Patents by Inventor Joerg-Erich Sorg
Joerg-Erich Sorg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140190732Abstract: A carrier device for an electrical component includes a carrier, which includes an electrically insulating layer, and an electrical contact layer on the electrically insulating layer The electrical contact layer includes at least one bridge-shaped contact region At least one recess in the electrically insulating layer is arranged at least on one side surface of the bridge-shaped contact region and/or the bridge-shaped contact region includes a bridge width reducing toward the insulating layer.Type: ApplicationFiled: July 9, 2012Publication date: July 10, 2014Applicant: OSRAM GMBHInventors: Krister Bergenek, Andreas Biebersdorf, Jörg Erich Sorg
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Patent number: 8731392Abstract: A luminous unit (1) for an optical recording device (13) comprising a light source (2) for generating radiation and a partly reflective element, which is disposed downstream of the light source (2) in a main emission direction (H) and subdivides a space into a first half-space facing the light source (2) and a second half-space remote from the light source (2), wherein the partly reflective element at least partly transmits the radiation coming from the light source (2) from the first half-space and at least partly reflects the external radiation coming from an opposite direction from the second half-space.Type: GrantFiled: April 16, 2009Date of Patent: May 20, 2014Assignee: OSRAM Opto Semiconductors GmbHInventors: Joerg Erich Sorg, Stefan Gruber
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Publication number: 20140030829Abstract: An optoelectronic module is described including a carrier substrate and a plurality of radiation-emitting semiconductor components. The carrier substrate includes structured conductor tracks. The semiconductor components each include an active layer for generating electromagnetic radiation, a first contact area and a second contact area. The first contact area is in each case arranged on that side of the semiconductor components that is remote from the carrier substrate. The semiconductor components are provided with an electrically insulating layer having a cutout in a region of the first contact area. Conductive structures are arranged in regions on the insulating layer. One of the conductive structures electrically conductively connects at least the first contact area of a semiconductor component to a further first contact area of a further semiconductor component or to a conductor track of the carrier substrate. A method for producing such a module is also described.Type: ApplicationFiled: June 6, 2013Publication date: January 30, 2014Applicant: OSRAM Opto Semiconductors GmbHInventors: Bert BRAUNE, Joerg Erich SORG, Walter WEGLEITER, Karl WEIDNER, Oliver WUTZ
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Publication number: 20130248908Abstract: The invention relates to a radiation-emitting component comprising a semiconductor body which emits electromagnetic radiation from a radiation exit surface during operation. The semiconductor body is arranged in a component housing having a cutout. The component further comprises an optical element which is connected to the component housing in a mechanically stable manner by means of a joining layer. The modulus of elasticity of the joining layer is lower than or equal to 30 MPa.Type: ApplicationFiled: August 17, 2011Publication date: September 26, 2013Applicant: OSRAM Opto Semiconductors GmbHInventors: Joerg Erich Sorg, Ruediger Mueller, Raimund Schwarz
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Publication number: 20130207144Abstract: A component with an optoelectronic semiconductor chip fixed to a connection carrier by a bonding layer and embedded in an encapsulation, wherein a decoupling layer is arranged at least in places between the bonding layer and the encapsulation.Type: ApplicationFiled: July 1, 2011Publication date: August 15, 2013Applicant: OSRAM Opto Semiconductors GmbHInventors: Johann Ramchen, Jörg Erich Sorg, Simon Jerebic, Bert Braune
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Patent number: 8461604Abstract: An optoelectronic module is described including a carrier substrate and a plurality of radiation-emitting semiconductor components. The carrier substrate includes structured conductor tracks. The radiation-emitting semiconductor components each include an active layer suitable for generating electromagnetic radiation, a first contact area and a second contact area. The first contact area is in each case arranged on that side of the radiation-emitting semiconductor components that is remote from the carrier substrate. The radiation-emitting semiconductor components are provided with an electrically insulating layer, which in each case has a cutout in a region of the first contact area. Conductive structures are arranged in regions on the electrically insulating layer.Type: GrantFiled: August 25, 2009Date of Patent: June 11, 2013Assignee: OSRAM Opto Semiconductors GmbHInventors: Bert Braune, Jörg Erich Sorg, Walter Wegleiter, Karl Weidner, Oliver Wutz
