 2009
    Date of Patent: July 31, 2012
    Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: David Martin, Joel Philliber, John Choy
  • Publication number: 20120074555
    Abstract: A semiconductor package comprises: a substrate comprising a semiconductor device; a cap comprising a seal ring disposed over a surface of the cap; and a gap between the substrate and the surface of the cap. The seal ring comprises a tread comprising at least two columns.
    Type: Application
    Filed: September 29, 2010
    Publication date: March 29, 2012
    Applicant: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: Rick Snyder, Joel Philliber
  • Publication number: 20110120971
    Abstract: In accordance with an illustrative embodiment, a method of fabricating a transducer is described. The method comprises providing a transducer over a first surface of a substrate, wherein the substrate comprises a thickness. The method further comprises patterning a mask over a second surface. The mask comprises an opening for forming a scribe etch. The method comprises etching through the opening in the mask and into but not through the thickness of the substrate to provide the scribe etch.
    Type: Application
    Filed: November 23, 2009
    Publication date: May 26, 2011
    Applicant: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: David Martin, Joel Philliber
  • Patent number: 7888844
    Abstract: A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: February 15, 2011
    Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: David Martin, Donald Lee, John Choy, Joel Philliber, Osvaldo Buccafusca
  • Publication number: 20100327695
    Abstract: An apparatus comprises a substrate and transducers disposed over the substrate, each of the transducers comprising a different resonance frequency. A transducer device comprises circuitry configured to transmit signals, or to receive signals, or both. The transducer device also comprises a transducer block comprising a plurality of piezoelectric ultrasonic transducers (PMUT), wherein each of the PMUTs; and an interconnect configured to provide signals from the transducer block to the circuitry and to provide signals from the circuitry to the transducer block.
    Type: Application
    Filed: June 30, 2009
    Publication date: December 30, 2010
    Applicant: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: Atul Goel, Osvaldo Buccafusca, Steven Martin, Joel Philliber
  • Publication number: 20100327702
    Abstract: A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.
    Type: Application
    Filed: September 30, 2009
    Publication date: December 30, 2010
    Applicant: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: David Martin, Donald Lee, John Choy, Joel Philliber, Osvaldo Buccafusca
  • Publication number: 20080000060
    Abstract: A method of determining adhesion quality and apparatus embodying the method are disclosed. The apparatus includes a substrate, a seed layer, and a resonator. The substrate defines a cavity and has a doped portion proximal to the cavity. The seed layer is disposed above the cavity. The resonator includes a bottom electrode on the seed layer, a piezoelectric portion on the bottom electrode, and a top electrode on the piezoelectric portion. To test the quality of adhesion of the seed layer to the substrate, one or more electrical property is measured between the doped portion and the bottom electrode and compared to a threshold value.
    Type: Application
    Filed: September 13, 2007
    Publication date: January 3, 2008
    Inventor: Joel Philliber
  • Publication number: 20060170309
    Abstract: A method of determining adhesion quality and apparatus embodying the method are disclosed. The apparatus includes a substrate, a seed layer, and a resonator. The substrate defines a cavity and has a doped portion proximal to the cavity. The seed layer is disposed above the cavity. The resonator includes a bottom electrode on the seed layer, a piezoelectric portion on the bottom electrode, and a top electrode on the piezoelectric portion. To test the quality of adhesion of the seed layer to the substrate, one or more electrical property is measured between the doped portion and the bottom electrode and compared to a threshold value.
    Type: Application
    Filed: January 31, 2005
    Publication date: August 3, 2006
    Inventor: Joel Philliber
  • Publication number: 20050242419
    Abstract: A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method is disclosed. To fabricate the apparatus, a device chip including a substrate and at least one circuit element on the substrate is fabricated. Also, a cap is fabricated. The cap is attached to the device chip using single phase metal alloy to achieve sealed cavity over the circuit element. The single phase metal alloy allows the cap to be diffusion bonded to the device chip at a higher diffusivity thus allowing diffusion at a lower temperature, lower pressure, shorter period, or a combination of these.
    Type: Application
    Filed: April 30, 2004
    Publication date: November 3, 2005
    Inventor: Joel Philliber