Abstract: A heat dissipating device. The heat dissipating device includes a receiving area open on at least one side, and a mosaic segment, arranged in the receiving area, which includes a thermally conductive and elastic compensation element and a thermally conductive low-adherent contact region. The thermally conductive and elastic compensation element rests against the inner surface of the base of the receiving area. The thermally conductive low-adherent contact region at least partly protrudes out of the receiving area at the open face of the receiving area lying opposite the base. The outer surface of the base of the receiving area forms a rigid first contact surface for a heat source or a heat sink, and the thermally conductive low-adherent contact region of the at least one mosaic segment forms a flexible second contact surface for the heat sink or the source.

Abstract: A method for charging a processing device with a profile strand which is to be fed to the processing device. The processing device, by severing strand portions and connecting the strand portions to a vehicle body, processes to form seals or edge protection strips on the vehicle body. The profile strand is fed in the strand longitudinal direction from a delivery unit used to transport the profile strand to the processing location while being unwound from a winding contained in the delivery unit. The profile strand is either unwound as a right-hand profile, which is to be applied to the vehicle body on the right, beginning with one of the two strand ends, or as a left-hand profile, which is to be applied to the vehicle body on the left, beginning with the other strand end. A delivery unit and a winding holder are provided for carrying out the method.

Abstract: A device for measuring pressure, in particular for measuring high pressure, is provided, having a pressure sensor situated in a sensor housing, the sensor housing having a first sensor housing part provided with a pressure connecting piece and a second sensor housing part provided with an electric terminal. To reduce the manufacturing cost, the second sensor housing part is attached to the first sensor housing part by a connecting part situated between the first sensor housing part and the second sensor housing part, it being possible for the connecting part to be manufactured as a simple punch bent part or thin-walled tubular part, for example.

Abstract: A pressure sensor for measuring the pressure in a space acted upon by high pressure. The signals detected by the pressure sensor are supplied to evaluation electronics. A sensor diaphragm is accommodated on the end of the pressure sensor pointing towards the space acted upon by high pressure. The sensor diaphragm takes the form of a steel diaphragm, to whose back side a thin, metallic layer accommodating piezoresistive measuring elements is applied. The thin, metallic layer is contacted by transmission elements and connected to the evaluation electronics.

Abstract: A device for measuring pressure, in particular for measuring high pressure, is provided, having a pressure sensor situated in a sensor housing, the sensor housing having a first sensor housing part provided with a pressure connecting piece and a second sensor housing part provided with an electric terminal. To reduce the manufacturing cost, the second sensor housing part is attached to the first sensor housing part by a connecting part situated between the first sensor housing part and the second sensor housing part, it being possible for the connecting part to be manufactured as a simple punch bent part or thin-walled tubular part, for example.

Abstract: The present invention relates to a sensor element for detecting pressures or forces. The sensor element (10) includes a sensor diaphragm (13), on the diaphragm outer side (20) of which piezoresistive measuring elements (8) are located. The sensor diaphragm (13) of the sensor element (10) is diametrically opposed to a sealing surface (15, 16) for sealing off the sensor element (10) from a housing. A force introduction region (23, 24) for introducing a force which produces a seal is mechanically decoupled from the sensor diaphragm (13) of the sensor element (10).

Abstract: A pressure sensor for measuring the pressure in a space acted upon by high pressure. The signals detected by the pressure sensor are supplied to evaluation electronics. A sensor diaphragm is accommodated on the end of the pressure sensor pointing towards the space acted upon by high pressure. The sensor diaphragm takes the form of a steel diaphragm, to whose back side a thin, metallic layer accommodating piezoresistive measuring elements is applied. The thin, metallic layer is contacted by transmission elements and connected to the evaluation electronics.

Abstract: A sensor arrangement has a housing, a pressure detector having a measuring diaphragm which is deflectable by a pressurized measurement medium, a sensor circuit attached directly to the measuring diaphragm, an electronic evaluation circuit connected to the sensor circuit and formed as a hybrid circuit, a connector contacted by an element selected from the group consisting of the sensor circuit, the evaluation circuit and both, the hybrid circuit being fastened directly to the measuring diaphragm by a conductive glue which produces electrical connections between the hybrid circuit and the sensor circuit fastened to the measuring diaphragm and produces a ground connection to the housing.

Abstract: The invention relates to a sensor arrangement with a pressure detector (6) that has a measuring diaphragm, which can be deflected by the pressurized measurement medium. A measuring bridge is provided as a sensor circuit, which is attached directly to the measuring diaphragm. An evaluation circuit is embodied as a hybrid circuit (8) and can be fastened directly to the measuring diaphragm, producing electrical connections (9, 10) between the hybrid circuit (8) and the sensor circuit and a ground connection to the housing (2, 3) of the sensor arrangement (1). The housing (2, 3, 4) of the sensor arrangement (1) is embodied as multi-part and the contacting of the connections of the hybrid circuit (8) with connector pins (11) of the connector (4) can be produced, for example, by means of pressure contacts (12, 13; 23).