Abstract: A mirror system including a mirror that is mounted in a manner that permits oscillation, having a coil and at least one first spring that intercouples the mirror and the coil in a way that allows the coil to be placed as a counterweight to the oscillating mirror. Also a corresponding projection device.

Abstract: A method for structuring a layered structure, for example, of a micromechanical component, from two semiconductor layers between which an insulating and/or etch stop layer is situated includes forming a first etching mask on a first side of the first semiconductor layer, carrying out a first etching step, starting from a first outer side, for structuring the first semiconductor layer, forming a second etching mask on a second side of the second semiconductor layer, and carrying out a second etching step, starting from the second outer side, for structuring the second semiconductor layer. After carrying out the first etching step and prior to carrying out the second etching step, at least one etching protection material is deposited on at least one trench wall of at least one first trench, which is etched in the first etching step.

Abstract: A micromechanical component and a method for producing a micromechanical component are described. The component has: a frame; a plate spring that is connected to the frame and that has a front side and a rear side facing away from the front side; a mirror element that is situated on the front side of the plate spring and is connected to the front side of the plate spring in such a way that the mirror element is suspended on the frame so as to be capable of displacement; and at least one piezoelectric strip that is connected to the rear side of the plate spring; the plate spring being elastically deformable through the application of an electrical voltage to the at least one piezoelectric strip in order to displace the mirror element.

Abstract: A method for structuring a layered structure, for example, of a micromechanical component, from two semiconductor layers between which an insulating and/or etch stop layer is situated includes forming a first etching mask on a first side of the first semiconductor layer, carrying out a first etching step, starting from a first outer side, for structuring the first semiconductor layer, forming a second etching mask on a second side of the second semiconductor layer, and carrying out a second etching step, starting from the second outer side, for structuring the second semiconductor layer. After carrying out the first etching step and prior to carrying out the second etching step, at least one etching protection material is deposited on at least one trench wall of at least one first trench, which is etched in the first etching step.

Abstract: A micromechanical component includes: a hermetically sealed housing; a first functional element that is situated inside the housing; a first structured electrically conductive layer that contacts the first functional element and that is situated inside the housing; and a second structured electrically conductive layer, the first conductive layer being electrically contacted via the second conductive layer, and the second conductive layer being electrically contacted laterally through the housing via a hermetic through-contacting in the second conductive layer.

Abstract: An apparatus for eutectic bonding includes (a) a bonding frame that includes two substrates and (b) a frame device situated on the substrates, the frame device including two frames, the apparatus being usable to develop a eutectic, formed during bonding, in a spatially defined manner, whereby a volume formed by the frames and the substrates can be be filled up completely with the eutectic.

Abstract: A micromirror for a micromirror device includes: a mirror side; and a back side which is directed away from the mirror side, at least one central area of the back side having at least one surface which is plane parallel to the mirror side, the back side being shaped in such a way that on two opposite sides of the central area, a side area having at least one side surface of the back side in each case, which is curved and/or oriented inclined toward the mirror side borders on the central area of the back side, and a height of the micromirror continuously decreasing starting from the central area along a cross section of the micromirror, which runs through the central area and the two side areas.

Abstract: A micromechanical component and a corresponding test method for a micromechanical component are described. The micromechanical component includes at least one first region, which is elastically connected to a second region via a spring device, a resistor element, which is situated in and/or on the spring device and is at least partially interruptible in the event of damage to the spring device, and a detection device, which is electrically connected to the resistor element, for detecting an interruption in the resistor element and for generating a corresponding detection signal.

Abstract: A micromechanical component and a method for producing a micromechanical component are described. The component has: a frame; a plate spring that is connected to the frame and that has a front side and a rear side facing away from the front side; a mirror element that is situated on the front side of the plate spring and is connected to the front side of the plate spring in such a way that the mirror element is suspended on the frame so as to be capable of displacement; and at least one piezoelectric strip that is connected to the rear side of the plate spring; the plate spring being elastically deformable through the application of an electrical voltage to the at least one piezoelectric strip in order to displace the mirror element.

Abstract: A micromechanical component includes a mounting, and a mirror plate which is adjustable with respect to the mounting about at least one rotational axis and which has a mirror side and a rear side which faces away from the mirror side. The mirror plate is connected to the mounting at least via four springs. Each of the four springs extends partially along the rear side of the mirror plate and is connected to the mirror plate via one support post each, which in each case contacts an anchoring area situated on the rear side. Also described is a micromirror device, as well as a manufacturing method for a micromechanical component.

Abstract: A micromechanical structure includes a substrate having an upper side and a lower side, the substrate having a first region and a second region adjacent thereto, the upper side being fashioned in the first region as a mirror region that reflects light. In the second region on the upper side of the substrate, a network-type structure and/or a web-type structure is fashioned, such that the second region is essentially non-light-reflective.

Abstract: In a method for regenerating a biosensor, a biosensor is prepared having a substrate surface on which at least one receptor is immobilized. At least one ligand that is binding specific to the receptor is bound to the receptor, said ligand, together with the receptor, forming a ligand-receptor complex. To regenerate the biosensor, the ligand-receptor complex is brought into contact with an enzyme. The enzyme is selected so that it catalyzes the ligand into fragments. The enzyme is inert with respect to the receptor.

Abstract: In a method for regenerating a biosensor, a biosensor is prepared having a substrate surface on which at least one receptor is immobilized. At least one ligand that is binding specific to the receptor is bound to the receptor, said ligand, together with the receptor, forming a ligand-receptor complex. To regenerate the biosensor, the ligand-receptor complex is brought into contact with an enzyme. The enzyme is selected so that it catalyzes the ligand into fragments. The enzyme is inert with respect to the receptor.