Abstract: X-ray sources including an electron source, an adjustment means for adjusting an orientation of the electron beam generated by the electron source, a focusing means configured to focus the electron beam in accordance with a focusing setting, a beam orientation sensor arranged to generate a signal indicating an orientation of the electron beam relative to a target position, and a controller that is operably connected to the focusing means, the beam orientation sensor and the adjustment means. Also, X-ray sources including a target orientation sensor and a target adjustment means, wherein the controller is configured to cause the beam adjustment means and/or target adjustment means to adjust the relative orientation between the electron beam and the target.

Abstract: X-ray sources including an electron source, an adjustment means for adjusting an orientation of the electron beam generated by the electron source, a focusing means configured to focus the electron beam in accordance with a focusing setting, a beam orientation sensor arranged to generate a signal indicating an orientation of the electron beam relative to a target position, and a controller that is operably connected to the focusing means, the beam orientation sensor and the adjustment means. Also, X-ray sources including a target orientation sensor and a target adjustment means, wherein the controller is configured to cause the beam adjustment means and/or target adjustment means to adjust the relative orientation between the electron beam and the target.

Abstract: X-ray sources including an electron source, an adjustment means for adjusting an orientation of the electron beam generated by the electron source, a focusing means configured to focus the electron beam in accordance with a focusing setting, a beam orientation sensor arranged to generate a signal indicating an orientation of the electron beam relative to a target position, and a controller that is operably connected to the focusing means, the beam orientation sensor and the adjustment means. Also, X-ray sources including a target orientation sensor and a target adjustment means, wherein the controller is configured to cause the beam adjustment means and/or target adjustment means to adjust the relative orientation between the electron beam and the target.

Abstract: A jetting apparatus for jetting droplets of viscous medium onto a substrate and a method of improving the performance of the jetting apparatus are provided. The jetting apparatus includes a jetting outlet through which the droplets are jetted, a flow generator for producing a flow of air past the jetting outlet for removing viscous medium residue at the jetting outlet, a receptacle for receiving viscous medium residue transported by the air flow away from the jetting outlet, and a flow path for the air flow between the jetting outlet and the flow generator, via the receptacle. A flow sensor is arranged in the flow path for measuring the air flow. An air flow signal representative of the air flow is obtained, the air flow signal is evaluated for determining at least one status of the jetting apparatus, and an indication of the status is provided.

Abstract: A method and a system for jetting droplets of viscous medium, such as solder paste, onto a substrate, such as an electronic circuit board. The volume of the droplets are adjusted by regulating the amount of viscous medium that is fed into a jetting nozzle for subsequent jetting of the viscous medium droplets therefrom. The exit velocity of the jetted droplets is adjusted or maintained substantially constant by regulating the velocity with which the viscous medium is impacted. Furthermore, the rate at which viscous medium is fed, for instance by a feed screw, into the nozzle is adjusted in order to regulate the feeding time required for feeding the viscous medium into the jetting nozzle, for instance in order to maintain a constant feeding time.

Abstract: A method and a system for jetting droplets of viscous medium, such as solder paste, onto a substrate, such as an electronic circuit board. The volume of the droplets are adjusted by regulating the amount of viscous medium that is fed into a jetting nozzle for subsequent jetting of the viscous medium droplets therefrom. The exit velocity of the jetted droplets is adjusted or maintained substantially constant by regulating the velocity with which the viscous medium is impacted. Furthermore, the rate at which viscous medium is fed, for instance by a feed screw, into the nozzle is adjusted in order to regulate the feeding time required for feeding the viscous medium into the jetting nozzle, for instance in order to maintain a constant feeding time.

Abstract: A method and a system for jetting droplets of viscous medium, such as solder paste, onto a substrate, such as an electronic circuit board. The volume of the droplets are adjusted by regulating the amount of viscous medium that is fed into a jetting nozzle for subsequent jetting of the viscous medium droplets therefrom. The exit velocity of the jetted droplets is adjusted or maintained substantially constant by regulating the velocity with which the viscous medium is impacted. Furthermore, the rate at which viscous medium is fed, for instance by a feed screw, into the nozzle is adjusted in order to regulate the feeding time required for feeding the viscous medium into the jetting nozzle, for instance in order to maintain a constant feeding time.

Abstract: The present invention is generally related to a jetting device for jetting droplets of viscous medium onto a substrate, said jetting device comprising an ejector element for performing the jetting process and a jetting outlet through which said droplets are jetted. In particular, the invention is related to a method, a measuring device, a jetting device, and a viscous medium container for use in such a jetting device for measuring or monitoring a level or volume of viscous medium during a jetting process and/or measuring electrical properties of the viscous medium to determine characteristics of the medium.

Abstract: A jetting apparatus (15) for jetting droplets of viscous medium onto a substrate and a method of improving the performance of the jetting apparatus. The jetting apparatus (15) includes a jetting outlet (27) through which the droplets are jetted, a flow generator for producing a flow of air past the jetting outlet for removing viscous medium residue at the jetting outlet (27), a receptacle (55) for receiving viscous medium residue transported by the air flow away from the jetting outlet (27), and a flow path (58) for the air flow between the jetting outlet (27) and the flow generator, via the receptacle. A flow sensor (70) is arranged in the flow path (58) for measuring the air flow. An air flow signal representative of the air flow is obtained, the air flow signal is evaluated for determining at least one status of the jetting apparatus (15), and an indication of the status is provided.