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Patent number: 8373186Abstract: A radiation-emitting component includes a semiconductor layer stack having an active region that emits electromagnetic radiation, and at least one surface of the semiconductor layer stack or of an optical element that transmits the electromagnetic radiation wherein the surface has a normal vector, wherein on the at least one surface of the semiconductor layer stack or of the optical element through which the electromagnetic radiation passes, an antireflection layer is arranged such that, for a predetermined wavelength, it has a minimum reflection at a viewing angle relative to the normal vector of the surface at which an increase in a zonal luminous flux of the electromagnetic radiation has approximately a maximum.Type: GrantFiled: August 28, 2008Date of Patent: February 12, 2013Assignee: OSRAM Opto Semiconductors GmbHInventors: Stefan Grötsch, Jan Marfeld, Jörg Erich Sorg, Moritz Engl, Steffen Köhler
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Publication number: 20120322178Abstract: In a method for producing a radiation-emitting optoelectronic component, a semiconductor chip is mounted by a first main area onto a carrier body and is electrically conductively connected at a first contact area to a first connection region, and a transparent electrically insulating encapsulation layer is applied to the chip and the carrier body. A first cutout in the encapsulation layer for at least partly uncovering a second contact area of the chip is produced, and a second cutout in the encapsulation layer for at least partly uncovering a second connection region of the carrier body is produced. Finally, an electrically conductive layer, which electrically conductively connects the second contact area of the semiconductor chip and the second connection region of the carrier body, is applied.Type: ApplicationFiled: August 28, 2012Publication date: December 20, 2012Applicant: Osram Opto Semiconductors GmbHInventors: Ewald Karl Michael Guenther, Jörg Erich Sorg, Norbert Stath
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Publication number: 20120301982Abstract: An optoelectronic headlight which emits electromagnetic radiation is specified, which has a luminescence diode chip with at least two spatial emission regions or which has at least two luminescence diode chips each having at least one spatial emission region. The headlight is suitable in particular for a front headlight for motor vehicles. The emission regions, in a plan view of a main extension plane associated with them, are shaped differently, are of different sizes and/or are not shaped rectangularly and are differently oriented. Particularly preferably, the emission regions can be driven independently of one another. Methods for production of an optoelectronic headlight and a luminescence diode chip are furthermore specified.Type: ApplicationFiled: August 13, 2012Publication date: November 29, 2012Inventors: Johannes BAUR, Joachim Reill, Jörg Erich Sorg
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Patent number: 8267561Abstract: An optoelectronic headlight which emits electromagnetic radiation is specified, which has a luminescence diode chip with at least two spatial emission regions or which has at least two luminescence diode chips each having at least one spatial emission region. The headlight is suitable in particular for a front headlight for motor vehicles. The emission regions, in a plan view of a main extension plane associated with them, are shaped differently, are of different sizes and/or are not shaped rectangularly and are differently oriented. Particularly preferably, the emission regions can be driven independently of one another. Methods for production of an optoelectronic headlight and a luminescence diode chip are furthermore specified.Type: GrantFiled: March 20, 2007Date of Patent: September 18, 2012Assignee: Osram Opto Semiconductors GmbHInventors: Johannes Baur, Joachim Reill, Jörg Erich Sorg
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Patent number: 8237192Abstract: A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.Type: GrantFiled: December 9, 2008Date of Patent: August 7, 2012Assignee: OSRAM Opto Semiconductors GmbHInventors: Joerg Erich Sorg, Stefan Gruber, Georg Bogner
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Publication number: 20120190140Abstract: A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side and which are fixed by their rear side—opposite the front side—on a first main face of a common carrier body, wherein the semiconductor chips consist of a respective substrateless semiconductor layer stack and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.Type: ApplicationFiled: April 5, 2012Publication date: July 26, 2012Applicant: OSRAM Opto Semiconductors GmbHInventors: Jörg Erich SORG, Stefan Gruber, Siegfried Herrmann, Berthold Hahn
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Publication number: 20120161162Abstract: An optoelectronic semiconductor device is specified, comprising a multiplicity of radiation-emitting semiconductor chips (2), arranged in a matrix-like manner, wherein the semiconductor chips (2) are applied on a common carrier (1), at least one converter element (3) disposed downstream of at least one semiconductor chip (2) for converting electromagnetic radiation emitted by the semiconductor chip (2), at least one scattering element (4) situated downstream of each semiconductor chip (2) and serving for diffusely scattering electromagnetic radiation emitted by the semiconductor chip (2), wherein the scattering element (4) is in direct contact with the converter element (3).Type: ApplicationFiled: December 23, 2009Publication date: June 28, 2012Applicant: OSRAM Opto Semiconductors GmbHInventors: Moritz Engl, Jörg Erich Sorg, Thomas Zeiler, Joachim Reill
