Abstract: An illumination system, an inspection tool and a method for inspecting an object are disclosed. A configurable area light source is arranged in an illumination optical axis of an illumination beam path, wherein the configurable area light source is configured such that different beam diameters are settable. At least one illumination lens is positioned in the illumination beam path for directing a collimated beam at least onto a field of view on a surface of the object, wherein a value of an angle of incidence of the illumination optical axis of the illumination beam path equals a value of an angle of reflectance of the imaging optical axis of the imaging beam path. The invention allows the combination of the functionality of a wide angle coaxial illumination and a collimated coaxial illumination in one illumination system.

Abstract: An illumination system, an inspection tool and a method for inspecting an object are disclosed. A configurable area light source is arranged in an illumination optical axis of an illumination beam path, wherein the configurable area light source is configured such that different beam diameters are settable. At least one illumination lens is positioned in the illumination beam path for directing a collimated beam at least onto a field of view on a surface of the object, wherein a value of an angle of incidence of the illumination optical axis of the illumination beam path equals a value of an angle of reflectance of the imaging optical axis of the imaging beam path. The invention allows the combination of the functionality of a wide angle coaxial illumination and a collimated coaxial illumination in one illumination system.

Abstract: A method for estimating the efficiency of a solar cell to be manufactured from a wafer is disclosed, wherein the efficiency estimate is obtained from a density of crystallite boundaries on a surface of the wafer. In embodiments the density of crystallite boundaries is obtained from a digital image of the surface of the wafer, from which first a filtered image, and then a binary image is generated. The binary image is evaluated to obtain the density of crystallite boundaries. Alternatively, the efficiency estimate is obtained from the sizes of crystallites on the surface of the wafer. An apparatus for obtaining the efficiency estimate is also disclosed.

Abstract: The present invention is directed to a method for detecting anomalies in a semiconductor substrate comprising the steps of providing a semiconductor substrate, making an inspection image I of the substrate, generating an image K from image I by image processing, generating image B by binarizing image K, and examining image I using image B, characterized in that generating image K comprises multiplying a high-pass convolution filtered image G(I) from image I and a first weight image W1. The present invention is also directed to an apparatus suitable for applying the method.

Abstract: A system for characterizing interruption defect induced efficiency loss in a photovoltaic cell includes an inspection system configured to acquire inspection data from a photovoltaic cell, a control system configured to: receive the inspection data acquired from the photovoltaic cell, identify one or more interruption defects in one or more fingers of an electrode of the one photovoltaic cell utilizing the inspection data, determine a spatial parameter associated with at least one of the identified interruption defects and one or more floating finger portions of the one or more fingers created by two or more identified interruption defects, determine an interruption-defect-induced efficiency loss of the photovoltaic cell based on the determined spatial parameter associated with the at least one of the identified interruption defects and the floating finger portions of the one or more fingers created by two or more identified interruption defects.

Abstract: The present invention is directed to a method for detecting anomalies in a semiconductor substrate comprising the steps of providing a semiconductor substrate, making an inspection image I of the substrate, generating an image K from image I by image processing, generating image B by binarizing image K, and examining image I using image B, characterized in that generating image K comprises multiplying a high-pass convolution filtered image G(I) from image I and a first weight image W1. The present invention is also directed to an apparatus suitable for applying the method.