Abstract: A laser sintering deposition method for disposing lead selenide onto a substrate. The method includes: wet-milling a lead selenide ingot mixed with methanol into a colloidal slurry containing nanocrystals; separating the colloidal slurry into nanocrystal particles and the methanol; depositing the nanocrystal particles to a substrate; and emitting coherent infrared light onto the nanocrystal particles for fusing into a lead selenide crystalline film. Afterwards, the lead selenide film can be exposed to oxygen to form a lead selenite layer, and subsequently to iodine gas to produce a lead iodide layer onto the lead selenite layer.

Abstract: An assembly is provided for mechanically severing ball grid array (BGA) attachment solder between an electronics chip and a printed circuit board. The assembly includes a bridge fixture, a tungsten wire and removable spacers. The bridge fixture extends over the chip. A pair of guide bars flanks the bridge fixture. each guide bar has a wire engagement surface. The tungsten wire is disposed across the chip between the pair of guide bars along their respective surfaces. The removable spacers are disposed between the corresponding guide bars and the printed circuit board for aligning the wire to engage the solder.