Abstract: An additively manufactured air gap winding for an electrical machine is provided. The air-gap winding includes a hollow cylindrical main portion having a geometric axis, the main portion defining an active winding length of the winding, and electrical winding conductors of the winding extending in the main portion from a first axial end of the winding to a second axial end. The air gap winding further comprises a first winding head at the first axial end and a second winding head at the second axial end, wherein winding head connections of the winding conductors extend in the winding heads. The winding heads project radially inwardly and/or outwardly beyond the hollow cylindrical main section. The winding head connections extend at least in sections at different distances from the axis in such a way that one winding head connection at least partially radially surrounds the other winding head connection.

Abstract: A method for contacting and packaging a semiconductor chip of a power electronic component. The power electronic component has a first contact face produced in a first step via a multi-material printing process and a semiconductor chip, which is placed in a second step onto the first contact face. A ceramic insulation layer, which surrounds the semiconductor chip along its circumference and extends over the first contact face not covered by the semiconductor chip, is printed in a third step onto the first contact face. A second contact face is printed in a fourth step onto the ceramic insulation layer and the semiconductor chip. In a fifth step, the power electronic component is sintered by means of heat treatment.

Abstract: A method for contacting and packaging a semiconductor chip of a power electronic component. The power electronic component has a first contact face produced in a first step via a multi-material printing process and a semiconductor chip, which is placed in a second step onto the first contact face. A ceramic insulation layer, which surrounds the semiconductor chip along its circumference and extends over the first contact face not covered by the semiconductor chip, is printed in a third step onto the first contact face. A second contact face is printed in a fourth step onto the ceramic insulation layer and the semiconductor chip. In a fifth step, the power electronic component is sintered by means of heat treatment.

Abstract: The invention relates to a method and a device for producing a component by means of 3D multi-material pressure and to a component part produced therewith, wherein metallic and ceramic pastes, mixed with powder and binding agents, for producing the component are applied in layers by means of an extrusion process and are shaped, and the printing process is monitored by means of a monitoring device in such a way that defects in the pressure are detected by means of a camera and the defects are eliminated and/or overfilling or underfilling of each printed layer in relation to the extrusion quantity is monitored by means of a camera and/or temporary blockages in the extrusion nozzle are detected by monitoring the pressure in the region of the extrusion nozzle and released by increasing the pressure. The device comprises a corresponding monitoring device. The device can also have a mixing and feeding device with a vacuum mixing container which is connected to a vibration device.

Abstract: A winding is provided for electric energy converters, such as electric machines, like electric motors, generators or transformers, and a respective machine. The winding has conductor paths applied to a flexible carrier material by means of a printing process, in particular screen printing process. The conductor path preferably includes an electrically conductive paste. The conductor paths are printed one above the other in layers, and an insulating layer is applied between individual layers of the conductor paths. The conductor paths are arranged such that the conductor paths of superimposed winding layers preferably are transversely shifted against each other in a pre-finished, rolled up state.

Abstract: Pyrrolylquinones and indolylquinones useful for treating diseases such as neurodegenerative disease, viral infections and proliferative disease are described, along with methods of making such compounds and pharmaceutical formulations containing such compounds.

Abstract: Pyrrolylquinones and indolylquinones useful for treating diseases such as neurodegenerative disease, viral infections and proliferative disease are described, along with methods of making such compounds and pharmaceutical formulations containing such compounds.

Abstract: The present invention relates to polypeptides which comprise the ligand binding domain of Cdc25, crystalline forms of these polypeptides and the use of these crystalline forms to determine the three dimensional structure of the catalytic domain of Cdc25. The invention also relates to the use of the three dimensional structure of the Cdc25 catalytic domain in methods of designing and/or identifying potential inhibitors of Cdc25 activity, for example, compounds which inhibit the binding of a native substrate to the Cdc25 catalytic domain.

Abstract: An extrusion device for extruding a cladding onto a core, said device having an extrusion chamber, a nozzle extending into the extrusion chamber with a nozzle opening aligned with a die opening so that a core passes through the nozzle opening and then the die opening with the material extruded thereon characterized by an arrangement to increase the friction between surfaces of the nozzle opening and the core to subsequently improve the bond and adhesion of the cladding to the core. This arrangement can include either notches formed in the nozzle opening adjacent the edges so that a portion of the core will be engaged by the extrusion material prior to the rest of the core surfaces exiting the nozzle, a groove in an end surface of the nozzle so that portions of the nozzle can be pressed onto the core or projections or blades on an internal surface of the nozzle opening.