Abstract: The invention relates to a molding compound, comprising the following components: a) 60 to 96% by weight polyaryletherketone, b) 2 to 25% by weight hexagonal bornite, and c) 2 to 25% by weight talcum, wherein the sum of the parts by weight of components a), b), and c) is 100. Said compounds can be used to produce a film having a thickness of 5 to 1200 ?m, which is suitable for producing dimensionally stable circuit boards.

Abstract: A process for producing a composite of a polyarylene ether ketone foil a metal foil is provided. The process includes: providing a foil of thickness from 5 to 1200 ?m made of a molding composition which comprises: from 60 to 96 parts by weight of polyarylene ether ketone, from 2 to 25 parts by weight of hexagonal boron nitride and from 2 to 25 parts by weight of talc, where the sum of the parts by weight of the components is 100; providing a metal foil of thickness from 10 to 150 ?m; and pressing the foils without using an adhesive at a temperature in the range from Tm?40K to Tm+40K and at a pressure in the range from 4 to 5000 bar. Also provided is the adhesive-free composite foil which is suitable for producing dimensionally stable circuit boards.

Abstract: The invention relates to a molding compound, comprising the following components: a) 60 to 96% by weight polyaryletherketone, b) 2 to 25% by weight hexagonal bornite, and c) 2 to 25% by weight talcum, wherein the sum of the parts by weight of components a), b), and c) is 100. Said compounds can be used to produce a film having a thickness of 5 to 1200 ?m, which is suitable for producing dimensionally stable circuit boards.