Abstract: An optoelectronic semiconductor device is disclosed wherein the device is a vertical-cavity surface-emitting laser or a photodiode containing a section, the top part of which is electrically isolated from the rest of the device. The electric isolation can be realized by etching a set of holes and selective oxidation of AlGaAs layer or layers such that the oxide forms a continuous layer or layers everywhere beneath the top surface of this section. Alternatively, a device can be grown epitaxially on a semi-insulating substrate, and a round trench around a section of the device can be etched down to the semi-insulating substrate thus isolating this section electrically from the rest of the device. Then if top contact pads are deposited on top of the electrically isolated section, the pads have a low capacitance, and a pad capacitance below two hundred femto-Farads, and the total capacitance of the device below three hundred femto-Farads can be reached.

Abstract: An optoelectronic semiconductor device is disclosed wherein the device is a vertical-cavity surface-emitting laser or a photodiode containing a section, the top part of which is electrically isolated from the rest of the device. The electric isolation can be realized by etching a set of holes and selective oxidation of AlGaAs layer or layers such that the oxide forms a continuous layer or layers everywhere beneath the top surface of this section. Alternatively, a device can be grown epitaxially on a semi-insulating substrate, and a round trench around a section of the device can be etched down to the semi-insulating substrate thus isolating this section electrically from the rest of the device. Then if top contact pads are deposited on top of the electrically isolated section, the pads have a low capacitance, and a pad capacitance below two hundred femto-Farads, and the total capacitance of the device below three hundred femto-Farads can be reached.

Abstract: An opto-electronic micro-module includes a monocrystalline substrate having a first surface and a second surface parallel to said first surface, wherein a through hole passes from said first surface through said monocrystalline substrate to said second surface; and an optical substrate having a first portion in said through hole and a second portion protruding from said through hole.

Abstract: An opto-electronic assembly for high speed opto-electronic signal transmission which comprises: mounting plate with a top side; wherein the top side contains at least one area at a higher level and at least one area at a lower level, an electro-optical or opto-electronic transducer component with a number of transducers with the optical port of the transducer component on the top side; a micro-mirror component; an optical transmission path assigned to each transducer wherein the transmission axis of each transmission path is oriented substantially parallel to the surface of the transducer component and to the top side of the mounting plate; and a transducer component that is mounted with the bottom side on the mounting plate below a micro-mirror component that is mounted above the transducer component in such a configuration that the optical transmission path to or from each transducer is reflected at the dedicated mirror surface.

Abstract: An opto-electronic assembly for high speed opto-electronic signal transmission which comprises: mounting plate with a top side; wherein the top side contains at least one area at a higher level and at least one area at a lower level, an electro-optical or opto-electronic transducer component with a number of transducers with the optical port of the transducer component on the top side; a micro-minor component; an optical transmission path assigned to each transducer wherein the transmission axis of each transmission path is oriented substantially parallel to the surface of the transducer component and to the top side of the mounting plate; and a transducer component that is mounted with the bottom side on the mounting plate below a micro-minor component that is mounted above the transducer component in such a configuration that the optical transmission path to or from each transducer is reflected at the dedicated mirror surface.

Abstract: The optoelectronic assembly for high speed signal transmission based on surface-emitting/receiving components is disclosed. The assembly contains a mounting plate with a top side used for the mounting of the components; single or multiple electrooptical or optoelectronic transducer components with the optical ports of the transducer on the top side and a bottom side used for assembly; a micro-mirror component; an optical transmission path wherein the transmission axis is oriented substantially parallel to the surface of the transducer components and to the top side of the mounting plate; and a transducer component mounted with the bottom side on the mounting plate near a micro-mirror component mounted above the transducer component in such a configuration that the optical transmission path to or from the transducer is reflected at the mirror surface such that the transducer is optically coupled to this same transmission path.

Abstract: The optoelectronic assembly for high speed signal transmission based on surface-emitting/receiving components is disclosed. The assembly contains a mounting plate with a top side used for the mounting of the components; single or multiple electrooptical or optoelectronic transducer components with the optical ports of the transducer on the top side and a bottom side used for assembly; a micro-mirror component; an optical transmission path wherein the transmission axis is oriented substantially parallel to the surface of the transducer components and to the top side of the mounting plate; and a transducer component mounted with the bottom side on the mounting plate near a micro-mirror component mounted above the transducer component in such a configuration that the optical transmission path to or from the transducer is reflected at the mirror surface such that the transducer is optically coupled to this same transmission path.

Abstract: The arrangement has at least two electrooptic transducers (1, 2) with in each case one optically active zone (1a, 2a). Optical connections (12, 14) which are assigned to the transducers are adjacent at a spacing (a). Optical coupling paths (8, 9) run via a coupling device (6) between the connections (12, 14) and the respectively assigned optically active zones (1a, 2a) In order in the case of a very tight spacing (a) to permit a favorable crosstalk response and a cost effective design, the coupling paths (8, 9) run in such a way that the spacing (A) between two optically active zones (1a, 2a) is greater than the spacing (a).