Abstract: An optoelectronic assembly and method for operating an optoelectronic assembly are provided. In some aspects, the optoelectronic assembly includes an organic light-emitting component, a temperature sensor configured to record a temperature value, and a driver circuit coupled to the organic light-emitting component and the temperature sensor. The driver circuit is configured to apply an AC voltage to the organic light-emitting component when the organic light-emitting component is switched on, and if the recorded temperature value is less than a predetermined temperature threshold value, where the AC voltage is, at least, temporarily less than an instantaneous threshold voltage of the organic light-emitting component. The driver circuit is also configured to apply a DC voltage to the organic light-emitting component if a measurement value is greater than or equal to a predetermined threshold value, where the DC voltage is greater than the instantaneous threshold voltage of the organic light-emitting component.

Abstract: An organic light-emitting diode is disclosed. In an embodiment, the diode includes a first light-emitting segment and at least a second light-emitting segment, wherein the first and second light-emitting segments include a common first electrode and a common second electrode, and are configured to emit radiation with different brightnesses, wherein the first electrode includes at least one separating line that does not completely cut through the first electrode, wherein an electric conductivity of the first electrode is reduced in a region of the separating line, wherein the separating line separates the first light-emitting segment from the second light-emitting segment, and wherein the second light-emitting segment has a lower brightness during operation than the first light-emitting segment.

Abstract: A light-emitting element includes at least one flat light emitter having a first electrical contact portion formed on a side surface, and a housing partially surrounding the side surface of the flat light emitter, the housing including a second electrical contact portion formed on an inner surface of the housing and configured to mate with the first electrical contact portion.

Abstract: An optoelectronic assembly and method for operating an optoelectronic assembly are provided herein. The optoelectronic assembly may include an organic light-emitting component, a temperature sensor for recording a temperature value, and a controller coupled to the organic light-emitting component and to the temperature sensor. The controller may be configured to apply an alternating current (AC) voltage to the organic light-emitting component when the organic light-emitting component is switched on, and if the recorded temperature value is less than a predetermined temperature threshold value, where the AC voltage may, at least, temporarily less than an instantaneous threshold voltage of the organic light-emitting component.

Abstract: An illuminant may include at least one light-emitting element unit, which has a carrier, at least one light-emitting element arranged on the carrier and is surrounded by an encapsulating material, at least one contact area formed on the carrier, and at least one contact element arranged on the contact area, wherein the light-emitting element surrounded by the encapsulating material is electrically connected to the contact element via the contact area, and at least one mating contact element, wherein electrical contact can be made between the mating contact element and the contact element via a plug-type connection, wherein the contact element is a female connector element, and the mating contact element is a male connector element and having a plurality of pin contact elements, or the contact element is a male connector element and having a plurality of pin contact elements, and the mating contact element is a female connector element.

Abstract: Various embodiments may relate to an optoelectronic component, including an optically active region formed for taking up and/or for providing electromagnetic radiation, at least one first contact structure, wherein the optically active region is electrically conductively coupled to the first contact structure, and an encapsulation structure with a second contact structure, wherein the encapsulation structure is formed on or above the optically active region and the first contact structure, and an electrically conductive structure formed for electrically conductively connecting the first contact structure to the second contact structure, wherein the encapsulation structure is at least partly formed by an electrically insulating molding compound, wherein the electrically insulating molding compound at least partly surrounds the electrically conductive structure.

Abstract: In various embodiments, an optoelectronic component is provided. The optoelectronic component includes a carrier body. An optoelectronic layer structure is formed above the carrier body and has at least one contact region for electrically contacting the optoelectronic layer structure. A covering body is arranged above the optoelectronic layer structure. At least one contact cutout in which at least one part of the contact region is exposed extends through the carrier body and/or the covering body. At least one plug element for electrically contacting the optoelectronic component is arranged at least partly in the contact cutout and tightly closes the contact cutout. A contact medium, via which the plug element is electrically coupled to the contact region, is arranged in the contact cutout.

Abstract: A method can be used for operating an organic light-emitting component. The organic light-emitting component has a first electrode and a second electrode, between which an organic functional layer stack with at least one organic light-emitting layer is arranged. The first and second electrodes and the organic functional layer stack have a large area. Electrical contact is made with the first electrode via at least two electrical connection elements in the peripheral regions, in which different electric voltages are applied to the at least two electrical connection elements and the different electric voltages vary over time. A lighting device for implementing the method is also specified.

Abstract: An organic light-emitting diode is disclosed. In an embodiment, the diode includes a first light-emitting segment and at least a second light-emitting segment, wherein the first and second light-emitting segments include a common first electrode and a common second electrode, and are configured to emit radiation with different brightnesses, wherein the first electrode includes at least one separating line that does not completely cut through the first electrode, wherein an electric conductivity of the first electrode is reduced in a region of the separating line, wherein the separating line separates the first light-emitting segment from the second light-emitting segment, and wherein the second light-emitting segment has a lower brightness during operation than the first light-emitting segment.

