Abstract: A system and method includes an infrared camera; a processing unit; and an output unit. The infrared camera is configured to acquire a plurality of infrared images of the device, wherein the plurality of infrared images comprises a first infrared image and a second infrared image acquired a time period after the first infrared image. The processing unit is configured to determine a pixel in the first infrared image with a hottest temperature and determine a pixel in the second infrared image with a hottest temperature. The processing unit is configured to determine a first number of pixels in the first infrared image that have a temperature within a threshold temperature of the hottest temperature of the first infrared image and determine a second number of pixels in the second infrared image that have a temperature within the threshold temperature of the hottest temperature of the second infrared image.

Abstract: A fault detection system and method includes a sensor; a processing unit; and an output unit. The sensor is configured to acquire temperature data at a sensor location of a device, wherein the temperature data comprises first temperature data and second temperature data acquired a first time period after the first temperature data. The processing unit determines a temperature magnitude comprising utilization of the first temperature data and/or the second temperature data, and determines a rate of change of temperature. The processing unit predicts a temperature at a location of the device using the temperature magnitude, the rate of change of temperature, and a correlation, wherein the correlation is a correlation of a plurality of temperature magnitudes and a plurality of rate of change of temperatures at the sensor location with a plurality of hotspot temperatures at the location.

Abstract: A system for monitoring a switchgear includes: an infrared camera for acquiring at least one infrared image of the switchgear; a processing unit for determining a pixel in the at least one infrared image associated with a hottest temperature, determining e pixels in the at least one infrared image associated with a temperature that is within a threshold temperature of the hottest temperature, and determining that a hot spot exists in the switchgear as a determination, the determination being a utilization of the determined pixels in the at least one infrared image; and an output unit for outputting an indication of a fault in the switchgear based on the determined hot spot.

Abstract: A system for monitoring a switchgear includes: an infrared camera for acquiring at least one infrared image of the switchgear; a processing unit for determining a pixel in the at least one infrared image associated with a hottest temperature, determining e pixels in the at least one infrared image associated with a temperature that is within a threshold temperature of the hottest temperature, and determining that a hot spot exists in the switchgear as a determination, the determination being a utilization of the determined pixels in the at least one infrared image; and an output unit for outputting an indication of a fault in the switchgear based on the determined hot spot.

Abstract: A low or medium voltage switchgear monitoring system includes: at least one sensor; a processing unit; and an output unit. The at least one sensor acquires sensor data within a compartment of a switchgear. The sensor data includes first sensor data. The sensor data includes second sensor data. The second sensor data is acquired a set time after the first sensor data. The at least one sensor provides the first sensor data and the second sensor data to the processing unit. The processing unit determines status information for a compartment of the switchgear based on a comparison of the second sensor data to the first sensor data. The output unit outputs the status information.

Abstract: A fault state detection apparatus includes an input unit and a processing unit. The input unit receives condition monitoring data. The processing unit implements a trained machine learning algorithm to analyze the received condition monitoring data to determine if the received condition monitoring data is associated with a fault state. The trained machine learning algorithm was trained on the basis of a plurality of non-fault state condition monitoring data and associated ground truth information and on the basis of a plurality of fault state condition monitoring data and associated ground truth information. A subset of the plurality of fault state condition monitoring data was generated from one or more non-fault state condition monitoring data. Generation of fault state conditioning monitoring data in the subset of the plurality of fault state condition monitoring data comprises a transformation of non-fault state condition monitoring data to fault state condition monitoring data.

Abstract: A system and method includes at least one temperature sensor, a processing unit, and an output unit. The temperature sensor acquires a temperature measurement at a first location of an operational device, which first location is in thermal contact with a second location of the operational device. The processing unit selects a simulated temperature distribution of the first location of a simulated device from a plurality of simulated temperature distributions of the first location and compares the temperature measurement with simulated temperature distributions of the first location, and determines whether a hot spot exists or is developing at the second location. The determination comprises utilization of a correlation between the simulated temperature distribution of the first location and the second location for the selected simulated temperature distribution of the first location of the simulated device.

Abstract: A system and method for monitoring a device includes a temperature sensor, a processing unit, and an output unit. The temperature sensor acquires a temperature measurement during a heat-up phase of a component and provides a temperature measurement to the processing unit, which selects a simulated transient temperature distribution of the simulated component of the simulated device from a plurality of simulated transient temperature distributions of the simulated component of the simulated device. The selection comprises a comparison of the at least one temperature measurement with the plurality of simulated transient temperature distributions at an equivalent time point in the simulated heat-up to a time point at which the temperature measurement was acquired. When a hot spot is developing an output unit outputs an indication of a fault associated with the component.

