Abstract: A method for automating pin assignments through an electronic design automation (EDA) development tool is provided. In the method, components for a chip design are selected and a board in which the chip design is to be implemented is identified. A port of one of the selected components is associated with a pin of the board through a component-based file. Thus, the component-based file maps the port to the pin. By utilizing a component based file, the mapping of the port to the pin is maintained during propagation of the chip design from a component level to a system level, even if the port name should change. A system for generating a chip design is also provided.

Abstract: A programmable logic device includes a functional block, which does not form part of an embedded processor, which can perform a testing function on other functional blocks of the programmable logic device. Thus, the test block can read stored data values from registers in the other functional blocks of the programmable logic device, or can read signal values at points in the other functional blocks of the programmable logic device, or can insert specific data values in registers in the other functional blocks of the programmable logic device.

Abstract: By suitable use of screen-printed carbon ink patterning, combined with patterning of the solder-mask layer on the top (finger) surface, a compact capacitive touchpad pointing device has been realized using only a two-layer board as a substrate. The first layer, on the topside of the printed circuit board, combines both the horizontal and vertical sensor electrode traces. The second layer, located on the underside of the printed circuit board, is formed in the conventional manner by attaching the controller chip and/or related circuitry.

Abstract: An electronic device is provided making use of a touch pad module to implement user input functions. The electronic device includes a case having a region of thinner cross section than the remaining case side wall for receiving the touch pad module. The case is further provided with a through hole in the area of its thinner cross section for receiving control electronics of the touch pad module enabling the region of thinner cross section to physically support the touch pad module so that the module can be thinner than what is conventionally believed to be necessary to maintain its physical integrity while in use as an input device.