Patents by Inventor Joern Schnapke

Joern Schnapke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for controlling an electrochemical etch process
    Patent number: 7993936
    Abstract: By evaluating a status signal on the basis of a fault detection classification mechanism in an electrochemical etch tool, a corresponding failure status of the tool may be obtained for each single substrate, thereby significantly reducing the risk of significant yield loss compared to conventional strategies. The fault detection and classification mechanism may be advantageously applied to the electrochemical removal of underbump metallization layers during the formation of solder bump structures.
    Type: Grant
    Filed: September 14, 2007
    Date of Patent: August 9, 2011
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Kerstin Siury, Niels Rackwitz, Joern Schnapke, Frank Kuechenmeister
  • SYSTEM AND METHOD FOR CONTROLLING AN ELECTROCHEMICAL ETCH PROCESS
    Publication number: 20080160650
    Abstract: By evaluating a status signal on the basis of a fault detection classification mechanism in an electrochemical etch tool, a corresponding failure status of the tool may be obtained for each single substrate, thereby significantly reducing the risk of significant yield loss compared to conventional strategies. The fault detection and classification mechanism may be advantageously applied to the electrochemical removal of underbump metallization layers during the formation of solder bump structures.
    Type: Application
    Filed: September 14, 2007
    Publication date: July 3, 2008
    Inventors: Kerstin Siury, Niels Rackwitz, Joern Schnapke, Frank Kuechenmeister
  • Method and system for on-line controlling of solder bump deposition
    Publication number: 20060266652
    Abstract: By evaluating a dynamic failure signal, such as a voltage signal and/or a current signal, obtained during an electroplating operation for forming solder bumps, an inline control system with a responsiveness on a substrate basis may be established. Thus, the electroplating tool may be controlled on a single wafer basis to improve process uniformity and also significantly reduce yield loss.
    Type: Application
    Filed: February 3, 2006
    Publication date: November 30, 2006
    Inventors: Andreas Netz, Niels Rackwitz, Joern Schnapke, Frank Kuechenmeister, Norbert Schroeder