Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

Abstract: The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.

Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

Abstract: The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.

Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

Abstract: The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.

Abstract: The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.

Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

Abstract: The present disclosure involves a method of making a lapping plate by electrostatically coating a platen with solid resin powder and abrasive particles followed by curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

Abstract: The present disclosure involves a method of making a lapping plate by coating a platen with solid resin powder, abrasive particles, and an aqueous carrier followed by evaporating the aqueous carrier and curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

Abstract: The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.

Abstract: The present disclosure involves a method of making a lapping plate by coating a platen with solid resin powder, abrasive particles, and an aqueous carrier followed by evaporating the aqueous carrier and curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

Abstract: The present disclosure involves a method of making a lapping plate by electrostatically coating a platen with solid resin powder and abrasive particles followed by curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

Abstract: A method of forming a patterned lapping plate by providing a working tool having a pattern comprising a plurality of raised teeth, each of the raised teeth having a base, at least one side wall, and a terminal end, and patterning the lapping plate with the tool to provide a working surface having an inverse pattern of the tool surface in the working surface of the lapping plate, the patterning process plastically deforming the working surface of the lapping plate.

Abstract: A method of forming a lapping plate. The method includes providing a lapping plate having a surface, spraying an adhesive onto the surface, spraying a slurry of abrasive particles and solvent onto the adhesive, and curing the adhesive to form an abrasive coating on the lapping plate. The adhesive may be, for example, epoxy, and the abrasive particles may be, for example, diamonds.

Abstract: An apparatus and associated method for constructing an abrading tool having a desired surface texture for a lapping surface of the tool. The abrading tool has a platen defining an external surface and a cavity intersecting the external surface. An adhesive is disposed in the cavity. An abrasive member is adhered at a proximal end thereof to the platen in the cavity by the adhesive so that the abrasive member extends beyond the external surface at a distal end thereof to define the lapping surface.

Abstract: A lapping platen having a working surface and an abrasive coating on the working surface. The abrasive coating comprises a plurality of individual abrasive composites adhered to the working surface with an epoxy, the abrasive composites comprising diamond particles and a ceramic matrix. The diamond particles have an average particle size of 0.1 micrometers to 3 micrometers with no particle larger than 6 micrometers. The abrasive composites have an average particle size of 15 micrometers to 100 micrometers with no particle larger than 150 micrometers.

Abstract: A method of forming a lapping plate. The method includes providing a lapping plate having a surface, spraying an adhesive onto the surface, spraying a slurry of abrasive particles and solvent onto the adhesive, and curing the adhesive to form an abrasive coating on the lapping plate. The adhesive may be, for example, epoxy, and the abrasive particles may be, for example, diamonds.

Abstract: A device having an air bearing surface, the device including a writer portion having an air bearing surface at the air bearing surface of the device; and an overcoat layer disposed on at least a portion of the air bearing surface of the writer portion, wherein the overcoat includes a material having a magnetic moment of at least about 0.1 Tesla (T).