Abstract: A micromodule includes a slotted metal strip and a perforated dielectric strip having a thickness of less than 70 micrometers, preferably between 30 and 50 micrometers. The metal strip is bonded to the dielectric strip so as to overlie the slots in the metal strip. A chip is bonded to the dielectric strip and connected to the metal strip through the perforations in the dielectric strip. An insulating resin layer encapsulates the chip and is bonded to the dielectric strip. The micromodule may be used, for example, in a smart card, as a radiating antenna, or as an identification label.

Abstract: The method consists in pressure bonding a first strip to a second strip through a bonding press, marking each of the strips with the pattern pitches and juxtaposing the pattern pitch markings of each strip at the time of the bonding by extension of at least one strip with respect to another and by differential heating of each of the opposing strips to cause a relative shift, by expansion, of the two strips with respect to each other.