Abstract: A method of energy dispatch for an energy storage device component of a local energy generation plant, the method including obtaining a charge/discharge profile for the energy storage device, quantifying an amount of energy generation available from energy source components of the local energy generation plant, accessing a degradation factor for the energy storage device, forecasting a future cost for storing energy in the energy storage device, evaluating the future cost, providing instruction to an energy storage plant control unit to increase energy storage in the energy storage device based on a result of the evaluation, else, instructing the energy storage plant control unit to decrease energy storage in the energy storage device, and shedding power from the energy source components if a recommendation to shed power was provided. A system for implementing the method and a non-transitory computer-readable medium are also disclosed.

Abstract: Techniques and mechanisms for high interconnect density communication with an interposer. In some embodiments, an interposer comprises a substrate and portions disposed thereon, wherein respective inorganic dielectrics of said portions adjoin each other at a material interface, which extends to each of the substrate and a first side of the interposer. A first hardware interface of the interposer spans the material interface at the first side, wherein a first one of said portions comprises first interconnects which couple the first hardware interface to a second hardware interface at the first side. A second one of said portions includes second interconnects which couple one of first hardware interface or the second hardware interface to a third hardware interface at another side of the interposer. In another embodiment, a metallization pitch feature of the first hardware interface is smaller than a corresponding metallization pitch feature of the second hardware interface.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate including a dielectric material having a first surface and an opposing second surface, a first material on at least a portion of the second surface, and a second material on at least a portion of the first material, wherein the second material has a different material composition than the first material.

Abstract: An outlet assembly for arrangement to an outer wall of a dispenser for web-shaped absorbent material, the outlet assembly comprises a first part defining a first outlet portion and a second part defining a second outlet portion wherein the first part comprises a rim attachment element such that the first part assumes a first part fixed position in relation to the wall opening outer rim, the first part further comprises a first connector element, and the second part comprises a second connector element, the first connector element and the second connector element being such that the second part can be attached to the first part by means of connection between the first connector element and the second connector element such that the second part assumes a second part fixed position in relation to the first part.

Abstract: The invention relates to isolated antisense molecule capable of inhibiting the expression of the KCNQ1 gene in a mammalian cell, wherein said antisense molecule comprises an anti-sense nucleic acid strand which is substantially complementary to a target region of a transcript encoded by the KCNQ1 gene, wherein said antisense nucleic acid strand is at least complementary to SNP rs1057128, rs8234 or rs17215465 in said target region.

Abstract: A first carrier comprises a plurality of regions. Each region comprises a first zone and a second zone. The second zone comprises a portion that surrounds the first zone. Each first zone comprises a hydrophilic surface, and each second zone comprises a hydrophobic surface. A first liquid is deposited on the first carrier. The plurality of regions are aligned with a plurality of dies on a second carrier. The dies are transferred from the second carrier to the first carrier. A second liquid is deposited on a substrate, which includes a plurality of bond areas. Each die bond area comprises a hydrophilic surface. The dies are transferred from the first carrier to the substrate.

Abstract: Various aspects may provide a handling assembly. The handling assembly may include a body with a component-handling surface. The component-handling surface may include a first component-handling region configured to accommodate a first semiconductor component arrangement and a second component-handling region configured to accommodate a second semiconductor component arrangement. The handling assembly may further include an electrode arrangement disposed at the body in a manner so as to be capable of independently toggling each of the first component-handling region and the second component-handling region between an active state and an inactive state. In the active state the electrode arrangement may provide an electrostatic retention force over the component-handling region, configured to retain a corresponding semiconductor component arrangement on the component-handling region.

Abstract: The invention pertains to an electrically operated cryocabin arrangement (100) comprising an open-top cabin (10) with a number of thermal sensor arrays (13) arranged at different heights along an internal perimeter of the cabin, a number of cooling units (20), and a data processing unit (30), wherein the data processing unit is configured to receive user-specific data comprising at least temperature indications (t1) measureable at skin surface of a user by the thermal sensor arrays throughout an operation cycle, during which cycle a cooling fluid (201) is delivered into the cabin and distributed inside the cabin via the cooling units (20), and, based on said user-specific data, to selectively adjust variables related to distribution of the cooling fluid inside the cabin to a predetermined level, said variables being at least a flow velocity (V) of a cooling fluid stream and/or a temperature (t2) of the cooling fluid, wherein the cooling fluid distribution variables are adjusted to reach the values, at which t

Abstract: The present invention relates to a polymer composition with a high heat deflection temperature comprising a first heterophasic propylene copolymer, a second heterophasic propylene copolymer and optionally an inorganic filler. The present invention further relates to a process for the preparation of said polymer composition. The present invention further relates to an automotive part comprising such polymer composition.

