Patents by Inventor Johan Maier

Johan Maier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package, method for producing a package and a device for producing a package
    Publication number: 20060038286
    Abstract: The invention relates to a package or package raw material comprising an electrically conductive layer arranged on a base material and a chip connected to the electrically conductive layer, the electrically conductive layer being configured as an antenna element for transferring data and/or energy, wherein the electrically conductive layer comprises a non-conductive portion. Further, the invention relates to a method for producing a package and a device for producing a package.
    Type: Application
    Filed: August 15, 2005
    Publication date: February 23, 2006
    Inventors: Johan Maier, Karl Kronegger, Gottfried Reiter, Harald Kraushaar