Patents by Inventor Johann W. Herlyn

Johann W. Herlyn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7399718
    Abstract: The invention relates to a multilayer material comprising (a) a first layer that consists of plaster or that substantially consists of plaster, and (b) at least one second layer, comprising a sandwich textile fiber material. The fibers of said material are interlinked in a mechanically stable manner, are incombustible and weather-proof and the interspaces are filled with a finely porous material. The second layer has a diffusion-equivalent air layer thickness of not more than 2.0 m and is water-impermeable at a water pressure of at least 100 mm water column. The inventive material can be used outdoors due to its properties. The invention further relates to methods for producing such a material.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: July 15, 2008
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Gert Neumann, Friedrich Raether, Holger Boese, Peter Loeschke, Volker Thole, Johann W. Herlyn, Heinz Sattler
  • Patent number: 6986939
    Abstract: The invention relates to a method for the manufacture of chipboard comprising a centre layer (18) of coarse chips and outer layers (20) of chips whose fibers are oriented in the plane of the board. In order to be able to reduce the density of the finished board while retaining the intrinsic characteristic profile of the board, it is proposed in accordance with the invention that the chips used to compose the centre layer (18) will comprise end-grain cut, flake-like chips (22) whose fibers are oriented in the thickness direction (24) of the chips, the chip fibers in the centre layer being oriented substantially transversely to the plane of the chipboard. The invention also relates to chipboard manufactured in accordance with the method.
    Type: Grant
    Filed: May 15, 2001
    Date of Patent: January 17, 2006
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung e. V.
    Inventor: Johann W. Herlyn
  • Publication number: 20040103616
    Abstract: The invention relates to a method for the manufacture of chipboard comprising a centre layer (18) of coarse chips and outer layers (20) of chips whose fibres are oriented in the plane of the board. In order to be able to reduce the density of the finished board while retaining the intrinsic characteristic profile of the board, it is proposed in accordance with the invention that the chips used to compose the centre layer (18) will comprise end-grain cut, flake-like chips (22) whose fibres are oriented in the thickness direction (24) of the chips, the chip fibres in the centre layer being oriented substantially transversely to the plane of the chipboard. The invention also relates to chipboard manufactured in accordance with the method.
    Type: Application
    Filed: May 14, 2003
    Publication date: June 3, 2004
    Inventor: Johann W. Herlyn
  • Publication number: 20040072487
    Abstract: The invention relates to a multilayer material comprising (a) a first layer that consists of plaster or that substantially consists of plaster, and (b) at least one second layer, comprising a sandwich textile fiber material. The fibers of said material are interlinked in a mechanically stable manner, are incombustible and weather-proof and the interspaces are filled with a finely porous material. The second layer has a diffusion-equivalent air layer thickness of not more than 2.0 m and is water-impermeable at a water pressure of at least 100 mm water column. The inventive material can be used outdoors due to its properties. The invention further relates to methods for producing such a material.
    Type: Application
    Filed: August 21, 2003
    Publication date: April 15, 2004
    Inventors: Gert Neumann, Friedrich Raether, Holger Boese, Peter Loeschke, Volker Thole, Johann W. Herlyn, Heinz Sattler