Abstract: In general, the invention is directed to techniques for forming a seal between parts of an overmold component. The overmold component includes a first part forming one or more thorough-holes and a second part overmolded to the first part. A through-hole may be, for example, a screw hole or an overmold material entrance hole. The through-holes formed by the first part are surrounded by an adhesive prior to overmolding the second part. After overmolding, the adhesive locally bonds the surface of the first part to the overmold part to make a seal around the through holes. For example, the overmold component may combine with a cover to form a housing of a disc drive or other electronic device defining an internal environment. In this example, the adhesive prevents external contaminants from entering the internal environment via the through-holes.

Abstract: Embodiments of the invention are directed to electronic device housings and may be particularly applicable to portable electronic devices. In an embodiment, an assembly comprises a first housing element that forms a first recess, a second housing element that contacts the first housing element, wherein the first recess faces away from the second housing element and the second recess faces towards the first housing element, wherein the first housing element and the second housing element combine to form an enclosure, and an electronic component within the enclosure. Embodiments of the invention increase shielding of electronic components within the housing and also reduce leakage paths through an interface between elements of the housing.