Abstract: In at least one embodiment, a light panel system includes a system carrier with a carrier front face. Multiple organic light emitting diodes are arranged in a uniform grid on the carrier front face. An electronics driver is fitted to or in the system carrier. The light panel system can be handled and mounted as a single unit.

Abstract: An optoelectronic component include a carrier body, an optoelectronic layer structure formed above the carrier body and having at least one contact region for contacting the optoelectronic layer structure, a covering body arranged above the optoelectronic layer structure, at least one contact cutout extending through the covering body and/or the carrier body. The contact cutout has a first and a second cutout regions, which lead into one another and which extend from an outer surface of the covering body and/or of the carrier body in a layer plane direction where the contact region is formed. A first clear width of the contact cutout near the corresponding outer surface in the first cutout region is greater than a second clear width in the second cutout region near the corresponding outer surface. The second clear width is less than a third clear width of the second cutout region near the contact region.

Abstract: An optoelectronic component include a carrier body, an optoelectronic layer structure formed above the carrier body and having at least one contact region for contacting the optoelectronic layer structure, a covering body arranged above the optoelectronic layer structure, at least one contact cutout extending through the covering body and/or the carrier body. The contact cutout has a first and a second cutout regions, which lead into one another and which extend from an outer surface of the covering body and/or of the carrier body in a layer plane direction where the contact region is formed. A first clear width of the contact cutout near the corresponding outer surface in the first cutout region is greater than a second clear width in the second cutout region near the corresponding outer surface. The second clear width is less than a third clear width of the second cutout region near the contact region.

Abstract: In various embodiments, an optoelectronic component is provided. The optoelectronic component includes a carrier body. An optoelectronic layer structure is formed above the carrier body and has at least one contact region for electrically contacting the optoelectronic layer structure. A covering body is arranged above the optoelectronic layer structure. At least one contact cutout in which at least one part of the contact region is exposed extends through the carrier body and/or the covering body. At least one plug element for electrically contacting the optoelectronic component is arranged at least partly in the contact cutout and tightly closes the contact cutout. A contact medium, via which the plug element is electrically coupled to the contact region, is arranged in the contact cutout.

Abstract: A method can be used for operating an organic light-emitting component. The organic light-emitting component has a first electrode and a second electrode, between which an organic functional layer stack with at least one organic light-emitting layer is arranged. The first and second electrodes and the organic functional layer stack have a large area. Electrical contact is made with the first electrode via at least two electrical connection elements in the peripheral regions, in which different electric voltages are applied to the at least two electrical connection elements and the different electric voltages vary over time. A lighting device for implementing the method is also specified.

Abstract: Various embodiments may relate to an optoelectronic component, including an optically active region formed for taking up and/or for providing electromagnetic radiation, at least one first contact structure, wherein the optically active region is electrically conductively coupled to the first contact structure, and an encapsulation structure with a second contact structure, wherein the encapsulation structure is formed on or above the optically active region and the first contact structure, and an electrically conductive structure formed for electrically conductively connecting the first contact structure to the second contact structure, wherein the encapsulation structure is at least partly formed by an electrically insulating molding compound, wherein the electrically insulating molding compound at least partly surrounds the electrically conductive structure.

Abstract: An illuminant may include at least one light-emitting element unit, which has a carrier, at least one light-emitting element arranged on the carrier and is surrounded by an encapsulating material, at least one contact area formed on the carrier, and at least one contact element arranged on the contact area, wherein the light-emitting element surrounded by the encapsulating material is electrically connected to the contact element via the contact area, and at least one mating contact element, wherein electrical contact can be made between the mating contact element and the contact element via a plug-type connection, wherein the contact element is a female connector element, and the mating contact element is a male connector element and having a plurality of pin contact elements, or the contact element is a male connector element and having a plurality of pin contact elements, and the mating contact element is a female connector element.

Abstract: In at least one embodiment, a light panel system includes a system carrier with a carrier front face. Multiple organic light emitting diodes are arranged in a uniform grid on the carrier front face. An electronics driver is fitted to or in the system carrier. The light panel system can be handled and mounted as a single unit.

Abstract: A light-emitting element may include at least one flat light emitter, and a housing. The flat light emitter is arranged in the housing in such a way that the housing surrounds a side surface of the flat light emitter partially. The flat light emitter is held in the housing by the side face of the light emitter, and electrical contact is formed therebetween. In order to form the electrical contact, a conductive surface element is arranged on the side surface of the light emitter and a conductive mating surface element is arranged on an inner surface of the housing, which inner surface points towards the side surface. The conductive surface element is guided over an edge region of the flat light emitter from an upper and/or lower side of an element of the flat light emitter to the side surface of the flat light emitter.