Abstract: In a chuck (1) for a wafer (8), on the top of the disk (2) of the chuck (1), a ceramic plate (6) is placed that with an annular elevation (7) that projects upward defines the region in which the wafer (8) will be placed. To place and lift the wafer (8) off the plate (6), there are lifting pins (12) that can be moved in the sleeves (11) of the chuck (1). To prevent the plate (6) on the top (5) of the chuck (1) from being raised and to prevent process media from being able to penetrate between the disk (2) of the chuck (1) and the plate (6), the sleeves (6) in which the lifting pins (12) are guided are connected to the plate (6), so that the latter is always held in tight contact with the disk (2) of the chuck (1).