Abstract: A die including a die body having a first body surface, a second body surface on an opposite side of the die body as the first body surface, an interconnect region adjacent to the first body surface including interconnect dielectric layers with metal lines and vias, a transistor region above the interconnect region, the metal lines and vias making electrical connections to one or more power rails of the transistor region and electrically connected to transistors of the transistor region, a power region above the transistor region including an electro-conductive film on the second body surface and TSVs in the power region, an outer end of the TSV contacting the film and an embedded end of the TSVs contacting one of the power rails. A method of manufacturing an IC package and computer with the IC package are also disclosed.

Abstract: The present invention relates to stabilising compositions, particularly stabilising compositions which can be used to stabilise elastomeric materials, such as rubbers and/or butadiene based elastomers. The stabilising composition comprises: a first stabilising component comprising at least one phosphite antioxidant; a second stabilising component comprising at least one aminic antioxidant; and a third stabilising component comprising at least one phenolic antioxidant. Also disclosed herein is use of the stabilising composition for stabilising elastomeric materials, a stabilised composition comprising an elastomeric material and the aforementioned stabilising composition and a useful article comprising the stabilising composition.