Abstract: Method of making an array of interconnected solar cells, including a) providing a continuous layer stack (1) of a prescribed thickness on a substrate (8), the layer stack (1) including an upper (2) and a lower (3) conductive layer having a photoactive layer (4) and a semiconducting electron transport layer (6) interposed there between; b) selectively removing the upper conductive layer (2) and the photoactive layer (4) for obtaining a contact hole (10) exposing the semiconducting electron transport layer (6); c) selectively heating the layer stack (1) to a first depth (d1) for obtaining a first heat affected zone (12) at a first centre-to-centre distance (s1) from the contact hole (10), the first heat affected zone (12) being transformed into a substantially insulating region with substantially the first depth (d1) in the layer stack, thereby locally providing an increased electrical resistivity to the layer stack (1).

Abstract: A method for transferring an electronic component supported by a carrier to a desired position on a substrate include moving the carrier supporting the component relative to the substrate while the component is present on a side of the carrier facing towards the substrate, with the component is positioned opposite the desired position on the substrate. Then, a light beam is directed at the carrier, at the location of the component, from a side remote from the substrate, as a result of which a connection between the component and the carrier is broken and the component is transferred from the carrier to the substrate.

Abstract: The invention relates to a method and an apparatus for the optical characterisation of a three-dimensional surface. The method and apparatus are an improvement over the known photogoniometer and Parousiameter, as it enables a more reliable characterisation of three-dimensionally shaped surfaces. The technique is particularly useful for the characterisation of surfaces with a complex optical appearance such as the human skin.

Abstract: Method suitable for transferring an electronic component (2??) supported by a carrier (3) to a desired position on a substrate (1). The carrier supporting the component is moved relative to the substrate whilst the component is present on a side of the carrier facing towards the substrate, until the component is positioned opposite the desired position on teh substrate. Then a light beam (4) is directed at the carrier (3), at the location of the component (2??), from a side remote from the substrate, as a result of which a connection between the component and the carrier is broken and the component is transferred from the carrier to the substrate.

Abstract: The invention relates to a method of manufacturing an electronic component (1), in particular a semiconductor component (1), which is provided with electric connection regions (2), wherein a mark (M), such as a type number, is provided on a surface thereof by means of laser radiation (3). In a method according to the invention, the component (1) is attached with one (4) of its sides (4, 7) to a foil (5) by means of an adhesive layer (6), and the component is provided, on said side (4), with the mark (M) through the foil (5) and the adhesive layer (6). In this manner, a large number of components (1) can be readily provided with a mark (M) without undue handling, and the marking operation can be readily integrated in the complete manufacturing process of the components. Surprisingly it has been found that marking through a radiation-absorbing double layer (5, 6) is very well feasible.

Abstract: The invention relates to a method of manufacturing an electronic component (1), in particular a semiconductor component (1), which is provided with electric connection regions (2), wherein a mark (M), such as a type number, is provided on a surface thereof by means of laser radiation (3).

Abstract: A method of providing an encodable layer on a glass object and on the resultant product. Said layer is formed by providing a paste containing glass frit, pigment and a binder, on the hot glass. As a result, the glass frit melts, causing the pigment to adhere to the glass object. The binder, which is used to render the paste spreadable, disappears from the mixture.

Abstract: The invention relates to a method of providing an encodable layer on a glass object and on the resultant product. The layer is formed by providing a paste containing glass frit, pigment and a binder, on the hot glass. As a result, the glass frit melts, causing the pigment to adhere to the glass object. The binder, which is used to render the paste spreadable, disappears from the mixture.

Abstract: A method of producing a surfacial marking (11) on a surface (1b) of a body (1) of transmissive material, whereby use is made of a laser beam (5) having a wavelength .lambda. to which the material is substantially transparent, which method comprises the following steps:(a) providing a layer (3) of assistant material against the surface (1b), which assistant material is absorptive at the wavelength .lambda.;(b) directing the laser beam (5) through the body (1) onto the layer (3), so as to locally heat and ablate the layer (3).

Abstract: A method of selectively removing a metallic layer (3) from a non-metallic substrate (1) includes the steps of arranging for the metallic layer (3) to be overlaid by a coating (7) of Sn-rich metallic material, and directing a laser beam of wavelength .lambda. onto a selected area (5') of the coating (7), .lambda. being chosen to lie in the range 450-650 nm, thereby causing localized heating of the coating (7) in this area (5') and consequent ablative removal of the underlying portion of the metallic layer (3). The method is particularly useful in the manufacture of printed circuit boards.