Patents by Inventor Johanna Marie Swan

Johanna Marie Swan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging and assembly method for optical coupling
    Patent number: 6512861
    Abstract: A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has optical waveguide structures in addition to electrical connections. An optically active device may be flip-bonded directly to an integrated circuit using solder bump technology. The integrated circuit then flip-bonded or wire-bonded to a BGA package. The package has alignment rails or balls and V-grooves to anchor the alignment rails/balls to align the BGA package to the PCB. The BGA package is bonded to the PCB using solder reflow technology.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: January 28, 2003
    Assignee: Intel Corporation
    Inventors: Kishore K. Chakravorty, Ian A. Young, Joseph F. Ahadian, Johanna Marie Swan
  • PACKAGING AND ASSEMBLY METHOD FOR OPTICAL COUPLING
    Publication number: 20020196997
    Abstract: A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has optical waveguide structures in addition to electrical connections. An optically active device may be flip-bonded directly to an integrated circuit using solder bump technology. The integrated circuit then flip-bonded or wire-bonded to a BGA package. The package has alignment rails or balls and V-grooves to anchor the alignment rails/balls to align the BGA package to the PCB. The BGA package is bonded to the PCB using solder reflow technology.
    Type: Application
    Filed: June 26, 2001
    Publication date: December 26, 2002
    Inventors: Kishore K. Chakravorty, Ian A. Young, Joseph F. Ahadian, Johanna Marie Swan