Abstract: A base module of an electronic device is adapted to provide a basic functionality, wherein the base module comprises a connection device for electrically contacting the base module, and wherein the connection device is adapted to establish an electrical connection between the base module and an extension module for functional extension of the base module, so that the base module may be electrically contacted through the extension module. Furthermore, an extension module and an electronic device with extended functionality are proposed.

Abstract: A power electronics module includes a substrate with a substrate metallization layer, which is separated into conducting areas for providing conducting paths for the power electronics module; a semiconductor switch chip bonded with a first power electrode to a first conducting area of the substrate metallization layer; a conductor plate bonded to a second power electrode of the semiconductor switch chip opposite to the first power electrode.

Abstract: A base module of an electronic device is adapted to provide a basic functionality, wherein the base module comprises a connection device for electrically contacting the base module, and wherein the connection device is adapted to establish an electrical connection between the base module and an extension module for functional extension of the base module, so that the base module may be electrically contacted through the extension module. Furthermore, an extension module and an electronic device with extended functionality are proposed.

Abstract: A power semiconductor module, including a housing; a power semiconductor chip within the housing; power terminals protruding from the housing and electrically interconnected with power electrodes of the semiconductor chip; and auxiliary terminals protruding from the housing and electrically interconnected with a gate electrode and one of the power electrodes; wherein three auxiliary terminals are arranged in a coaxial auxiliary terminal arrangement, which comprises an inner and two outer auxiliary terminals, which are arranged on opposing sides of the inner auxiliary terminal. The inner auxiliary terminal is electrically interconnected with the gate electrode or one of the power electrodes and the two outer auxiliary terminals are electrically connected with the other one of the gate electrode and the one of the power electrodes.

Abstract: A power electronics module includes a substrate with a substrate metallization layer, which is separated into conducting areas for providing conducting paths for the power electronics module; a semiconductor switch chip bonded with a first power electrode to a first conducting area of the substrate metallization layer; a conductor plate bonded to a second power electrode of the semiconductor switch chip opposite to the first power electrode.

Abstract: A circuit arrangement for an electronic device having at least two semiconductor elements of the same type connected in parallel with each other. At least one first semiconductor element has a first characteristic and at least one second semiconductor element has a second characteristic. Each of the two characteristics is defined by at least one power loss. The at least one power loss of the at least one first semiconductor element has a first value, and the at least one power loss of the at least one second semiconductor element has a second value. The two values of the at least one power loss are different.

Abstract: A power semiconductor module, including a housing; a power semiconductor chip within the housing; power terminals protruding from the housing and electrically interconnected with power electrodes of the semiconductor chip; and auxiliary terminals protruding from the housing and electrically interconnected with a gate electrode and one of the power electrodes; wherein three auxiliary terminals are arranged in a coaxial auxiliary terminal arrangement, which comprises an inner and two outer auxiliary terminals, which are arranged on opposing sides of the inner auxiliary terminal. The inner auxiliary terminal is electrically interconnected with the gate electrode or one of the power electrodes and the two outer auxiliary terminals are electrically connected with the other one of the gate electrode and the one of the power electrodes.

Abstract: A circuit arrangement for an electronic device having at least two semiconductor elements of the same type connected in parallel with each other. At least one first semiconductor element has a first characteristic and at least one second semiconductor element has a second characteristic. Each of the two characteristics is defined by at least one power loss. The at least one power loss of the at least one first semiconductor element has a first value, and the at least one power loss of the at least one second semiconductor element has a second value. The two values of the at least one power loss are different.