Patents by Inventor Johanna Swan

Johanna Swan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200027811
    Abstract: An integrated circuit assembly may be formed having a substrate, a first integrated circuit device electrically attached to the substrate, a second integrated circuit device electrically attached to the first integrated circuit device, and a heat dissipation device comprising at least one first thermally conductive structure proximate at least one of the first integrated circuit device, the second integrated circuit device, and the substrate; and a second thermally conductive structure disposed over the first thermally conductive structure(s), the first integrated circuit device, and the second integrated circuit device, wherein the first thermally conductive structure(s) have a lower electrical conductivity than an electrical conductivity of the second thermally conductive structure. The first thermally conductive structure(s) may be formed by an additive process or may be pre-formed and attached to at least one of the first integrated circuit device, the second integrated circuit device, and the substrate.
    Type: Application
    Filed: July 20, 2018
    Publication date: January 23, 2020
    Applicant: Intel Corporation
    Inventors: Feras Eid, Adel Elsherbini, Johanna Swan
  • Publication number: 20200027812
    Abstract: An integrated circuit assembly may be formed having a substrate, a first integrated circuit device electrically attached to the substrate, a second integrated circuit device electrically attached to the first integrated circuit device, and a heat dissipation device comprising at least one first thermally conductive structure proximate at least one of the first integrated circuit device, the second integrated circuit device, and the substrate; and a second thermally conductive structure disposed over the first thermally conductive structure(s), the first integrated circuit device, and the second integrated circuit device, wherein the first thermally conductive structure(s) have a lower electrical conductivity than an electrical conductivity of the second thermally conductive structure. The first thermally conductive structure(s) may be formed by an additive process or may be pre-formed and attached to at least one of the first integrated circuit device, the second integrated circuit device, and the substrate.
    Type: Application
    Filed: July 20, 2018
    Publication date: January 23, 2020
    Applicant: Intel Corporation
    Inventors: Feras Eid, Adel Elsherbini, Johanna Swan
  • Publication number: 20190393131
    Abstract: An integrated circuit structure may be formed having a first integrated circuit device, a second integrated circuit device electrically coupled to the first integrated circuit device with a plurality of device-to-device interconnects, and at least one jumping drops vapor chamber between the first integrated circuit device and the second integrated circuit device wherein at least one device-to-device interconnect of the plurality of device-to-device interconnects extends through the jumping drops vapor chamber. In one embodiment, the integrated circuit structure may include three or more integrated circuit devices with at least two jumping drops vapor chambers disposed between the three or more integrated circuit devices. In a further embodiment, the two jumping drops chambers may be in fluid communication with one another.
    Type: Application
    Filed: June 21, 2018
    Publication date: December 26, 2019
    Inventors: Feras Eid, Adel Elsherbini, Johanna Swan
  • Publication number: 20190393193
    Abstract: An integrated circuit structure may be formed having a first integrated circuit device, a second integrated circuit device electrically coupled to the first integrated circuit device with a plurality of device-to-device interconnects, and at least one jumping drops vapor chamber between the first integrated circuit device and the second integrated circuit device wherein at least one device-to-device interconnect of the plurality of device-to-device interconnects extends through the jumping drops vapor chamber. In one embodiment, the integrated circuit structure may include three or more integrated circuit devices with at least two jumping drops vapor chambers disposed between the three or more integrated circuit devices. In a further embodiment, the two jumping drops chambers may be in fluid communication with one another.
    Type: Application
    Filed: June 21, 2018
    Publication date: December 26, 2019
    Applicant: Intel Corporation
    Inventors: Feras Eid, Adel Elsherbini, Johanna Swan
  • Publication number: 20190393192
    Abstract: An integrated circuit structure may be formed having a first integrated circuit device, a second integrated circuit device electrically coupled to the first integrated circuit device with a plurality of device-to-device interconnects, and at least one jumping drops vapor chamber between the first integrated circuit device and the second integrated circuit device wherein at least one device-to-device interconnect of the plurality of device-to-device interconnects extends through the jumping drops vapor chamber. In one embodiment, the integrated circuit structure may include three or more integrated circuit devices with at least two jumping drops vapor chambers disposed between the three or more integrated circuit devices. In a further embodiment, the two jumping drops chambers may be in fluid communication with one another.
