Patents by Inventor Johan de Beer

Johan de Beer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS OF ATTACHING ELECTRONIC COMPONENTS
    Publication number: 20160005710
    Abstract: A method of attaching an electronic component to a metal substrate, wherein the electronic component comprises solder provided on an exposed solder region. The method comprising: forming a metal-based compound layer on the substrate; placing the electronic component on the metal substrate such that the solder region is in contact with a contact region of the metal-based compound layer; and heating the solder region such that the contact region of the metal-based compound layer dissolves and the solder region forms an electrical connection between the electronic component and the metal substrate. The metal-based compound layer can have a minimum thickness of 10 nm.
    Type: Application
    Filed: June 2, 2015
    Publication date: January 7, 2016
    Inventors: Sven Walczyk, Johan de Beer, Erik Eltink, Amar Mavinkurve