Abstract: A method for inspecting semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.

Abstract: A method for fabricating semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.

Abstract: A method and apparatus for inspecting semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.

Abstract: An apparatus and method for automatically tuning the power and the intensity of light supplied to an illuminated object to some desired values, the apparatus including a light source positionable along at least a first axis with respect to a reflector, a drive assembly for positioning the light source in response to an intensity of light measured by a light meter positioned to sample light reflected from the object along a reflected light path, and a diaphragm having an adjustable aperture for controlling the amount of light supplied to the object. The light source is automatically positioned along the first axis to achieve a maximum intensity of light on the object. The light source may then be automatically positioned along a second axis and a third axis to achieve respective maximum light intensities on the object.