Abstract: Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

Abstract: Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

Abstract: Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

Abstract: An HVAC system for controlling conditions in one or more grow rooms. The HVAC system includes pumps, sensors, controller(s) and valve(s) that mitigate undesired over cooling, which may result in thermally stressing the plants. To counteract the undesired overcooling the HVAC system utilizes reheat to return grow room temperatures to optimal conditions.

Abstract: Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

Abstract: Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

Abstract: Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

Abstract: Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

Abstract: An air handling unit for a computer room having a floor can include a cabinet having an upper chamber and a lower chamber separated by a partition. The lower chamber can be positioned in an air plenum located under the floor. The air handling unit can include a cooling device located in the upper chamber. A first fan assembly can include a first fan and a first mounting device coupling the first fan to the cabinet. The first fan assembly can be movable along a first axis between the upper and lower chambers. According to another embodiment, the air handling can further include a first sensor that detects air pressure in the cabinet, a second sensor that detects air pressure outside the cabinet, and a control unit that increases rotational speed of the fan when the air pressure in the cabinet is lower than the air pressure outside the cabinet.

Abstract: An apparatus, system, and method for improving the provision of air conditioning, is disclosed. The system and method optimize air flow and static pressure for decreased energy consumption, and may include a cabinet and a separation barrier. The cabinet may be operative to house a plurality of any type of plug fans, including for example, AC plug fans and/or electronically commutated (EC) plug fans. The separation barrier is operable to separate or isolate the EC fans from one another. The system may include any of a floor-mounted, raised-floor, computer room, precision air conditioner and/or data center, where the EC fans may be fixedly disposed within the cabinet. The system may also include a V-shaped coil having a substantially open end operable to receive an air flow and a substantially closed end, with a fan operable to receive the dispelled air flow from the V-shaped coil.