Patents by Inventor Johann ASAM

Johann ASAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11183489
    Abstract: A power electronics module includes a substrate with a substrate metallization layer, which is separated into conducting areas for providing conducting paths for the power electronics module; a semiconductor switch chip bonded with a first power electrode to a first conducting area of the substrate metallization layer; a conductor plate bonded to a second power electrode of the semiconductor switch chip opposite to the first power electrode.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: November 23, 2021
    Assignee: AUDI AG
    Inventors: Andreas Apelsmeier, Johann Asam
  • Publication number: 20210278071
    Abstract: A base module of an electronic device is adapted to provide a basic functionality, wherein the base module comprises a connection device for electrically contacting the base module, and wherein the connection device is adapted to establish an electrical connection between the base module and an extension module for functional extension of the base module, so that the base module may be electrically contacted through the extension module. Furthermore, an extension module and an electronic device with extended functionality are proposed.
    Type: Application
    Filed: March 3, 2021
    Publication date: September 9, 2021
    Inventors: Dominik TIEFEL, Michael KOCH, Johann ASAM, Lambert FRYE
  • Patent number: 11018109
    Abstract: A power semiconductor module, including a housing; a power semiconductor chip within the housing; power terminals protruding from the housing and electrically interconnected with power electrodes of the semiconductor chip; and auxiliary terminals protruding from the housing and electrically interconnected with a gate electrode and one of the power electrodes; wherein three auxiliary terminals are arranged in a coaxial auxiliary terminal arrangement, which comprises an inner and two outer auxiliary terminals, which are arranged on opposing sides of the inner auxiliary terminal. The inner auxiliary terminal is electrically interconnected with the gate electrode or one of the power electrodes and the two outer auxiliary terminals are electrically connected with the other one of the gate electrode and the one of the power electrodes.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: May 25, 2021
    Assignees: ABB Power Grids Switzerland AG, Audi AG
    Inventors: Didier Cottet, Felix Traub, Jürgen Schuderer, Andreas Apelsmeier, Johann Asam
  • Publication number: 20210091054
    Abstract: A power electronics module includes a substrate with a substrate metallization layer, which is separated into conducting areas for providing conducting paths for the power electronics module; a semiconductor switch chip bonded with a first power electrode to a first conducting area of the substrate metallization layer; a conductor plate bonded to a second power electrode of the semiconductor switch chip opposite to the first power electrode.
    Type: Application
    Filed: April 11, 2018
    Publication date: March 25, 2021
    Applicant: AUDI AG
    Inventors: Andreas APELSMEIER, Johann ASAM
  • Patent number: 10439605
    Abstract: A circuit arrangement for an electronic device having at least two semiconductor elements of the same type connected in parallel with each other. At least one first semiconductor element has a first characteristic and at least one second semiconductor element has a second characteristic. Each of the two characteristics is defined by at least one power loss. The at least one power loss of the at least one first semiconductor element has a first value, and the at least one power loss of the at least one second semiconductor element has a second value. The two values of the at least one power loss are different.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: October 8, 2019
    Assignee: AUDI AG
    Inventors: Andreas Apelsmeier, Johann Asam
  • Publication number: 20190304946
    Abstract: A power semiconductor module, including a housing; a power semiconductor chip within the housing; power terminals protruding from the housing and electrically interconnected with power electrodes of the semiconductor chip; and auxiliary terminals protruding from the housing and electrically interconnected with a gate electrode and one of the power electrodes; wherein three auxiliary terminals are arranged in a coaxial auxiliary terminal arrangement, which comprises an inner and two outer auxiliary terminals, which are arranged on opposing sides of the inner auxiliary terminal. The inner auxiliary terminal is electrically interconnected with the gate electrode or one of the power electrodes and the two outer auxiliary terminals are electrically connected with the other one of the gate electrode and the one of the power electrodes.
    Type: Application
    Filed: June 17, 2019
    Publication date: October 3, 2019
    Inventors: Didier Cottet, Felix Traub, Jürgen Schuderer, Andreas Apelsmeier, Johann Asam
  • Publication number: 20180226966
    Abstract: A circuit arrangement for an electronic device having at least two semiconductor elements of the same type connected in parallel with each other. At least one first semiconductor element has a first characteristic and at least one second semiconductor element has a second characteristic. Each of the two characteristics is defined by at least one power loss. The at least one power loss of the at least one first semiconductor element has a first value, and the at least one power loss of the at least one second semiconductor element has a second value. The two values of the at least one power loss are different.
    Type: Application
    Filed: February 2, 2018
    Publication date: August 9, 2018
    Applicant: AUDI AG
    Inventors: Andreas APELSMEIER, Johann ASAM