    Type: Application
    Filed: June 21, 2018
    Publication date: December 26, 2019
    Applicant: Intel Corporation
    Inventors: Feras Eid, Adel Elsherbini, Johanna Swan
  • Publication number: 20190385931
    Abstract: An integrated circuit assembly may be formed having a substrate, a first integrated circuit device electrically attached to the substrate, a second integrated circuit device electrically attached to the first integrated circuit device, and a heat dissipation device defining a fluid chamber, wherein at least a portion of the first integrated circuit device and at least a portion of the second integrated circuit device are exposed to the fluid chamber. In further embodiments, at least one channel may be formed in an underfill material between the first integrated circuit device and the second integrated circuit device, between the first integrated circuit device and the substrate, and/or between the second integrated circuit device and the substrate, wherein the at least one channel is open to the fluid chamber.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 19, 2019
    Applicant: Intel Corporation
    Inventors: Feras Eid, Adel Elsherbini, Johanna Swan
  • Publication number: 20190385932
    Abstract: An integrated circuit assembly may be formed having a substrate, a first integrated circuit device electrically attached to the substrate, a second integrated circuit device electrically attached to the first integrated circuit device, and a heat dissipation device defining a fluid chamber, wherein at least a portion of the first integrated circuit device and at least a portion of the second integrated circuit device are exposed to the fluid chamber. In further embodiments, at least one channel may be formed in an underfill material between the first integrated circuit device and the second integrated circuit device, between the first integrated circuit device and the substrate, and/or between the second integrated circuit device and the substrate, wherein the at least one channel is open to the fluid chamber.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 19, 2019
    Applicant: Intel Corporation
    Inventors: Feras Eid, Adel Elsherbini, Johanna Swan
  • Publication number: 20190385933
    Abstract: An integrated circuit assembly may be formed having a substrate, a first integrated circuit device electrically attached to the substrate, a second integrated circuit device electrically attached to the first integrated circuit device, and a heat dissipation device defining a fluid chamber, wherein at least a portion of the first integrated circuit device and at least a portion of the second integrated circuit device are exposed to the fluid chamber. In further embodiments, at least one channel may be formed in an underfill material between the first integrated circuit device and the second integrated circuit device, between the first integrated circuit device and the substrate, and/or between the second integrated circuit device and the substrate, wherein the at least one channel is open to the fluid chamber.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 19, 2019
    Applicant: Intel Corporation
    Inventors: Feras Eid, Adel Elsherbini, Johanna Swan
  • Patent number: 10508961
    Abstract: A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: December 17, 2019
    Assignee: INTEL CORPORATION
    Inventors: Kevin L. Lin, Qing Ma, Feras Eid, Johanna Swan, Weng Hong Teh
  • Publication number: 20190348738
    Abstract: Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.
    Type: Application
    Filed: January 5, 2017
    Publication date: November 14, 2019
    Inventors: Telesphor KAMGAING, Sash OSTER, Georgios DOGIAMIS, Johanna SWAN
  • Publication number: 20190343017
    Abstract: An integrated circuit structure may be formed having a first integrated circuit device, a second integrated circuit device electrically coupled to the first integrated circuit device, and at least one unidirectional heat transfer device between the first integrated circuit device and the second integrated circuit device. In one embodiment, the unidirectional heat transfer device may be oriented such that it has a higher conductivity in the direction of heat transfer from the first integrated circuit device to the second integrated circuit device than it does in the opposite direction. When the temperature of the second integrated circuit device rises above the temperature of the first integrated circuit device, the unidirectional heat transfer device will act as a thermal insulator, and when the temperature of the first integrated circuit device rises above the temperature of the second integrated circuit device, the unidirectional heat transfer device will act as a thermal conductor.
    Type: Application
    Filed: May 3, 2018
    Publication date: November 7, 2019
    Applicant: Intel Corporation
    Inventors: Feras Eid, Adel Elsherbini, Johanna Swan
  • Publication number: 20190326192
    Abstract: A heat dissipation device may be formed as a thermally conductive structure having at least one thermal isolation structure extending at least partially through the thermally conductive structure. The heat dissipation device may be thermally connected to a plurality of integrated circuit devices, such that the at least one thermal isolation structure is positioned between at least two integrated circuit devices. The heat dissipation device allows for heat transfer away from each of the plurality of integrated circuit devices, such as in a z-direction within the thermally conductive structure, while substantially preventing heat transfer in either the x-direction and/or the y-direction within the thermally isolation structure, such that thermal cross-talk between integrated circuit devices is reduced.
    Type: Application
    Filed: April 19, 2018
    Publication date: October 24, 2019
    Applicant: Intel Corporation
    Inventors: Feras Eid, Adel Elsherbini, Johanna Swan
  • Publication number: 20190323785
    Abstract: A heat dissipation device may be formed having at least one isotropic thermally conductive section (uniformly high thermal conductivity in all directions) and at least one anisotropic thermally conductive section (high thermal conductivity in at least one direction and low thermal conductivity in at least one other direction). The heat dissipation device may be thermally coupled to a plurality of integrated circuit devices such that at least a portion of the isotropic thermally conductive section(s) and/or the anisotropic thermally conductive section(s) is positioned over at least one integrated circuit device.
