Abstract: The apparatus of the present invention may be utilized for the automated bonding of electronic components to a circuit board. A placement and bonding head is attached to a manipulatable robotic arm and is utilized to select an electronic component having a plurality of conductive leads from a supply of such components and position that component adjacent a plurality of contact pads on a circuit board. While retaining the electronic component within the placement and bonding head, the component is then thermally bonded to the contact pads. In one embodiment of the present invention, an electronic component may be optically inspected while being retained within the placement and bonding head. In another embodiment, thermal bonding is accomplished utilizing a plurality of thermally activatable blades which each include a thermocouple mounted adjacent thereto.

Abstract: The method and apparatus of the present invention may be utilized to support a selected mounting point on a circuit board during the mounting an electronic component. An integrated circuit device is selected and positioned adjacent a first side of a circuit board at a desired mounting point utilizing a robotic manipulator and a placement head. A support fixture is then urged into temporary contact with a second side of the circuit board utilizing a flexible mounting system such that minor variations or misalignments between the plane of the support fixture, the circuit board and the placement head are eliminated. In one embodiment of the present invention a flexible fluid filled bag is utilized in conjunction with the support fixture so that the presence of components on the second side of the circuit board may be accommodated while supporting the circuit board during component mounting.