Abstract: The invention provides a method for 3D printing a 3D item (10), the method comprising providing a filament (320) of 3D printable material (201) and printing during a printing stage said 3D printable material (201), to provide said 3D item (10) comprising 3D printed material (202), wherein the 3D printable material (201) further comprises particles (410), wherein the particles (410) comprise one or more of glass and mica, wherein the particles (410) have a coating (412), wherein the coating comprises one or more of a metal coating and a metal oxide coating, and wherein the particles (410) have a longest dimension (A1) having an longest dimension length (L1) selected from the range of 10 ?m-2 mm, and wherein the particles have an aspect ratio of at least 10.

Abstract: A resin, in accordance with one aspect of the present invention, includes silica, one or more multifunctional monomers, a solvent for promoting dispersion of the silica in the resin, a dispersing agent, and a photoinitiator. A product, in accordance with one aspect, includes a printed glass part having cross-sectional dimensions, along (imaginary) lines in every direction intersecting a point within the printed glass part, of greater than 5 mm. A process, in accordance with one aspect, includes forming a part from a resin, the resin comprising silica, one or more multifunctional monomers, a solvent for promoting dispersion of the silica in the resin, a dispersing agent, and a photoinitiator. The one or more multifunctional monomers are polymerized to form one or more polymers during and/or after the forming. The formed part is dried. The one or more polymers are removed from the dried part. The dried part is sintered.

Abstract: Hybrid bonded 3D die stacks with improved thermal performance, related apparatuses, systems, and methods of fabrication are disclosed. Such hybrid bonded 3D die stacks include multiple levels of dies including a level of the 3D die stack with one or more integrated circuit dies and one or more thermal dies both directly bonded to another level of the 3D die stack.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to via structures and/or planar structures within a glass core of a substrate to facilitate high-speed signaling with a die coupled with the substrate. In embodiments, the substrate may be coupled with an interposer to enable high-speed signaling between a compute die (or tile) and a storage die (or tile) that may be remote to the substrate. Other embodiments may be described and/or claimed.

Abstract: Disclosed herein are waveguide interconnect bridges for integrated circuit (IC) structures, as well as related methods and devices. In some embodiments, a waveguide interconnect bridge may include a waveguide material and one or more wall cavities in the waveguide material. The waveguide interconnect bridge may communicatively couple two dies in an IC package.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.

Abstract: An analysis instrument may perform analytical operations on an analyte that is combined with multiple reagents prior to being introduced into a flow cell. The instrument may include a nozzle sipper that aspirates reagents from a recipient, along with an analyte. The reagents may be directed to a volume and may be repeatedly moved into and out of the volume by cycling of a pump. The reagents may be ejected into a destination recipient with the nozzle sipper promoting vorticity in the recipient to enhance mixing. The repeated aspiration and ejection through the nozzle sipper effectively mixes the reagents and the template in an automated or semi-automated fashion.

Abstract: The present invention is directed to an aqueous formulation of S-ketamine hydrochloride, preferably for nasal administration.

Abstract: An integrated circuit device may be formed including an electronic substrate and a metallization structure on the electronic substrate, wherein the metallization structure includes a first level comprising a first dielectric material layer, a second level on the first level, wherein the second level comprises a second dielectric material layer, a third level on the second level, wherein the third level comprises a third dielectric material layer, at least one power/ground structure in the second level, and at least one skip level via extending at least partially through the first dielectric material layer of the first level, through the second dielectric layer of the second level, and at least partially through the third dielectric material layer of the third level, wherein the at least one skip level via comprises a continuous conductive material.

Abstract: A head-up display and methods for providing a lane-related visual assistance function with a head-up display for a motor vehicle. Information is obtained regarding a driving lane currently travelled on by a motor vehicle. A characteristic value is obtained, which describes an uncertainty regarding the lane-related display of a virtual object serving as a visual assistance function with the head-up display. At least one virtual object is displayed as a visual assistance function, wherein the object is displayed such that it runs along at least a portion of the lane from the perspective of the driver, wherein a length of the object along the lane is defined according to the magnitude of the characteristic value.