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Publication number: 20120139003Abstract: An optoelectronic component including a connection carrier including an electrically insulating film at a top side of the connection carrier, an optoelectronic semiconductor chip at the top side of the connection carrier, a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and a potting body surrounding the optoelectronic semiconductor chip, wherein a bottom area of the cutout is formed at least regionally by the electrically insulating film, the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip, and the cutout is at least regionally free of the potting body.Type: ApplicationFiled: May 28, 2010Publication date: June 7, 2012Applicants: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG, OSRAM OPTO SEMICONDUCTORS GMBHInventors: Michael Zitzlsperger, Eckhard Ditzel, Jörg Erich Sorg
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Patent number: 8154040Abstract: A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side (101) and which are fixed by their rear side (102)—opposite the front side—on a first main face (201) of a common carrier body (2), wherein the semiconductor chips consist of a respective substrateless semiconductor layer stack (1) and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.Type: GrantFiled: September 25, 2007Date of Patent: April 10, 2012Assignee: OSRAM Opto Semiconductors GmbHInventors: Jörg Erich Sorg, Stefan Gruber, Siegfried Herrmann, Berthold Hahn
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Publication number: 20110309377Abstract: An optoelectronic module is specified, comprising a carrier substrate (1) and a plurality of radiation-emitting semiconductor components (2). The carrier substrate (1) comprises structured conductor tracks. The radiation-emitting semiconductor components (2) each comprise an active layer (2a) suitable for generating electromagnetic radiation, a first contact area (21) and a second contact area (22), wherein the first contact area (21) is in each case arranged on that side of the radiation-emitting semiconductor components (2) which is remote from the carrier substrate (1). The radiation-emitting semiconductor components (2) are provided with an electrically insulating layer (4), which in each case has a cutout in a region of the first contact area (21). Conductive structures (8) are arranged in regions on the electrically insulating layer (4).Type: ApplicationFiled: August 25, 2009Publication date: December 22, 2011Applicant: OSRAM Opto Semiconductors GmbHInventors: Bert Braune, Jörg Erich Sorg, Walter Wegleiter, Karl Weidner, Oliver Wutz
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Publication number: 20110266576Abstract: An optoelectronic semiconductor device at least one radiation-emitting semiconductor chip (3); at least one converter element (4) disposed downstream of the semiconductor chip (3) and serving for converting electromagnetic radiation emitted by the semiconductor chip (3) during operation, wherein the converter element (4) emits colored light upon irradiation with ambient light; a means for diffusely scattering light (5), which is designed to scatter ambient light impinging on the device in a switched-off operating state of the device in such a way that a light exit area (62) of the device appears white.Type: ApplicationFiled: October 27, 2009Publication date: November 3, 2011Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Moritz Engl, Joerg Erich Sorg, Thomas Zeiler, Michael Reich, Ulrich Streppel
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Publication number: 20110188846Abstract: A luminous unit (1) for an optical recording device (13) comprising a light source (2) for generating radiation and a partly reflective element, which is disposed downstream of the light source (2) in a main emission direction (H) and subdivides a space into a first half-space facing the light source (2) and a second half-space remote from the light source (2), wherein the partly reflective element at least partly transmits the radiation coming from the light source (2) from the first half-space and at least partly reflects the external radiation coming from an opposite direction from the second half-space.Type: ApplicationFiled: April 16, 2009Publication date: August 4, 2011Applicant: Osram Opto Semiconductors GmbHInventors: Joerg Erich Sorg, Stefan Gruber
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Publication number: 20110108870Abstract: An optoelectronic semiconductor component includes a connection carrier with at least two connection points and configured with a silicone matrix with a fiber reinforcement, and at least one optoelectronic semiconductor chip mounted on the connection carrier and in direct contact therewith.Type: ApplicationFiled: April 20, 2009Publication date: May 12, 2011Applicant: OSRAM Opto Semiconductors GmbHInventors: Harald Jaeger, Joerg Erich Sorg
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Publication number: 20100270578Abstract: A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.Type: ApplicationFiled: December 9, 2008Publication date: October 28, 2010Inventors: Joerg Erich Sorg, Stefan Gruber, Georg Bogner