Abstract: A method for mounting an electrical component on a substrate is disclosed. According to the method, joining is simplified using a cover, or hood, that includes a contact structure on an inner side of the hood, wherein when the hood is mounted, the contact structure is joined to the underlying structure at different joining levels simultaneously using an additional material. Moreover, a joining pressure, e.g., for diffusion or sintered bonds for electrical contacts, can be applied using such a hood.

Abstract: A method for mounting an electrical component to a substrate may include mounting the component onto the substrate, forming a cover including a thermally softenable or hardenable material and a contacting structure defined by integrated conductor paths, mounting the cover onto a mounting side of the substrate and onto the component mounted on the substrate, such that (a) the cover laterally traverses the component, (b) first contact surfaces of the contacting structure engage with the substrate at a first joining level defined at the mounting side of the substrate, and (c) second contact surfaces of the contacting structure engage with the component at a second joining level at the top side of the component, the second joining level being different than the first joining level. After assembling the components, joining connections at the first and second joining levels may be completed by a temperature or pressure based joining process.

Abstract: A diffusion soldering method for joining an electronic component to a substrate is provided. The joining surfaces are designed such that cavities are formed in a joining gap between the component and substrate. The formation of such cavities can be provided, e.g., by depressions in a mounting surface of the component and/or in a contact surface of the substrate, the depressions being cup-shaped and/or defining channels that surround columnar structural elements, the end faces of which define the mounting surface and/or contact surface. The cavities are designed such that solder material can leak into the cavities when the component during a heating process to achieve a desired width of the joining gap. This allows for the formation of a narrow-width joining having a diffusion zone that bridges the joining gap upon soldering. In this manner, a diffusion solder connection can be produced even using standard solder.

Abstract: A method for mounting an electrical component on a substrate is disclosed. According to the method, joining is simplified using a cover, or hood, that includes a contact structure on an inner side of the hood, wherein when the hood is mounted, the contact structure is joined to the underlying structure at different joining levels simultaneously using an additional material. Moreover, a joining pressure, e.g., for diffusion or sintered bonds for electrical contacts, can be applied using such a hood.

Abstract: A diffusion soldering method for joining an electronic component to a substrate is provided. The joining surfaces are designed such that cavities are formed in a joining gap between the component and substrate. The formation of such cavities can be provided, e.g., by depressions in a mounting surface of the component and/or in a contact surface of the substrate, the depressions being cup-shaped and/or defining channels that surround columnar structural elements, the end faces of which define the mounting surface and/or contact surface. The cavities are designed such that solder material can leak into the cavities when the component during a heating process to achieve a desired width of the joining gap. This allows for the formation of a narrow-width joining having a diffusion zone that bridges the joining gap upon soldering. In this manner, a diffusion solder connection can be produced even using standard solder.