Abstract: A motor vehicle comprises a three-point safety belt device to a motor vehicle seat, wherein the safety belt device comprises a belt, a belt magazine, a belt buckle for releasably securing the belt and a deflection member. The deflection member is provided for guiding the belt emerging from the belt magazine and for deflecting the belt and forming a belt portion of the belt, wherein the belt portion is guided over a shoulder and a chest of a secured motor vehicle occupant seated on the motor vehicle seat. The deflection member is designed such that in the state of the motor vehicle occupant secured by the belt, when the belt portion is subjected to an increased tensile loading, the belt portion performs a displacement from a comfort position into an emergency position in the direction of the motor vehicle interior.

Abstract: A deflection fitting for a seat belt in a motor vehicle, in particular for an inflatable seat belt, includes a belt deflector which encloses the seat belt and which comprises a guide slot for receiving and for passing through the seat belt.

Abstract: A packaged IC component having a semiconductor body and a printed circuit board. The semiconductor body includes a monolithically integrated circuit and at least two metal contact areas. The printed circuit board has a first and second region and a top and a bottom. At least two formed terminal contacts and two conductive traces are connected to the terminal contacts, and the terminal contacts are designed as contact holes passing through the printed circuit board, and are arranged in the first region of the printed circuit board. The two metal contact areas are connected to the conductive traces by bond wires, and the semiconductor body is implemented as a die. The die is arranged in the second region on the top of the printed circuit board, and the semiconductor body and the bond wires are completely covered with a potting compound on the top of the printed circuit board.

Abstract: An electrical component having a first package part of a first plastic compound. The first package part has a first trench-shaped formation. A first semiconductor body with an integrated circuit is disposed in the first trench-shaped formation. At least two traces, which run on an outer side of the first package part, are provided on a surface of the first trench-shaped formation, wherein the at least two traces are connected to the integrated circuit. The first trench-shaped formation is filled at least partially with a filling material of a second plastic compound to cover the first semiconductor body.

Abstract: A tool-changing carrier, that is to say a tool turret (1) with a rotary turret unit having at least two tool mounts (9) and arranged such that it can be rotated relative to a basic turret body (12), has radiation-transmission means which are provided for passing electromagnetic radiation through the tool-changing carrier or along the same. A tool system comprises such a tool-changing carrier and at least two tool heads (3, 5, 15, 17, 18, 27, 34, 40, 43), intended for fixing on the tool mounts (9), wherein at least one tool head is an optical tool head (3, 15, 17, 18) which is suitable for exposing a workpiece (11) to electromagnetic radiation and has a tool optics unit (23) for deflecting and/or forming the electromagnetic radiation.

Abstract: An IC package having a semiconductor body that includes a monolithically integrated circuit and at least two metallic contact surfaces. The integrated circuit being connected to the two electrical contact surfaces via printed conductors, and being disposed on a carrier substrate and connected to the carrier substrate in a force-fitting manner. The carrier substrate including at least two terminal contacts that are connected to the two contact surfaces. The semiconductor body and the carrier substrate being covered by a casting compound forming one part of the IC package. A section of each of the two terminal contacts penetrating the IC package. The two terminal contacts being disposed on the carrier substrate, and each terminal contact and the carrier substrate disposed beneath the particular terminal contacts having a hole-like formation. The particular hole-like formation being designed as a through-connection for providing an electrical connection to another electrical component.

Abstract: A sensor device for suppressing a magnetic stray field, having a semiconductor body with a surface, formed in an x-y plane, and a back surface. Each circle half of a disk-shaped magnet has two magnetic poles and the magnet is rotatable relative to the IC housing around a z-direction. An imaginary lengthening of the axis penetrates the magnet in the center of gravity of the main extension surface of the magnet. A first pixel cell and a second pixel cell are integrated into the surface of the semiconductor body together with a circuit arrangement, and each pixel cell has a first magnetic field sensor and a second magnetic field sensor. The first pixel cell is spaced apart from the second pixel cell along a connecting line, and the first pixel cell in a projection along an imaginary lengthening of the axis is arranged within the two inner circle segments.

