Patents by Inventor Johan Vanvoorden

Johan Vanvoorden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9006342
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than ?20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Grant
    Filed: December 5, 2012
    Date of Patent: April 14, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Jozef J. Van Dun, Patrick J. C. Schouterden, Kalyan Sehanobish, Peter F. van den Berghen, Noorallah Jivraj, Johan Vanvoorden, Ruddy A. J. Nicasy, Ravindra S. Dixit, Frederik E. Gemoets
  • Patent number: 8338538
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than ?20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: December 25, 2012
    Assignee: Dow Global Technologies LLC
    Inventors: Jozef J. Van Dun, Patrick J. C. Schouterden, Kalyan Sehanobish, Peter F. van den Berghen, Noorallah Jivraj, Johan Vanvoorden, Ruddy A. J. Nicasy, Ravindra S. Dixit, Frederick E. Gemoets
  • Publication number: 20100317798
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than ?20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Application
    Filed: August 23, 2010
    Publication date: December 16, 2010
    Applicant: Dow Global Technologies Inc.
    Inventors: Jozef J. VanDun, Peter F.M. van den Berghe, Patrick J. Schouterden, Ruddy Nicasy, Johan Vanvoorden, Frederik E.I. Gemoets, Kalyan Sehanobish, Noorallah Jivraj, Ravi S. Dixit
  • Patent number: 7825190
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than ?20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: November 2, 2010
    Assignee: Dow Global Technologies
    Inventors: Jozef J. Van Dun, Patrick J. C. Schouterden, Kalyan Sehanobish, Peter F. van den Berghen, Noorallah Jivraj, Johan Vanvoorden, Ruddy A. J. Nicasy, Ravi S. Dixit, Frederik E. Gemoets
  • Publication number: 20080161497
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than ?20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Application
    Filed: January 11, 2008
    Publication date: July 3, 2008
    Applicant: Dow Global Technologies Inc.
    Inventors: Jozef J. Van Dun, Patrick J. Schouterden, Kalyan Sehanobish, Peter F.M. van den Berghe, Noorallah Jivraj, Johan Vanvoorden, Ruddy Nicasy, Ravi S. Dixit, Frederik E.L. Gemoets
  • Patent number: 7345113
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution, methods for making the same, and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: March 18, 2008
    Assignee: Dow Global Technologies Inc.
    Inventors: Jozef J. Van Dun, Patrick J. C. Schouterden, Kalyan Sehanobish, Peter F. van den Berghen, Noorallah Jivraj, Johan Vanvoorden, Ruddy A. J. Nicasy, Ravi S. Dixit, Frederik E. Gemoets
  • Publication number: 20070021567
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution, methods for making the same, and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 25, 2007
    Applicant: Dow Global Technologies Inc.
    Inventors: Jozef Van Dun, Peter van den Berghe, Patrick Schouterden, Ruddy Nicasy, Johan Vanvoorden, Frederik Gemoets, Kalyan Sehanobish, Noorallah Jivraj, Ravi Dixit
  • Patent number: 7129296
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (LMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Grant
    Filed: April 2, 2004
    Date of Patent: October 31, 2006
    Assignee: Dow Global Technologies Inc.
    Inventors: Jozef J. Van Dun, Patrick J. Schouterden, Kalyan Sehanobish, Peter F. M. van den Berghen, Noorallah Jivraj, Ruddy Nicasy, Johan Vanvoorden, Ravi S. Dixit, Frederik E. Gemoets
  • Publication number: 20040198911
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Application
    Filed: April 2, 2004
    Publication date: October 7, 2004
    Inventors: Jozef J. Van Dun, Patrick J. Schouterden, Kalyan Sehanobish, Peter F. M. van den Berghen, Noorallah Jivraj, Ruddy Nicasy, Johan Vanvoorden, Ravi S. Dixit, Frederik E. Gemoets
  • Publication number: 20030149180
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than −20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Application
    Filed: August 16, 2002
    Publication date: August 7, 2003
    Applicant: Dow Global Technologies Inc.
    Inventors: Jozef J. Van Dun, Patrick J. Schouterden, Kalyan Sehanobish, Peter F.M. van den Berghe, Noorallah Jivraj, Johan Vanvoorden, Ravi S. Dixit, Ruddy Nicasy, Frederik E.L. Gemoets