Patents by Inventor Joerg G. APPINGER

Joerg G. APPINGER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer probe alignment
    Patent number: 9977053
    Abstract: A wafer probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: May 22, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Joerg G. Appinger, Eberhard Dengler, Roland Dieterle, Martin Eckert, Gabriele Kuczera, Siegfried Tomaschko, Otto Torreiter, Quintino Lorenzo Trianni
  • Wafer probe alignment
    Patent number: 9927463
    Abstract: A water probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: March 27, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Joerg G. Appinger, Eberhard Dengler, Roland Dieterle, Martin Eckert, Gabriele Kuczera, Siegfried Tomaschko, Otto Torreiter, Quintino Lorenzo Trianni
  • WAFER PROBE ALIGNMENT
    Publication number: 20170108547
    Abstract: A wafer probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.
    Type: Application
    Filed: June 8, 2016
    Publication date: April 20, 2017
    Inventors: Joerg G. APPINGER, Eberhard DENGLER, Roland DIETERLE, Martin ECKERT, Gabriele KUCZERA, Siegfried TOMASCHKO, Otto TORREITER, Quintino Lorenzo TRIANNI
  • WAFER PROBE ALIGNMENT
    Publication number: 20170108534
    Abstract: A water probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.
    Type: Application
    Filed: October 20, 2015
    Publication date: April 20, 2017
    Inventors: Joerg G. APPINGER, Eberhard DENGLER, Roland DIETERLE, Martin ECKERT, Gabriele KUCZERA, Siegfried TOMASCHKO, Otto TORREITER, Quintino Lorenzo TRIANNI