Abstract: A data switching device comprises at least one interface designed to communicate with a first plurality of vehicle components of the vehicle, and to communicate with a second plurality of vehicle components of the vehicle. The data switching device includes a control circuit designed to communicate with the first plurality of vehicle components based on at least one first data format, and with the second plurality of vehicle components based on at least one second data format. The control circuit is designed to provide a communication interface for the communication between the first plurality of vehicle components and the second plurality of vehicle components. The control circuit is designed to provide access to the first data of the first plurality of vehicle components by providing second data for the second plurality of vehicle components.

Abstract: A data switching device comprises at least one interface designed to communicate with a first plurality of vehicle components of the vehicle, and to communicate with a second plurality of vehicle components of the vehicle. The data switching device includes a control circuit designed to communicate with the first plurality of vehicle components based on at least one first data format, and with the second plurality of vehicle components based on at least one second data format. The control circuit is designed to provide a communication interface for the communication between the first plurality of vehicle components and the second plurality of vehicle components. The control circuit is designed to provide access to the first data of the first plurality of vehicle components by providing second data for the second plurality of vehicle components.

Abstract: An electrical component that includes a substrate that includes at least one electrical circuit is described herein. The electrical component also includes a heat sink in an aperture through the substrate.

Abstract: The invention discloses an electrical component with a carrier substrate, on which at least one semiconductor chip is mounted. Terminal areas are arranged on the underside of the carrier substrate and contact areas designed for the assembly with semiconductor chips are arranged on the upper side. The carrier substrate has a functional area that is divided into sections, wherein each section is assigned at least one function such as, e.g., as a filter, a frequency-separating filter, a balun, etc. A separate area of the carrier substrate is assigned to each section. The following applies to at least one of the sections: the contact area and/or the terminal area that is conductively connected to the section lies outside the base of this section. The connecting line that conductively connects the input or output of the respective section to the contact area and/or the terminal area is preferably shielded from the section by a ground area.

Abstract: A multi-layer capacitor includes several electrically insulating layers that are stacked on top of one another. Parallel electrode plates are arranged between the insulating layers alternately one on top of the other, with each of the plates being separated by an intervening insulating layer. At least one first connecting line which extends perpendicularly through the layers is connected to one set of electrode plates and is insulated in relation to the other set of second electrode plates. Similarly, second connecting lines extend perpendicularly through the layers and are connected to the other set of plates and are insulated in relation to the one set of plates. The first connecting line extends centrally through the stacked electrode plates and is designed to carry a high-frequency signal.

Abstract: The invention discloses an electrical component with a carrier substrate, on which at least one semiconductor chip is mounted. Terminal areas are arranged on the underside of the carrier substrate and contact areas designed for the assembly with semiconductor chips are arranged on the upper side. The carrier substrate has a functional area that is divided into sections, wherein each section is assigned at least one function such as, e.g., as a filter, a frequency-separating filter, a balun, etc. A separate area of the carrier substrate is assigned to each section. The following applies to at least one of the sections: the contact area and/or the terminal area that is conductively connected to the section lies outside the base of this section. The connecting line that conductively connects the input or output of the respective section to the contact area and/or the terminal area is preferably shielded from the section by a ground area.

Abstract: According to one variant, an electrical component is specified, with a substrate (1), through which a heat sink (109) that is integrated into a filter realized in substrate (1) is led. According to a second variant, an electrical component is specified, with a substrate (1), through which a heat sink (103, 104) that serves to conduct signals is led. According to a third variant, an electrical component is specified, with a substrate (1), through which a heat sink (105, 108) that is connected to a conductive surface (111, 112, 113) buried in substrate (1) is led.

Abstract: The invention relates to an integrated circuit (1) having a plurality of substrate layers (2), active and/or passive components (3) embedded in the substrate layers (2), high-frequency lines conducted to the components (3) through the substrate layers (2), and cooling channels (6) for the dissipation of heat. The inventive circuit is characterized in that the cooling channels (6) are configured as high-frequency lines.

Abstract: A multichip circuit module includes a main board, at least one carrier substrate mounted on and in electrical contact with the main board, and at least one semiconductor chip arranged on the carrier substrate and in electrical contact therewith. The carrier substrate has at least one cavity on an assembly surface for receiving the semiconductor chip. The cavity includes connecting contacts which join with associated bumps on the semiconductor chip using a flip-chip technique. The assembly surface of the carrier substrate is placed on a contact surface of the main board, and a filling material is provided between the contract surface of the main board and the assembly surface of the carrier substrate.

Abstract: The invention relates to a multi-layer capacitor (1) comprising several electrically insulating layers that are stacked on top of one another, in addition to parallel first electrode plates (2) and second electrode plates (3) that are arranged between the insulating layers. The first and second electrode plates (2, 3) are located alternately one on top of the other, separated by an intervening insulating layer. Said capacitor also comprises at least one first connecting line (4a), which extends perpendicularly through the layers, is connected to the first electrode plates (2) and is insulated in relation to the second electrode plates (3) and second connecting lines (5), which extend perpendicularly through the layers, are connected to the second electrode plates (3) and are insulated in relation to the first electrode plates (2). The first connecting line (4a) extends centrally through the stacked first and second electrode plates (2, 3) and is designed to carry a high-frequency signal.