Abstract: Aspects of the present disclosure relate to a transfer device, system, and method for transferring an electronic component onto a placement position on a substrate. The transfer device is based on a fluidic process principle in which electronic components are transferred in a transfer liquid. In accordance with an aspect of the present disclosure, the transfer device further includes a plurality of acoustic transducers, and a controller for controlling the plurality of acoustic transducers. The controller is configured to control the plurality of acoustic transducers to create an acoustic trap in the transfer liquid for capturing an electronic component when it is released in the transfer liquid and to subsequently manipulate the position and/orientation of the acoustic trap for the purpose of positioning the electronic component at the placement position on the substrate.

Abstract: Aspects of the present disclosure relate to a system for transporting an electronic component. Further aspects of the present disclosure relate to a method for transporting an electronic component. According to an aspect of the present disclosure a system for transporting an electronic component is provided that includes a carrier for carrying the electronic component, and a transducer system including a plurality of transducers, the transducer system being configured for generating a levitation field in which the carrier levitates. The system also includes an input unit for arranging the electronic component onto the carrier, and an output unit for receiving the electronic component from the carrier. A controller is used for controlling the transducer system to change the levitation field for the purpose of moving the carrier from the input unit to the output unit.

Abstract: The disclosure relates to an apparatus for transferring a semiconductor die from an arrangement of semiconductor dies to a target and to a wafer stage to be used in such an apparatus. The wafer chuck includes a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged, and the wafer stage includes a first motor for rotating the curved shell around a rotational axis. The curved configuration allows an improved throughput of the wafer stage. The film frame carrier used with this wafer stage comprises a ring-shaped body with an asymmetric bending stiffness allowing the ring-shaped body to be bent so that the mounting surface of the ring-shaped body changes from having a first shape to a second more concave shape and prevents or limits the ring-shaped body to be bent so that the shape of the mounting surface becomes more convex than the first shape.

Abstract: An apparatus for transferring a semiconductor die from an arrangement dies to a target is provided and relates to a wafer stage, and film frame carrier, and to an assembly including the film frame carrier and arrangement of dies. The wafer chuck includes a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged. The wafer stage includes a motor for rotating the curved shell around a rotational axis. The configuration allows improved throughput of the wafer stage. The carrier used with this wafer stage includes a ring-shaped body with an asymmetric bending stiffness allowing the ring-shaped body to be bent so that the mounting surface of the ring-shaped body changes from a first shape to a second more concave shape and prevents or limits the ring-shaped body to be bent so that the mounting surface becomes more convex than the first shape.

Abstract: A semiconductor device such as a chip-scale package is provided. Aspects of the present disclosure further relate to a method for manufacturing such a device. According to an aspect of the present disclosure, a semiconductor device is provided that includes a conformal coating arranged on its sidewalls and on the perimeter part of the semiconductor die of the semiconductor device. To prevent the conformal coating from covering unwanted areas, such as electrical terminals, a sacrificial layer is arranged prior to arranging the conformal coating. By removing the sacrificial layer, the conformal coating can be removed locally. The conformal coating covers the perimeter part of the semiconductor die by the semiconductor device, in which part a remainder of a sawing line or dicing street is provided.

Abstract: A semiconductor device is provided that includes a substrate, a pocket within the substrate, a solderable/glueable re-distribution layer arranged in the pocket and a die. The die is arranged downwards, so that a base contact and an emitter contact of the die face the bottom of the device, and a collector contact of the die faces the top of the device. The solderable/glueable re-distribution layer includes a first and second re-distribution layer part and the first re-distribution layer part and the second re-distribution layer part are isolated from each other by an isolating material. The emitter contact is connected to the first re-distribution layer part and the base contact is connected to the second re-distribution layer part. The emitter contacts via the first re-distribution layer part, the base contacts via the second re-distribution layer part, and the collector contact are fan out to the top surface of the semiconductor device.

Abstract: A semiconductor device is provided that includes a frontside and a backside, four sidewalls, a first solder/glue connection on the frontside and a second solder/glue connection on the backside. The semiconductor device is either connected as a chip scale package to a printed circuit board or inside a semiconductor package via one of the four sidewalls, so that the first solder/glue connection and the second solder/glue connection are visible for a visual solder/glue inspection.

