Abstract: A test socket for and a method of testing electronic components, in particular high-power semiconductor components comprise: a plurality of contact elements, being adapted to contact to the electronic component; a holder block for holding and arranging the plurality of contact elements, wherein each contact element of the plurality of contact elements comprises at least one conductive surface portion; wherein the holder block comprises a plurality of electrically conductive support sections, for supporting the conductive surface portions of the plurality of contact elements, wherein the plurality of support sections, makes electrical contact to the plurality of conductive surface portions by supporting the conductive surface portions, and wherein the holder block at least partially transmits a test signal.

Abstract: An automated test equipment (ATE) for testing semiconductor devices, the test equipment comprises a test handler, a spare part, or a contactor socket, and a semiconductor devices tester, The spare part comprises an electronic component for storing and or processing data regarding the spare part or a portion thereof, The test equipment comprises an operator terminal comprising a display or GUI and a data exchange interface which is connected or connectable to the electronic component within the spare part, for at least displaying data stored therein. The ATE further comprises a data buffer unit for buffering the data, a maintenance planning and control unit for planning and controlling maintenance actions of the test equipment, and a dedicated database residing in a control computer.

Abstract: A device for removing tested semiconductor components from a clamping carrier having fixed stop elements and movable clamping elements, pre-tensioned by spring elements includes an actuation device arranged above the clamping carrier, which moves the clamping elements into an opening position enabling the clamping carrier to be discharged, and then moves the clamping elements into a rest position after discharge, an intermediate carrier, positioned under the clamping carrier during discharge, onto which the clamping carrier is emptied, a data memory in which data about each semiconductor component are stored, and a removal device, which removes the semiconductor components from the intermediate carrier and sorts them into at least two different categories in accordance with the data stored in the data memory.

Abstract: A device for removing tested semiconductor components from a clamping carrier having fixed stop elements and movable clamping elements, pre-tensioned by spring elements includes an actuation device arranged above the clamping carrier, which moves the clamping elements into an opening position enabling the clamping carrier to be discharged, and then moves the clamping elements into a rest position after discharge, an intermediate carrier, positioned under the clamping carrier during discharge, onto which the clamping carrier is emptied, a data memory in which data about each semiconductor component are stored, and a removal device, which removes the semiconductor components from the intermediate carrier and sorts them into at least two different categories in accordance with the data stored in the data memory.

Abstract: A centering device for electronic components, particularly for ICs, has at least one centering unit comprising two L-shaped centering elements and two coupling elements. The centering elements and coupling elements are hinged together such that a pivoting movement of the coupling elements is forcibly coupled to a parallel displacement of the centering elements, thus causing a widening or narrowing of a centering opening for the components.