Abstract: Method for applying liquid varnish coating over raised conductor pattern of a printed circuit board. The circuit board is passed through nip rolls at least one of which has a coating of liquid varnish thereon. The thickness of the coating on the nip roll is adjusted to between 5 and 100 .mu.m by adjusting the thickness of liquid varnish on an applicator roll in contact with the nip roll. The flow of liquid varnish applied to the applicator roll is at least 1.5 times the rate of transfer from the nip rolls to the circuit board.

Abstract: A metal article is coated on and at an edge thereof where at least two planar surfaces meet. The coating is carried out by initially coating the article at least partially at and on the edge, one surface at the edge is freed from coating in a mechanical way or an edge and a surface free from coating is prepared simultaneously in a mechanical way, as e.g. cutting off or sawing off part of the article. The exposed metal surface is then etched to form protecting coating projections and the etched surface is selectively coated. The article obtained has excellent and uniform resistant properties all over its surfaces.