Abstract: The invention relates to a process for manufacturing a sputter target. The process comprises the steps of—providing a target holder (12); —applying an intermediate layer (14) on said target holder; —applying a top layer (16) on top of said intermediate layer; said top layer comprising a material having a melting point which is substantially higher than the melting point of said target material; —heating the target holder coated with said intermediate layer and said top layer.

Abstract: A process for the preparation of a sputtering target which comprises sub-stoichiometric titanium dioxide, TiOx, where x is below 2, having an electrical resistivity of less than 0.5 ohm.cm, optionally together with niobium oxide, which process comprises plasma spraying titanium dioxide, TiO2, optionally together with niobium oxide, onto a target base in an atmosphere which is oxygen deficient and which does not contain oxygen-containing compounds, the target vase being coated with TiOx which is solidified by cooling under conditions which prevent the sub-stiochiometric titanium dioxide from combining with oxygen.

Abstract: The invention relates to a process for manufacturing a sputter target. The process comprises the steps of—providing a target holder (12);—applying an intermediate layer (14) on said target holder;—applying a top layer (16) on top of said intermediate layer; said top layer comprising a material having a melting point which is substantially higher than the melting point of said target material;—heating the target holder coated with said intermediate layer and said top layer.

Abstract: The invention relates to a sputter target and more particularly to a zinc sputter target. The target comprises a target holder having an outer surface and a target material formed on said outer surface. The target material has a relative density higher than 92% of the theoretical density of the metal or metal alloy. Furthermore the invention relates to a process for the manufacturing of a sputter target.

Abstract: A sputtering target may include: a) a backing adapted to be operatively connected to a sputter power source; and b) an outer layer of a sputterable material carried by the backing, the sputterable material including a mixture of zinc and a second metal having a melting point less than that of the zinc, the zinc and the second metal being present in the sputterable material in metallic form and arranged as discrete volumes of the second metal in a matrix of zinc so that the zinc and the second metal are present in the sputterable material in a substantially non-alloyed form.

Abstract: An assembly comprising a permeable medium and a frame is provided. The permeable medium comprises a sintered fleece comprising metal fibers. A leak-proof seal between the permeable medium and the frame is assured by spraying a ceramic or metallic layer onto the junction permeable medium/frame. The assembly is in particular suitable to be used as filter element.

Abstract: A target for use in sputtering may include a backing adapted to be operatively connected to a sputtering power source and an outer layer of a sputterable material carried by the backing The sputterable material comprises a mixture of zinc and a second metal having a melting point less than that of the zinc. The zinc and the second metal are present in the sputterable material in metallic form and are arranged as discrete volumes of the second metal in a matrix of zinc. This target may be manufactured by simultaneously plasma spraying zinc metal and the second metal onto a backing to create an outer layer of a sputterable material carried by the backing. The target may be used by placing the target and a substrate in a sputtering chamber and applying power to the target while maintaining in the sputtering chamber a reactive atmosphere comprising oxygen, thereby depositing on a surface of the substrate a film comprising oxides of zinc and the second metal.

Abstract: Material utilization and process stability for a rotating cylindrical magnetron target used in a sputtering system are improved by incorporation of a second magnet structure or “race track”, allowing the power density on the target surface to be reduced by approximately 50% for any given point where magnetic confinement of the plasma exists. Offsetting one race track relative to the other along the longitudinal axis of the target reduces the power density at each turn-around area (relative to the longitudinal area). Modestly increasing the target material thickness at the ends of the target allows nearly all of the material between the turn-around areas to be sputtered.

Abstract: This invention is relating to a sputter cathode (1) with a layer of material that is applied to a substrate by sputtering, wherein this layer (3) contains low electrical conductivity particles (3a) of which a certain quantity are at least coated by a film (3b) of electrically conductive material, or which form an aggregate with a conductive material, so as to give this layer (3) sufficient electrical conductivity to be able to be applied to the substrate by means of sputtering.

Abstract: An apparatus to releasably affix a rotating cylindrical magnetron target to a spindle utilizes a threaded spindle collar engaging threads on the outside surface of the target, with a single water-to-vacuum seal located at the target and spindle interface. The threads may be removable from the target, enabling efficient assembly/disassembly and recycling.

Abstract: A sound- and/or vibration-damping coating, which comprises a layer of a relatively hard substance (2) having pores, interstices, cavities (3) and/or hollows (12) containing a material (4) which has a higher plasticity or elasticity than said substance (2), and an element provided with said coating. This coating may be applied on said element by applying to the surface of the latter a surface treatment ensuring the adhesion of the layer of relatively hard substance (2), by applying this layer to the so treated surface by projection of said substance in the at least molten state and as droplets, by using known per se techniques, and by entering said material (4) into cavities (3) formed between coagulated droplets of said substance (2).