    Type: Application
    Filed: April 19, 2018
    Publication date: October 24, 2019
    Applicant: Intel Corporation
    Inventors: Feras Eid, Adel Elsherbini, Johanna Swan
  • Patent number: 10453635
    Abstract: An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectromechanical system (MEMS) structures, such as cantilever switches and/or shunt switches.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: October 22, 2019
    Assignee: Intel Corporation
    Inventors: Qing Ma, Johanna Swan, Valluri Rao, Feras Eid
  • Publication number: 20190200451
    Abstract: A millimeter wave (mm-wave) communication interface includes a first semiconductor package coupled to a first substrate and a second semiconductor package coupled to a second substrate. The second substrate may be coupled at approximately a 90° angle to the first substrate. The second semiconductor package may include a mm-wave die that modulates digital data on a high frequency microwave signal and a mm-wave launcher that launches the modulated high-frequency microwave signal into a waveguide member operably coupled to the second substrate. In such an implementation, the waveguide member may beneficially exit the second substrate along a longitudinal axis parallel to the principal plane of the first substrate. Advantageously, all high-frequency components are close coupled to the second substrate without the use of an intervening interface.
    Type: Application
    Filed: September 29, 2016
    Publication date: June 27, 2019
    Applicant: Intel Corporation
    Inventors: SASHA OSTER, Georgios Dogiamis, TELESPHOR KAMGAING, Adel Elsherbini, Shawna Liff, Aleksandar Aleksov, JOHANNA SWAN
  • Publication number: 20190190106
    Abstract: Generally, this disclosure provides apparatus and systems for coupling waveguides to a server package with a modular connector system, as well as methods for fabricating such a connector system. Such a system may be formed with connecting waveguides that turn a desired amount, which in turn may allow a server package to send a signal through a waveguide bundle in any given direction without bending waveguides.
    Type: Application
    Filed: September 30, 2016
    Publication date: June 20, 2019
    Inventors: TELESPHOR KAMGAING, SASHA OSTER, Georgios Dogiamis, Adel Elsherbini, Shawna Liff, Aleksandar Aleksov, JOHANNA SWAN, Brandon Rawlings
  • Publication number: 20190190119
    Abstract: A waveguide coupling system may include at least one waveguide member retention structure disposed on an exterior surface of a semiconductor package. The waveguide member retention structure may be disposed a defined distance or at a defined location with respect to an antenna carried by the semiconductor package. The waveguide member retention structure may engage and guide a waveguide member slidably inserted into the respective waveguide member retention structure. The waveguide member retention structure may position the waveguide member at a defined location with respect to the antenna to maximize the power transfer from the antenna to the waveguide member.
    Type: Application
    Filed: September 23, 2016
    Publication date: June 20, 2019
    Applicant: INTEL CORPORATION
    Inventors: SASHA OSTER, GEORGIOS DOGIAMIS, TELESPHOR KAMGAING, ADEL ELSHERBINI, SHAWNA LIFF, ALEKSANDAR ALEKSOV, JOHANNA SWAN
  • Publication number: 20190141456
    Abstract: Embodiments of the invention include an acoustic transducer device having a base structure that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material in contact with a first electrode of the base structure, and a second electrode in contact with the piezoelectric material. In one example, for a transmit mode, a voltage signal is applied between the first and second electrodes and this causes a stress in the piezoelectric material which causes a stack that is formed with the first electrode, the piezoelectric material, and the second electrode to vibrate and hence the base structure to vibrate and generate acoustic waves.
    Type: Application
    Filed: July 1, 2016
    Publication date: May 9, 2019
    Inventors: Georgios C. DOGIAMIS, Feras EID, Adel A. ELSHERBINI, Johanna SWAN, Shawna M. LIFF, Thomas L. SOUNART, Sasha N. OSTER
  • Publication number: 20190130743
    Abstract: Techniques are disclosed herein for providing guidance for autonomous vehicles in areas of low network connectivity, such as rural areas. According to an embodiment, a guidance system receives a request to exchange data with a vehicle within a specified radius thereof over a wireless connection (e.g., a radio frequency protocol-based connection). The data is stored by the guidance system and is indicative of navigation information within the specified radius. The guidance system transmits the stored data to the vehicle. The guidance system also receives, from the vehicle, data indicative of navigation information for a path previously passed by the vehicle.
    Type: Application
    Filed: December 27, 2018
    Publication date: May 2, 2019
    Inventors: Nadine Dabby, Johanna Swan, Annie Foong, Karla Saur, Hassnaa Moustafa, Rita H. Wouhaybi, Linda Hurd, Rajashree Baskaran
  • Publication number: 20190129418
    Abstract: Technologies for providing a cognitive capacity test for autonomous driving include a compute device. The compute device includes circuitry that is configured to display content to a user, prompt a message to the user to turn user's attention to another activity that needs situational awareness, receive a user response, and analyze the user response to determine an accuracy of the user response and a response time, wherein the accuracy and response time are indicative of a cognitive capacity of the user to assume control of an autonomous vehicle when the autonomous vehicle encounters a situation that the vehicle is unable to navigate.
    Type: Application
    Filed: December 27, 2018
    Publication date: May 2, 2019
    Inventors: Johanna Swan, Shahrnaz Azizi, Rajashree Baskaran, Melissa Ortiz, Fatema Adenwala, Mengjie Yu