Abstract: A method for mounting an electrical component to a substrate may include mounting the component onto the substrate, forming a cover including a thermally softenable or hardenable material and a contacting structure defined by integrated conductor paths, mounting the cover onto a mounting side of the substrate and onto the component mounted on the substrate, such that (a) the cover laterally traverses the component, (b) first contact surfaces of the contacting structure engage with the substrate at a first joining level defined at the mounting side of the substrate, and (c) second contact surfaces of the contacting structure engage with the component at a second joining level at the top side of the component, the second joining level being different than the first joining level.