Abstract: To prevent damage upon removal of a locating templet used in positioning a plate-like semiconductor on a support carrier (2, 14), for example a base plate (2) of a transistor housing or a metallized surface of a ceramic insulator (14), the locating templet (9) is made of solderable material, positioned with respect to the carrier structure by interengaging projection-and-recess elements (10, 10', 11) and soldered to the carrier in one soldering operation, the templet remaining on the carrier structure and forming part of the semiconductor element. If the carrier structure is the metallized coating of a ceramic, the templet may then be used as a terminal connection point for a connection or bonding wire connected to an internal portion of a connection pin extending through the housing of the semiconductor structure.