Abstract: A system for monitoring a switchgear includes multiple infrared cameras with fields of view; a processing unit; and an output unit. The cameras acquire multiple image data of a plurality of phases of the switchgear, and the processing unit determines whether there is a phase imbalance in a specific phase comprising a determination from a plurality of image data that temperature information for a plurality of component parts and/or a plurality of connections for that specific phase has an overall enhanced temperature compared to the temperature information for the same plurality of component parts and/or the same plurality of connections for one or more other phases of the plurality of phases. The output unit is configured to output information that a fault or load imbalance has occurred in a phase.

Abstract: A system and method includes an infrared camera; a processing unit; and an output unit. The infrared camera is configured to acquire a plurality of infrared images of the device, wherein the plurality of infrared images comprises a first infrared image and a second infrared image acquired a time period after the first infrared image. The processing unit is configured to determine a pixel in the first infrared image with a hottest temperature and determine a pixel in the second infrared image with a hottest temperature. The processing unit is configured to determine a first number of pixels in the first infrared image that have a temperature within a threshold temperature of the hottest temperature of the first infrared image and determine a second number of pixels in the second infrared image that have a temperature within the threshold temperature of the hottest temperature of the second infrared image.

Abstract: A fault detection system and method includes a sensor; a processing unit; and an output unit. The sensor is configured to acquire temperature data at a sensor location of a device, wherein the temperature data comprises first temperature data and second temperature data acquired a first time period after the first temperature data. The processing unit determines a temperature magnitude comprising utilization of the first temperature data and/or the second temperature data, and determines a rate of change of temperature. The processing unit predicts a temperature at a location of the device using the temperature magnitude, the rate of change of temperature, and a correlation, wherein the correlation is a correlation of a plurality of temperature magnitudes and a plurality of rate of change of temperatures at the sensor location with a plurality of hotspot temperatures at the location.

Abstract: Aa low or medium voltage switchgear monitoring system includes: at least one sensor; a processing unit; and an output unit. The at least one sensor acquires sensor data within a compartment of a switchgear. The sensor data includes first sensor data. The sensor data includes second sensor data. The second sensor data is acquired a set time after the first sensor data. The at least one sensor provides the first sensor data and the second sensor data to the processing unit. The processing unit determines status information for a compartment of the switchgear based on a comparison of the second sensor data to the first sensor data. The output unit outputs the status information.

Abstract: A system for monitoring a switchgear includes: an infrared camera for acquiring at least one infrared image of the switchgear; a processing unit for determining a pixel in the at least one infrared image associated with a hottest temperature, determining e pixels in the at least one infrared image associated with a temperature that is within a threshold temperature of the hottest temperature, and determining that a hot spot exists in the switchgear as a determination, the determination being a utilization of the determined pixels in the at least one infrared image; and an output unit for outputting an indication of a fault in the switchgear based on the determined hot spot.

Abstract: A rolled film capacitor is disclosed which includes a first dielectric film and a second dielectric film, which are wound along their length dimension to form alternating turns of the winding. A plurality of first conductive segments are arranged on a first surface of the first dielectric film along the length dimension of the first dielectric film, and a plurality of second conductive segments are arranged on a surface of the second dielectric film along the length dimension of the second dielectric film, or on a second surface of the first dielectric film along the length dimension of the first dielectric film. The first conductive segments can have a progressively increasing length along the length dimension of the first dielectric film, and the second conductive segments have a progressively increasing length along the length dimension of the first or second dielectric film. The number of the first and/or second conductive segments per turn of the winding can be equal to or more than one.

Abstract: A rolled film capacitor is disclosed which includes a first dielectric film and a second dielectric film, which are wound along their length dimension to form alternating turns of the winding. A plurality of first conductive segments are arranged on a first surface of the first dielectric film along the length dimension of the first dielectric film, and a plurality of second conductive segments are arranged on a surface of the second dielectric film along the length dimension of the second dielectric film, or on a second surface of the first dielectric film along the length dimension of the first dielectric film. The first conductive segments can have a progressively increasing length along the length dimension of the first dielectric film, and the second conductive segments have a progressively increasing length along the length dimension of the first or second dielectric film. The number of the first and/or second conductive segments per turn of the winding can be equal to or more than one.