Patents by Inventor Joel T. Tomlin

Joel T. Tomlin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5369051
    Abstract: A method for forming LOCOS isolation regions which includes the steps of forming a polysilicon buffer layer between the pad oxide layer and the nitride layer and forming a sidewall seal around the perimeter of the active moat regions prior to the field oxidation step. The resulting field oxide isolation region has reduced oxide encroachment into the active moat region.
    Type: Grant
    Filed: August 5, 1992
    Date of Patent: November 29, 1994
    Assignee: Texas Instruments Incorporated
    Inventors: Kalipatnam V. Rao, Joel T. Tomlin, Monica A. Beals
  • Patent number: 5159428
    Abstract: This is a semiconductor device, comprising: a semiconductor body having an isolation region separating at least two active device regions; pad oxide layers disposed on said active regions; polysilicon layers disposed on said pad oxide layers; silicon nitride layers disposed on said polysilicon layers; and a sidewall seal disposed all along the perimeter of the active device regions to seal said active device regions against oxygen diffusion. The resulting field oxide isolation region has reduced oxide encroachment into the active moat region.
    Type: Grant
    Filed: December 5, 1990
    Date of Patent: October 27, 1992
    Assignee: Texas Instruments Incorporated
    Inventors: Kalipatnam V. Rao, Joel T. Tomlin, Monica A. Beals
  • Patent number: 4911103
    Abstract: A process module which is compatible with a system using primarily vacuum wafer transport, but which permits processing multiple slices in parallel in a single module. This is accomplished by using notched quartz arms in the module, so that the transfer arm can place each of several wafers into one set of notches in the quartz arms. Optionally, a vertical degree of movement in the arm may be used to accomplish this, and the quartz arms may be immovable. This means that the port from the multi-wafer module into the wafer transfer system must be high enough to accommodate the necessary vertical movement of the transfer arm. After the transfer arm has placed the wafer on the quartz arms, the process module can be elevated to close around the set of wafers and made a seal.
    Type: Grant
    Filed: November 22, 1988
    Date of Patent: March 27, 1990
    Assignee: Texas Instruments Incorporated
    Inventors: Cecil J. Davis, Dean W. Freeman, Robert T. Matthews, Joel T. Tomlin, Rhett B. Jucha
  • Patent number: 4832778
    Abstract: A high pressure processing apparatus and method which is compatible with a system wherein wafers are largely transported and processed under vacuum. The pressure vessel can be extremely small, i.e. has a total pressurized volume of which almost all interior points are within one or two centimeters of one of the workpieces which may be loaded into the chamber.
    Type: Grant
    Filed: May 27, 1988
    Date of Patent: May 23, 1989
    Assignee: Texas Instruments Inc.
    Inventors: Cecil J. Davis, Dean W. Freeman, Robert T. Matthews, Joel T. Tomlin