Abstract: A sensor device is provided for suppressing a magnetic stray field, having a semiconductor body with a surface formed in an x-y plane, the x-direction and the y-direction are formed orthogonal to one another, and the sensor device has a first pixel cell and a second pixel cell integrated into the surface of the semiconductor body. A first magnetic field sensor detects a magnetic field in the x-direction and a second magnetic field sensor detects a magnetic field in the y-direction. The two pixel cells in a projection along an imaginary lengthening of the axis are arranged at an edge or next to an extension of the magnet in the x-y plane.

Abstract: A sensor device for suppressing a magnetic stray field, having a semiconductor body, a first pixel cell and a second pixel cell integrated into a surface of the semiconductor body together with a circuit arrangement. Each pixel cell has a first magnetic field sensor and a second magnetic field sensor to detect a magnetic field in the x-direction and a magnetic field in the y-direction. The first pixel cell is spaced apart from the second pixel cell along a connecting line, and the substrate and the semiconductor body are disposed in the same IC package. A magnet is provided that has a planar main extension surface in the direction of an x-y plane and has a magnetization with four magnetic poles in the direction of the x-y plane. The IC package is spaced apart from the main extension surface of the magnet in the z-direction and at least partially within a ring magnet.

Abstract: An IC package having a semiconductor body that includes a monolithically integrated circuit and at least two metallic contact surfaces. The integrated circuit being connected to the two electrical contact surfaces via printed conductors, and being disposed on a carrier substrate and connected to the carrier substrate in a force-fitting manner. The carrier substrate including at least two terminal contacts that are connected to the two contact surfaces. The semiconductor body and the carrier substrate being covered by a casting compound forming one part of the IC package. A section of each of the two terminal contacts penetrating the IC package. The two terminal contacts being disposed on the carrier substrate, and each terminal contact and the carrier substrate disposed beneath the particular terminal contacts having a hole-like formation. The particular hole-like formation being designed as a through-connection for providing an electrical connection to another electrical component.

Abstract: A measurement device for determining an angular position, having a magnet device and a sensor device that are rotatable relative to one another. The magnet device has a first north pole face of a first magnetic north pole and a first south pole face of a first magnetic south pole. The magnet device has a second north pole face of a second magnetic north pole and a second south pole face of a second magnetic south pole. The sensor device is located in a region between the first north pole face and the first south pole face and between the second north pole face and the second south pole face. The sensor device has a first magnetic field sensor and a second magnetic field sensor. The first magnetic field sensor and the second magnetic field sensor are spaced apart from one another for ascertaining a magnetic field difference.

Abstract: A motor vehicle comprises a three-point safety belt device to a motor vehicle seat, wherein the safety belt device comprises a belt, a belt magazine, a belt buckle for releasably securing the belt and a deflection member. The deflection member is provided for guiding the belt emerging from the belt magazine and for deflecting the belt and forming a belt portion of the belt, wherein the belt portion is guided over a shoulder and a chest of a secured motor vehicle occupant seated on the motor vehicle seat. The deflection member is designed such that in the state of the motor vehicle occupant secured by the belt, when the belt portion is subjected to an increased tensile loading, the belt portion performs a displacement from a comfort position into an emergency position in the direction of the motor vehicle interior.

Abstract: An injection-molded circuit carrier is provided that has an outside and an underside and an inner base region and a frame. The frame has an inside and a cover surface, so that the inner base region is enclosed in the manner of a frame, and multiple printed conductors are provided, which are spaced a distance apart. The printed conductors are guided at least partially from the inside to the underside via the cover surface and via the outside so that at least two metal surfaces are formed on the underside, which are each electrically connected to a printed conductor and are spaced a distance apart. The metal surfaces are designed to be significantly wider than the printed conductors for the purpose of forming a capacitive sensor.

