Patents by Inventor Joerg Hurdelbrink

Joerg Hurdelbrink has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device and method for regulating application of adhesives and/or sealants
    Patent number: 6746712
    Abstract: The present invention pertains to an arrangement for the controlled application of adhesive to substrate. In at least one embodiment, the arrangement comprises a) an adhesive reservoir, b) a pump, c) an applicator head having at least one applicator nozzle, d) a volume throughput sensor, and e) a monitoring unit. The reservoir, the pump, and the applicator head are connected together by a conduit system carrying the adhesive. The volume throughput sensor and the monitoring unit are connected together by a pulse transmission line. The monitoring unit, the feed pump, and the applicator head are connected together by control lines. In at least one embodiment, the application of adhesive to substrates is controlled by measuring the volume throughput of the adhesive, transmitting signals indicative of volume throughout to the monitoring unit, and controlling the amount of adhesive applied to the substrate material in-line in response to the signals.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: June 8, 2004
    Assignee: Henkel Kommanditgesellschaft auf Aktien (Henkel KGaA)
    Inventors: Gunter Hoffmann, Volker Kels, Joerg Hurdelbrink, Richard Scholta, Willi Borst, Roland Heume
  • DEVICE AND METHOD FOR REGULATING APPLICATION OF ADHESIVES AND/OR SEALANTS
    Publication number: 20030148018
    Abstract: The present invention pertains to an arrangement for the controlled application of adhesive to substrate. In at least one embodiment, the arrangement comprises a) an adhesive reservoir, b) a pump, c) an applicator head having at least one applicator nozzle, d) a volume throughput sensor, and e) a monitoring unit. The reservoir, the pump, and the applicator head are connected together by a conduit system carrying the adhesive. The volume throughput sensor and the monitoring unit are connected together by a pulse transmission line. The monitoring unit, the feed pump, and the applicator head are connected together by control lines. In at least one embodiment, the application of adhesive to substrates is controlled by measuring the volume throughput of the adhesive, transmitting signals indicative of volume throughout to the monitoring unit, and controlling the amount of adhesive applied to the substrate material in-line in response to the signals.
    Type: Application
    Filed: December 31, 2002
    Publication date: August 7, 2003
    Inventors: Gunter Hoffmann, Volker Kels, Joerg Hurdelbrink, Richard Scholta, Willi Borst, Roland Heume