Abstract: The disclosed device includes a single electric motor for linear and rotary movement with a stator. The stator includes a multi-phase coil arrangement with a plurality of coils or coil sets and a rotor. The rotor is movable in an axial direction of a rotational axis thereof and includes a plurality of poles respectively with at least one permanent magnet The device further includes a control unit operative to determine currents (Ir, Is, It) by calculation formulas and based on at least a number of coils or coil sets of the plurality of coils or coil sets, and an angle of rotation of said rotor and a parameter depending on an axial position of the rotor. Each current (Ir, Is, It) has a current component (Ir?, Is?, It?) for generating a torque and a current component (Irx, Isx, Itx) for generating an axial force, and to supply the determined currents in open loop to the number of coils or coil sets, so that the sum of the currents is zero. Further, at least one of the stator and the rotor, includes a back-iron.

Abstract: The disclosed device includes a single electric motor for linear and rotary movement with a stator. The stator includes a multi-phase coil arrangement with a plurality of coils or coil sets and a rotor. The rotor is movable in an axial direction of a rotational axis thereof and includes a plurality of poles respectively with at least one permanent magnet The device further includes a control unit operative to determine currents (Ir, Is, It) by calculation formulas and based on at least a number of coils or coil sets of the plurality of coils or coil sets, and an angle of rotation of said rotor and a parameter depending on an axial position of the rotor. Each current (Ir, Is, It) has a current component (Ir?, Is?, It?) for generating a torque and a current component (Irx, Isx, Itx) for generating an axial force, and to supply the determined currents in open loop to the number of coils or coil sets, so that the sum of the currents is zero. Further, at least one of the stator and the rotor, includes a back-iron.

Abstract: A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.

Abstract: In a chip transferring apparatus a wafer (44) and a lead frame (50) are positioned. A first chip (42) is picked up from the wafer (44) by a transfer head (14; 40a-40d) in a chip pick-up position, while bonding a second chip to the lead frame (50) by another transfer head in a chip bonding position. The first chip (42) is then transferred by said one of the transfer heads from the chip pick-up position to the chip bonding position. Next, the first chip (42) is bonded on the lead frame (50) by said one of the transfer heads (14; 40a-40d) in the chip bonding position, while another one of the transfer heads picks up a third chip from the wafer (44) in the chip pick-up position. Each transfer head (14; 40a-40d) comprises a collet (66a-66d) which, through a mechanical coupling, is coupled to another collet for compensating radial forces exerted on the collet relative to said axis of rotation.

Abstract: A gravity compensation device partially or completely compensates a force exerted by a basic mass (10) on a balancing device (12) at a first distance from an axis of rotation (13) by using a force generating device, such as spring (14), exerting a counterforce on the balancing device at a second distance from the axis of rotation. The first distance, the second distance, or both are selectable for providing the desired gravity compensation. One or more pulleys with an angle-variable radius may be used. The gravity compensation device does not add substantial mass to the basic mass, and is simple in design.

Abstract: A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.

Abstract: A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.

Abstract: A gravity compensation device partially or completely compensates a force exerted by a basic mass (10) on a balancing device (12) at a first distance from an axis of rotation (13) by using a force generating device, such as spring (14), exerting a counterforce on the balancing device at a second distance from the axis of rotation. The first distance, the second distance, or both are selectable for providing the desired gravity compensation. One or more pulleys with an angle-variable radius may be used. The gravity compensation device does not add substantial mass to the basic mass, and is simple in design.

Abstract: In a chip transferring apparatus a wafer (44) and a lead frame (50) are positioned. A first chip (42) is picked up from the wafer (44) by a transfer head (14; 40a-40d) in a chip pick-up position, while bonding a second chip to the lead frame (50) by another transfer head in a chip bonding position. The first chip (42) is then transferred by said one of the transfer heads from the chip pick-up position to the chip bonding position. Next, the first chip (42) is bonded on the lead frame (50) by said one of the transfer heads (14; 40a-40d) in the chip bonding position, while another one of the transfer heads picks up a third chip from the wafer (44) in the chip pick-up position. Each transfer head (14; 40a-40d) comprises a collet (66a-66d) which, through a mechanical coupling, is coupled to another collet for compensating radial forces exerted on the collet relative to said axis of rotation.

Abstract: A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.