Abstract: A circuit board (10) for carrying at least one light source (16) of a lighting device and a method of manufacturing such a circuit board are provided. The circuit board comprises a substrate (1), wherein the substrate comprises at least one fold (9) forming a projecting portion and extending from a periphery (3) of the substrate up to an inner portion (2) of the substrate, whereby the substrate has a polygonal funnel shape. The present aspects use the concept of folding the substrate in order to obtain a polygonal funnel shape of the circuit board, whereby shaping of the substrate without requiring removal of material of the substrate is allowed.

Abstract: A circuit board (10) for carrying at least one light source (16) of a lighting device and a method of manufacturing such a circuit board are provided. The circuit board comprises a substrate (1), wherein the substrate comprises at least one fold (9) forming a projecting portion and extending from a periphery (3) of the substrate up to an inner portion (2) of the substrate, whereby the substrate has a polygonal funnel shape. The present aspects use the concept of folding the substrate in order to obtain a polygonal funnel shape of the circuit board, whereby shaping of the substrate without requiring removal of material of the substrate is allowed.

Abstract: An arrangement for heat dissipation for a heat generating electrical component (10) comprising a heat generating electrical component (10) arranged on the printed circuit board (20), in thermal contact with a thermally conductive layer (23) of the PCB. A thermally conductive mounting element (40) is attached to the thermally conductive layer (23) by means of soldering, and has a connecting portion (43) adapted to engage with a recess (31) in the heat sink (30); thereby enabling attachment of the printed circuit board (20) to the heat sink (30); wherein a thermal path is provided, from the heat generating electrical component (10), via the thermally conductive layer (23) and the mounting element (40), to the heat sink (30). By utilizing a thermally conductive mounting element, heat dissipation can be achieved with a PCB provided with a single thermally conductive layer, rather than the multi layer PCB required in prior art arrangements.

Abstract: An arrangement for heat dissipation for a heat generating electrical component (10) comprising a heat generating electrical component (10) arranged on the printed circuit board (20), in thermal contact with a thermally conductive layer (23) of the PCB. A thermally conductive mounting element (40) is attached to the thermally conductive layer (23) by means of soldering, and has a connecting portion (43) adapted to engage with a recess (31) in the heat sink (30); thereby enabling attachment of the printed circuit board (20) to the heat sink (30); wherein a thermal path is provided, from the heat generating electrical component (10), via the thermally conductive layer (23) and the mounting element (40), to the heat sink (30). By utilizing a thermally conductive mounting element, heat dissipation can be achieved with a PCB provided with a single thermally conductive layer, rather than the multi layer PCB required in prior art arrangements.