Abstract: A jetting device and a method of jetting droplets of viscous medium onto a substrate. The jetting device includes a jetting outlet through which the droplets are jetted. The jetting device further includes a wall located at the jetting outlet, downstream of the jetting outlet seen in the jetting direction. The wall is provided with an orifice through which jetted droplets are permitted to pass through. A gaseous flow is provided within the space past the jetting outlet such that an adverse effect on the performance of the jetting device is prevented, the adverse effect resulting from the accumulation of viscous medium residue at the jetting outlet.

Abstract: This invention relates to a device for jetting droplets of a particle filled viscous medium. The device has a nozzle, an eject mechanism connected to the nozzle, a medium feeding mechanism connected to the eject mechanism, a particle filled viscous medium container connected to the medium feeding mechanism, and a filter arranged between an outlet of the particle filled viscous medium container and the medium feeding mechanism.

Abstract: System, jetting assembly and method for jetting viscous medium onto a substrate. The system comprises a plurality of ejector devices for jetting individual droplets of viscous medium onto the substrate, a plurality of viscous medium containers for holding and providing the viscous medium to be jetted, at least one holder for holding containers and ejector devices in a jetting machine, and a jetting machine.

Abstract: A method and a system for jetting droplets of viscous medium, such as solder paste, onto a substrate, such as an electronic circuit board. The volume of the droplets are adjusted by regulating the amount of viscous medium that is fed into a jetting nozzle for subsequent jetting of the viscous medium droplets therefrom. The exit velocity of the jetted droplets is adjusted or maintained substantially constant by regulating the velocity with which the viscous medium is impacted. Furthermore, the rate at which viscous medium is fed, for instance by a feed screw, into the nozzle is adjusted in order to regulate the feeding time required for feeding the viscous medium into the jetting nozzle, for instance in order to maintain a constant feeding time.

Abstract: This invention relates to a device for jetting droplets of a particle filled viscous medium. The device has a nozzle, an eject mechanism connected to the nozzle, a medium feeding mechanism connected to the eject mechanism, a particle filled viscous medium container connected to the medium feeding mechanism, and a filter arranged between an outlet of the particle filled viscous medium container and the medium feeding mechanism.

Abstract: A jetting device and a method of jetting droplets of viscous medium onto a substrate. The jetting device includes a jetting outlet through which the droplets are jetted. The jetting device further includes a wall located at the jetting outlet, downstream of the jetting outlet seen in the jetting direction. The wall is provided with an orifice through which jetted droplets are permitted to pass through. A gaseous flow is provided within the space past the jetting outlet such that an adverse effect on the performance of the jetting device is prevented, the adverse effect resulting from the accumulation of viscous medium residue at the jetting outlet.

Abstract: An assembly for jetting droplets of a viscous medium. The assembly is releasably mountable in a machine using the assembly for providing a substrate with deposits. The assembly comprises an assembly holder having first holding means mating with an assembly support of a docking device of the machine, a nozzle, an eject mechanism connected to the nozzle, a viscous medium container connected to the eject mechanism, and signal interface means. Thus, the assembly is to be regarded as a separate, exchangeable unit.

Abstract: An assembly for dispensing droplets of a viscous medium. The assembly is releasably mountable in a machine using the assembly for providing a substrate with deposits. The assembly comprises an assembly holder having first holding portions mating with an assembly support of a docking device of the machine, a nozzle, an eject mechanism connected to the nozzle, a viscous medium container connected to the eject mechanism, an assembly property element holding information about properties of the assembly, and signal interface. Thus, the assembly is to be regarded as a separate, exchangeable unit.

Abstract: In a device for ejecting small amounts of a liquid material having accurately defined volumes from a chamber (1), the chamber has a nozzle aperture (7) and a rod (9) is mounted in or attached to a wall of the chamber (1), so that an end surface (11) of the rod is located opposite and at a small distance of the nozzle aperture (7). A driving device is coupled to the rod (9) for displacing the end surface (11) forwards and backwards inside the chamber with a very small stroke, with a high acceleration and a large force, so that a pressure wave is formed and propagates in the material in the chamber (1). The pressure wave then ejects material out of the nozzle aperture (7).

Abstract: The present invention refers to a method and a device for jetting droplets of a viscous medium onto an electronic circuit board. According to the invention, the viscous medium is applied from a viscous medium supply container to an eject chamber through a tubular passage using a rotatable feed screw arranged within the tubular passage. The viscous medium is then jetted from the eject chamber through an eject nozzle by the rapid decreasing of the volume of the chamber.

Abstract: An assembly for jetting droplets of a viscous medium. The assembly is releasably mountable in a machine using the assembly for providing a substrate with deposits. The assembly comprises an assembly holder having first holding means mating with an assembly support of a docking device of the machine, a nozzle, an eject mechanism connected to the nozzle, a viscous medium container connected to the eject mechanism, and signal interface means. Thus, the assembly is to be regarded as a separate, exchangeable unit.