Abstract: A method of folding plastic composition flooring, including but not limited to LVP, LVT, SPC or WPC, to form a desired shape, such as stair noses, baseboards, quarter rounds, T-moldings, endcaps, or the like. The method includes the steps of incorporating a thermal insulation layer between the plastic composite flooring and a heat generator, applying heat until reaching a heat transmission coefficient to allow the plastic composite flooring to become malleable, removing the heat, applying pressure to the heated section of the plastic composite flooring to form into a desired shape using a positive and negative embossing die mold on the top and bottom heated section of the plastic composite flooring, and removing the embossing die-molds once the plastic composite flooring has cooled down to its initial temperature.

Abstract: A method of folding plastic composition flooring, including but not limited to LVP, LVT, SPC or WPC, to form a desired shape, such as stair noses, baseboards, quarter rounds, T-moldings, endcaps, or the like. The method includes the steps of incorporating a thermal insulation layer between the plastic composite flooring and a heat generator, applying heat until reaching a heat transmission coefficient to allow the plastic composite flooring to become malleable, removing the heat, applying pressure to the heated section of the plastic composite flooring to form into a desired shape using a positive and negative embossing die mold on the top and bottom heated section of the plastic composite flooring, and removing the embossing die-molds once the plastic composite flooring has cooled down to its initial temperature.

Abstract: A portable electrical testing device is disclosed. The portable electrical testing device includes an electrical probe and a laser soldering device. The electrical probe is configured to be placed in contact with an electrical circuit element and to receive electrical signals from the circuit element. The laser soldering device is configured to apply laser radiation to the electrical probe while the probe is in contact with the electrical circuit element to heat the electrical probe and to thereby enable soldering of the electrical probe to the electrical circuit element. The electrical probe further includes a replaceable probe lead having a surface coating of an electrically conductive fusible metal alloy that melts, when heated by laser radiation from the laser soldering device, and forms a mechanical bond with the circuit element upon cooling. The electrical probe and laser soldering device are configured to be adjustably positioned relative to a mechanical housing.