Patents by Inventor Johan Grundtvig

Johan Grundtvig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEADPHONE SEALING CUP
    Publication number: 20230328424
    Abstract: An earcup for a headphone, comprising at least one earcup comprising a front opening adapted to be adjacent to the ear of a user of the headphone, a baffle disposed within the earcup to define front and rear cavities, an outer cup arranged to accommodate the rear cavities, a first inner cup arranged within the rear cavity surrounding the front opening, a transducer and an earpad extending around the periphery of the front opening of the earcup arranged to accommodate the front cavity and the ear of the user, and wherein the earcup comprises a second inner cup arranged between the outer cup and the back-volume cup for providing an acoustic barrier between outside noise and the ear of the user.
    Type: Application
    Filed: April 26, 2023
    Publication date: October 12, 2023
    Inventors: Anders Røser HANSEN, Peter Vestergaard VÆRUM, Klaus Sommer IPSEN, Johan GRUNDTVIG, Morten Hessilt KJÆR, Giovanni FERRANTI
  • Headphone sealing cup
    Patent number: 11678104
    Abstract: An earcup for a headphone, comprising at least one earcup comprising a front opening adapted to be adjacent to the ear of a user of the headphone, a baffle disposed within the earcup to define front and rear cavities, an outer cup arranged to accommodate the rear cavities, a first inner cup arranged within the rear cavity surrounding the front opening, a transducer and an earpad extending around the periphery of the front opening of the earcup arranged to accommodate the front cavity and the ear of the user, and wherein the earcup comprises a second inner cup arranged between the outer cup and the back-volume cup for providing an acoustic barrier between outside noise and the ear of the user.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: June 13, 2023
    Assignee: EPOS Group A/S
    Inventors: Anders Røser Hansen, Peter Vestergaard Værum, Klaus Sommer Ipsen, Johan Grundtvig, Morten Hessilt Kjær, Giovanni Ferranti
  • HEADPHONE SEALING CUP
    Publication number: 20220103931
    Abstract: An earcup for a headphone, comprising at least one earcup comprising a front opening adapted to be adjacent to the ear of a user of the headphone, a baffle disposed within the earcup to define front and rear cavities, an outer cup arranged to accommodate the rear cavities, a first inner cup arranged within the rear cavity surrounding the front opening, a transducer and an earpad extending around the periphery of the front opening of the earcup arranged to accommodate the front cavity and the ear of the user, and wherein the earcup comprises a second inner cup arranged between the outer cup and the back-volume cup for providing an acoustic barrier between outside noise and the ear of the user.
    Type: Application
    Filed: September 29, 2021
    Publication date: March 31, 2022
    Applicant: EPOS Group A/S
    Inventors: Anders Røser Hansen, Peter Vestergaard Værum, Klaus Sommer Ipsen, Johan Grundtvig, Morten Hessilt Kjær, Giovanni Ferranti