Abstract: An electrostatic acoustic wave generating device and an electrostatic speaker making entries of dust, water, moisture, etc. into the device and the speaker, allowing reduction in power. A plate-like fixed electrode has a through hole penetrating the thickness of the fixed electrode. A vibrating body and a vibrating electrode each having a plate-like shape are arranged closer to one surface and closer to the other surface of the fixed electrode respectively, and are movable in the respective thickness directions thereof. A connection member connects the vibrating body and the vibrating electrode to each other through the through hole of the fixed electrode to cause the vibrating body and the vibrating electrode to move toward the same direction. Voice signal input is capable of applying a voltage to the fixed electrode, the vibrating body, and the vibrating electrode to move the vibrating body between the fixed electrode and the vibrating body.

Abstract: An electrostatic acoustic wave generating device and an electrostatic speaker making entries of dust, water, moisture, etc. into the device and the speaker, allowing reduction in power. A plate-like fixed electrode has a through hole penetrating the thickness of the fixed electrode. A vibrating body and a vibrating electrode each having a plate-like shape are arranged closer to one surface and closer to the other surface of the fixed electrode respectively, and are movable in the respective thickness directions thereof. A connection member connects the vibrating body and the vibrating electrode to each other through the through hole of the fixed electrode to cause the vibrating body and the vibrating electrode to move toward the same direction. Voice signal input is capable of applying a voltage to the fixed electrode, the vibrating body, and the vibrating electrode to move the vibrating body between the fixed electrode and the vibrating body.

Abstract: Provided are a pressure sensor which exhibits exceptional performance and a method of producing the same. The pressure sensor includes: a silicon substrate having a cavity; a diaphragm which is formed of a metallic glass and has a tensile stress in a range in which a resonant frequency is higher than an audible range; and a counter electrode which is insulated from the diaphragm and has a plurality of holes. The diaphragm and the counter electrode are disposed on the silicon substrate to face each other with a gap therebetween, the diaphragm and the counter electrode being released from the silicon substrate by the cavity.

Abstract: Provided are a pressure sensor which exhibits exceptional performance and a method of producing the same. The pressure sensor includes: a silicon substrate having a cavity; a diaphragm which is formed of a metallic glass and has a tensile stress in a range in which a resonant frequency is higher than an audible range; and a counter electrode which is insulated from the diaphragm and has a plurality of holes. The diaphragm and the counter electrode are disposed on the silicon substrate to face each other with a gap therebetween, the diaphragm and the counter electrode being released from the silicon substrate by the cavity.

Abstract: An electrostatically actuated micro-mechanical switching device with movable elements formed in the bulk of a substrate for closing and releasing at least one Ohmic contact by a horizontal movement of the movable elements in a plane of the substrate. The switching device has a drive with comb-shaped electrodes including fixed driving electrodes and movable electrodes. A movable push rod is mechanically connected with the movable electrodes, extends through the electrodes, has a movable contact element at one side, and at least one restoring spring. A signal line has two parts interrupted by a gap. The micro-mechanical switching device is in shunt-configuration with low loss, high isolation in a wide frequency range, low switching time at low actuation voltage and sufficient reliability. The line impedance of the signal line and its variation is as small as possible. The switching device is in shunt-configuration for closing and releasing the Ohmic contact between a ground line and the signal line.

Abstract: A microstructure has at least one bonding substrate and a reactive multilayer system. The reactive multilayer system has at least one surface layer of the bonding substrate with vertically oriented nanostructures spaced apart from one another. Regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A method for producing at least one bonding substrate and a reactive multilayer system, includes, for forming the reactive multilayer system, at least one surface layer of the bonding substrate is patterned or deposited in patterned fashion with the formation of vertically oriented nanostructures spaced apart from one another, and regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures.

Abstract: A contact arrangement for establishing a spaced, electrically conducting connection between a first wafer and a second wafer includes an electrical connection contact, a passivation layer on the electrical connection contact, and a dielectric spacer layer arranged on the passivation layer, wherein the contact arrangement is arranged at least on one of the first wafer and the second wafer, wherein the contact arrangement comprises trenches at least partly filled with a first material capable of forming a metal-metal connection, wherein the trenches are continuous trenches from the dielectric spacer layer through the passivation layer as far as the electrical connection contact, and wherein the first material is arranged in the trenches from the electrical connection contact as far as the upper edge of the trenches.

Abstract: A functional element package includes a silicon substrate with a functional element having one of a mobile portion and a sensor thereon; a seal member being bonded with the silicon substrate to form an airtightly sealed space therein, and including a step portion in its height direction; a first wiring portion being connected with the functional element and extending from the airtightly sealed space to an outside thereof; a second wiring portion being different from the first wiring portion and extending from the step portion to an upper surface of the seal member; and a bump on the second wiring portion, in which the first wiring portion is bent towards the airtightly sealed space and connected via a photoconductive member with the second wiring portion on the step portion.

Abstract: An electrostatically actuated micro-mechanical switching device with movable elements formed in the bulk of a substrate for closing and releasing at least one Ohmic contact by a horizontal movement of the movable elements in a plane of the substrate. The switching device has a drive with comb-shaped electrodes including fixed driving electrodes and movable electrodes. A movable push rod is mechanically connected with the movable electrodes, extends through the electrodes, has a movable contact element at one side, and at least one restoring spring. A signal line has two parts interrupted by a gap. The micro-mechanical switching device is in shunt-configuration with low loss, high isolation in a wide frequency range, low switching time at low actuation voltage and sufficient reliability. The line impedance of the signal line and its variation is as small as possible. The switching device is in shunt-configuration for closing and releasing the Ohmic contact between a ground line and the signal line.

Abstract: A microstructure has at least one bonding substrate and a reactive multilayer system. The reactive multilayer system has at least one surface layer of the bonding substrate with vertically oriented nanostructures spaced apart from one another. Regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A method for producing at least one bonding substrate and a reactive multilayer system, includes, for forming the reactive multilayer system, at least one surface layer of the bonding substrate is patterned or deposited in patterned fashion with the formation of vertically oriented nanostructures spaced apart from one another, and regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures.

Abstract: A functional element package includes a silicon substrate with a functional element having one of a mobile portion and a sensor thereon; a seal member being bonded with the silicon substrate to form an airtightly sealed space therein, and including a step portion in its height direction; a first wiring portion being connected with the functional element and extending from the airtightly sealed space to an outside thereof; a second wiring portion being different from the first wiring portion and extending from the step portion to an upper surface of the seal member; and a bump on the second wiring portion, in which the first wiring portion is bent towards the airtightly sealed space and connected via a photoconductive member with the second wiring portion on the step portion.