Abstract: A magnetic field measuring device includes a first semiconductor body having a surface formed in a first x-y plane, the first semiconductor body having two magnetic field sensors, spaced a distance apart on the surface, and the magnetic field sensors each measuring one z component of a magnetic field. A first magnet has a planar main extension surface formed in a second x-y plane, the direction of magnetization changing from a north pole to a south pole along the main extension surface on a symmetry surface of the magnet. One of the two magnetic field sensors being disposed in the vicinity of the north pole and the other of the two magnetic field sensors being situated in the vicinity of the south pole, so that signals having opposite polarities with respect to each other are formed in a z component of the magnetic field.

Abstract: A magnetic field measuring device having a first semiconductor body having a surface formed in a first x-y plane, the first semiconductor body having on the surface two magnetic field sensors which are spaced apart and arranged along a first connecting line, and wherein the magnetic field sensors respectively measure a z-component of a magnetic field, and the x-direction and the y-direction and the z-direction are each formed orthogonally to each other. A first magnet is provided with a planar main extension surface formed in a second x-y plane and with a symmetry surface formed in an x-z plane, wherein the direction of magnetization extends substantially or exactly parallel to the main extension surface and substantially or exactly parallel to the plane of symmetry. The first semiconductor body and the first magnet are rigidly fixed to each other.

Abstract: A measuring system having a magnetic device for generating a magnetic field and having a magnetic field sensor for detecting a flux density of the magnetic field at least in a first spatial direction, whereby the magnetic field sensor is fixedly positioned relative to the magnetic device. The magnetic device has at least two main poles for generating a main magnetic field and at least two secondary poles for generating a secondary magnetic field. The magnetic field in the magnetic field sensor is formed by superposition of the main magnetic field and the secondary magnetic field. The magnetic field sensor is designed to measure the flux density of the superposition in the first spatial direction, and, in the magnetic field sensor, the secondary magnetic field compensates at least partially the main magnetic field in the first spatial direction.

Abstract: A measuring system, having a magnetic device for generating a magnetic field and having a magnetic field sensor with a sensor surface for detecting a flux density of the magnetic field penetrating the sensor surface at least in a first spatial direction, whereby the magnetic field sensor is fixedly positioned relative to the magnetic device. The magnetic device can have at least one permanent magnet and a flux concentrator made of a ferromagnetic material. The permanent magnet has at least two pole surfaces and an outer surface. The flux concentrator can have a smaller dimensions than the outer surface of the permanent magnet. The flux concentrator can be positioned within the outer surface of the permanent magnet and the flux concentrator and the permanent magnet can have a magnetic force closure.

Abstract: A measuring system having a first magnetic field sensor, a second magnetic field sensor, a third magnetic field sensor, an encoder, and an evaluation circuit to which the first magnetic field sensor, the second magnetic field sensor, and the third magnetic field sensor are connected. The evaluation circuit is configured to determine the position of the encoder based on a first measurement signal of the first magnetic field sensor and a second measurement signal of the second magnetic field sensor and a third measurement signal of the third magnetic field sensor.

Abstract: A measuring system having a first magnetic field sensor, an encoder, and an evaluation circuit. The first magnetic field sensor and the second magnetic field sensor and the third magnetic field sensor are connected to the encoder. The evaluation circuit has a logic, which is set up to determine the position of the encoder based on a first measurement signal of a first magnetic field sensor and a second measurement signal of a second magnetic field sensor and a third measurement signal of a third magnetic field sensor.

Abstract: A measuring system having a first magnetic field sensor, a second magnetic field sensor, an encoder, and an evaluation circuit to which the first magnetic field sensor and the second magnetic field sensor are connected. The evaluation circuit generates a first signal and a second measurement signal. The encoder generates a second magnetic field change with a second periodicity. The evaluation circuit generates a second signal with the second periodicity from the first measurement signal of the first magnetic field sensor and the second measurement signal of the second magnetic field sensor according to an absolute value function.