Patents by Inventor Joerg Zapf

Joerg Zapf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing an electronic device connected to a printed circuit board
    Patent number: 7340826
    Abstract: A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board with external contacts. The printed circuit board is electrically coupled to the electronic device. At least the metallic surfaces of the configuration are covered by a plasma-polymerized polymer layer.
    Type: Grant
    Filed: December 9, 2004
    Date of Patent: March 11, 2008
    Assignee: Infineon Technologies AG
    Inventors: Harry Hedler, Jörg Zapf
  • Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours
    Patent number: 7208347
    Abstract: A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.
    Type: Grant
    Filed: January 26, 2004
    Date of Patent: April 24, 2007
    Assignee: Siemens Aktiengesellschaft
    Inventors: Norbert Seliger, Karl Weidner, Jörg Zapf
  • Self-supporting contacting structures that are directly produced on components without housings
    Publication number: 20060248716
    Abstract: A self-supporting contacting structure is directly produced on a component that does not have a housing by applying a layer made of non conducting material and a layer made of an electrically conductive material to the component and to a support and by subsequently removing these layers from said support.
    Type: Application
    Filed: January 15, 2004
    Publication date: November 9, 2006
    Inventors: Karl Weidner, Prof. Eckhard Wolfgang, Jörg Zapf
  • Internal connection system for power semiconductors comprising large-area terminals
    Publication number: 20060252253
    Abstract: According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.
    Type: Application
    Filed: January 23, 2004
    Publication date: November 9, 2006
    Inventors: Norbert Seliger, Karl Weidner, Jörg Zapf
  • Economical high-frequency package
    Publication number: 20060162157
    Abstract: A component is connected to a circuit carrier via contacts which place the component at a distance from the circuit carrier. A foil is applied to the component and the circuit carrier so that it lies close to the surface of the circuit carrier on which the component is located and to the sides of the component not facing the circuit carrier. After being applied to the component and the circuit carrier the film is provided with a metal coating.
    Type: Application
    Filed: June 29, 2004
    Publication date: July 27, 2006
    Inventors: Gernot Schimetta, Karl Weidner, Joerg Zapf
  • Detector module and detector for an X-ray computer tomograph
    Publication number: 20050184246
    Abstract: A detector module for an X-ray computer tomograph, includes a number of sensor arrays provided next to one another on a printed circuit board. Each of the sensor arrays includes a plurality of first contact elements on a top side, averted from the printed circuit board. In order to make contact with the sensor array, the first contact elements are electrically connected to second contact elements with the aid of conductor tracks that are accommodated in or on an electrically insulating flexible carrier.
    Type: Application
    Filed: February 10, 2005
    Publication date: August 25, 2005
    Inventors: Ludwig Danzer, Bjoern Heismann, Richard Matz, Heinz Pilz, Stefan Wirth, Joerg Zapf
  • Configuration having an electronic device electrically connected to a printed circuit board
    Patent number: 6852931
    Abstract: A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board with external contacts. The printed circuit board is electrically coupled to the electronic device. At least the metallic surfaces of the configuration are covered by a plasma-polymerized polymer layer.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: February 8, 2005
    Assignee: Infineon Technologies AG
    Inventors: Harry Hedler, Jörg Zapf
  • Sensor array for a capacitance measuring fingerprint sensor, and method for producing such a sensor array
    Patent number: 6481294
    Abstract: A base layer, which is preferably flexible, has first conductor tracks, a first insulation layer, fine structures with first electrodes, second conductor tracks and second electrodes, and finally a second insulation layer applied to it in succession. The first electrodes are connected, via plated-through holes, to associated first conductor tracks. Changes, caused by lines in the skin of a finger pad, in the stray capacitance between adjacent first and second electrodes are evaluated for recording fingerprints.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: November 19, 2002
    Assignee: Infineon Technologies AG
    Inventors: Maximilian Zellner, Jörg Zapf, Peter Demmer